Auxiliary power supply (APS) plays a key role in ensuring the safe operation of the main circuit elements including gate drivers, sensors, controllers, etc. in medium voltage (MV) silicon carbide (SiC)-based converter systems. Such a converter requires APS to have high insulation capability, low common-mode coupling capacitance (Ccm ), and high-power density. Furthermore, considering the lifetime and simplicity of the auxiliary power supply system design in the MV converter, partial discharge (PD) free and multi-load driving ability are the additional two factors that need to be addressed in the design. However, today’s state-of-the-art products have either low power rating or bulky designs, which does not satisfy the demands. To improve the current designs, this thesis presents a 1 MHz isolated APS design using gallium nitride (GaN) devices with MV insulation reinforcement. By adopting LCCL-LC resonant topology, the proposed APS is able to supply multiple loads simultaneously and realize zero voltage switching (ZVS) at any load conditions. Since high reliability under faulty load conditions is also an important feature for APS in MV converter, the secondary side circuit of APS is designed as a regulated stage. To achieve MV insulation (> 20 kV) as well as low Ccm value (< 5 pF), a current-based transformer with a single turn structure using MV insulation wire is designed. Furthermore, by introducing different insulated materials and shielding structures, the APS is capable to achieve different partial discharge inception voltages (PDIV). In this thesis, the transformer design, resonant converter design, and insulation strategies will be detailly explained and verified by experiment results. Overall, this proposed APS is capable to supply multiple loads simultaneously with a maximum power of 120 W for the sending side and 20 W for each receiving side in a compact form factor. ZVS can be realized regardless of load conditions. Based on different insulation materials, two different receiving sides were built. Both of them can achieve a breakdown voltage of over 20 kV. The air-insulated solution can achieve a PDIV of 6 kV with Ccm of 1.2 pF. The silicone-insulated solution can achieve a PDIV of 17 kV with Ccm of 3.9 pF. / M.S. / Recently, 10 kV silicon carbide (SiC) MOSFET receives strong attention for medium voltage applications. Asit can switch at very high speed, e.g. > 50 V/ns, the converter system can operate at higher switching frequency condition with very small switching losses compared to silicon (Si) IGBT [8]. However, the fast dv/dt noise also creates the common mode current via coupling capacitors distributed inside the converter system, thereby introducing lots of electromagnetic interference (EMI) issues. Such issues typically occur within the gate driver power supplies due to the high dv/dt noises across the input and output of the supply. Therefore, the ultra-small coupling capacitor (<5 pF) of a gate driver power supply is strongly desired.[37] To satisfy the APS demands for high power modular converter system, a solution is proposed in this thesis. This work investigates the design of 1 MHz isolated APS using gallium nitride (GaN) devices with medium voltage insulation reinforcement. By increasing switching frequency, the overall converter size could be reduced dramatically. To achieve a low Ccm value and medium voltage insulation of the system, a current-based transformer with a single turn on the sending side is designed. By adopting LCCL-LC resonant topology, a current source is formed as the output of sending side circuity, so it can drive multiple loads importantly with a maximum of 120 W. At the same time, ZVS can use realized with different load conditions. The receiving side is a regulated stage, so the output voltage can be easily adjusted and it can operate in a load fault condition. Different insulation solutions will be introduced and their effect on Ccm will be discussed. To further reduce Ccm, shielding will be introduced. Overall, this proposed APS can achieve a breakdown voltage of over 20 kV and PDIV up to 16.6 kV with Ccm<5 pF. Besides, multi-load driving ability is able to achieve with a maximum of 120 W. ZVS can be realized. In the end, the experiment results will be provided.

A newly designed setup to perform steady-state X-ray excited optical luminescence (XEOL) spectroscopy and simultaneous XEOL and X-ray absorption spectroscopy characterization at beamline P65 of PETRA III is described. The XEOL setup is equipped with a He-flow cryostat and state-ofthe- art optical detection system, which covers a wide wavelength range of 300– 1700 nm with a high spectral resolution of 0.4 nm. To demonstrate the setup functioning, low-temperature XEOL studies on polycrystalline CuInSe2 thin film, single-crystalline GaN thin film and single-crystalline ZnO bulk semiconductor samples are performed.

A newly designed setup to perform steady-state X-ray excited optical luminescence (XEOL) spectroscopy and simultaneous XEOL and X-ray absorption spectroscopy characterization at beamline P65 of PETRA III is described. The XEOL setup is equipped with a He-flow cryostat and state-ofthe- art optical detection system, which covers a wide wavelength range of 300– 1700 nm with a high spectral resolution of 0.4 nm. To demonstrate the setup functioning, low-temperature XEOL studies on polycrystalline CuInSe2 thin film, single-crystalline GaN thin film and single-crystalline ZnO bulk semiconductor samples are performed.

Yes / Much attention has been paid to making 5G developments more en-ergy efficient, especially in view of the need for using high data rates with more complex modulation schemes within a limited bandwidth. The concept of the Doherty power amplifier for improving amplifier efficiency is explained in addi-tion to a case study of a 70W asymmetrical Doherty power Amplifier using two GaN HEMTs transistors with peak power ratings of 45W and 25W. The rationale for this choice of power ratio is discussed. The designed circuit works in the 3.4GHz frequency band with 200 MHz bandwidth. Rogers RO4350B substrate with dielectric constant εr=4.66 and thickness 0.035 mm is used. The perfor-mance analysis of the Doherty power amplifier is simulated using AWR MWO software. The simulated results showed that 54-64% drain efficiency has been achieved at 8 dB back-off within the specified bandwidth with an average gain of 10.7 dB.

Group III-nitride semiconductors have received much research attention and witnessed a significant development due to their ample applications in solid-state lighting and high-power/high-frequency electronics. Numerous growth methods were explored to achieve device quality epitaxial III-nitride semiconductors. Among the growth methods for III-nitride semiconductors, molecular beam epitaxy provides advantages such as formation of abrupt interfaces and in-situ monitoring of growth. The present research work focuses on the growth and characterizations of III-nitride based epitaxial films, nanostructures and heterostructures on c-sapphire substrate using plasma-assisted molecular beam epitaxy system. The correlation between structural, optical and electrical properties of III-nitride semiconductors would be extremely useful. The interfaces of the metal/semiconductor and semiconductor heterostructures are very important in the performance of semiconductor devices. In this regard, the electrical transport studies of metal/semiconductor and semiconductor heterostructures have been carried out. Besides, studies involved with the defect induced room temperature ferromagnetism of GaN films and InN nano-structures have also been carried out. The thesis is organized in eight different chapters and a brief overview of each chapter is given below. Chapter 1 provides a brief introduction on physical properties of group III-nitride semiconductors. It also describes the importance of III-nitride heterostructures in the operation of optoelectronic devices. In addition, it also includes the current strategy of the emergence of room temperature ferromagnetism in III-nitride semiconductors. Chapter 2 deals with the basic working principles of molecular beam epitaxy system and different characterization tools employed in the present work. Chapter 3 describes the growth of GaN films on c-sapphire by plasma-assisted molecular beam epitaxy. The effects of N/Ga flux ratio on structural, morphological and optical properties have been studied. The flux ratio plays a major role in controlling crystal quality, morphology and emission properties of GaN films. The dislocation density is found to increase with increase in N/Ga flux ratio. The surface morphologies of the films as seen by scanning electron microscopy show pits on the surface and found that the pit density on the surface increases with flux ratio. The room temperature photoluminescence study reveals the shift in band-edge emission towards the lower energy with increase in N/Ga flux ratio. This is believed to arise from the reduction in compressive stress in the GaN films as it is evidenced by room temperature Raman study. The transport studies on the Pt/GaN Schottky diodes showed a significant increase in leakage current with an increase in N/Ga ratio and is found to be caused by the increase in dislocation density in the GaN films. Chapter 4 deals with the fabrication and characterization of Au/GaN Schottky diodes. The temperature dependent current–voltage measurements have been used to determine the current transport mechanism in Schottky diodes. The barrier height (φb) and the ideality factor (η) are estimated from the thermionic emission model and are found to be temperature dependent in nature, indicating the existence of barrier height inhomogeneities at the Au/GaN interface. The conventional Richardson plot of ln(Is/T2) versus 1/kT gives Richardson constant value of 3.23×10-5 Acm-2 K-2, which is much lower than the known value of 26.4 Acm-2 K-2 for GaN. Such discrepancy of Richardson constant value was attributed to the existence of barrier height inhomogeneities at the Au/GaN interface. The modified Richardson plot of ln(Is/T2)-q2σs2/2k2T2 versus q/kT, by assuming a Gaussian distribution of barrier heights at the Au/GaN interface, provides the Schottky barrier height of 1.47 eV and Richardson constant value of 38.8 Acm-2 K-2 which is very close to the theatrical value of Richardson constant. The temperature dependence of barrier height is interpreted on the basis of existence of the Gaussian distribution of the barrier heights due to the barrier height inhomogeneities at the Au/GaN interface. Chapter 5 addresses on the influence of GaN underlayer thickness on structural, electrical and optical properties of InN thin films grown using plasma-assisted molecular beam epitaxy. The high resolution X-ray diffraction study reveals superior crystalline quality for the InN film grown on thicker GaN film. The electronic and optical properties seem to be greatly influenced by the structural quality of the films, as can be evidenced from Hall measurement and optical absorption spectroscopy. Also, we present the studies involving the dependence of structural, electrical and optical properties of InN films, grown on thicker GaN films, on growth temperature. The optical absorption edge of InN film is found to be strongly dependent on carrier concentration. Kane’s k.p model is used to describe the dependence of optical absorption edge on carrier concentration by considering the non-parabolic dispersion relation for carrier in the conduction band. Chapter 6 deals with the analysis of the temperature dependent current transport mechanisms in InN/GaN heterostructure based Schottky junctions. The barrier height (φb) and the ideality factor (η) of the InN/GaN Schottky junctions are found to be temperature dependent. The temperature dependence of the barrier height indicates that the Schottky barrier height is inhomogeneous in nature at the heterostructure interface. The higher value of the ideality factor and its temperature dependence suggest that the current transport is primarily dominated by thermionic field emission (TFE) other than thermionic emission (TE). The room temperature barrier height and the ideality factor obtained by TFE model are 1.43 eV and 1.21, respectively. Chapter 7 focuses on the defect induced room temperature ferromagnetism in Ga deficient GaN epitaxial films and InN nano-structures grown on c-sapphire substrate by using plasma-assisted molecular beam epitaxy. The observed yellow emission peak in room temperature photoluminescence spectra and the peak positioning at 300 cm-1 in Raman spectra confirms the existence of Ga vacancies in GaN films. The ferromagnetism in Ga deficient GaN films is believed to originate from the polarization of the unpaired 2p electrons of nitrogen surrounding the Ga vacancy. The InN nano-structures of different size are grown on sapphire substrate, the structural and magnetic properties are studied. The room temperature magnetization measurement of InN nano-structures exhibits the ferromagnetic behavior. The saturation magnetization is found to be strongly dependent on the size of the nano-structures. Finally, Chapter 8 gives the summary of the present work and the scope for future work in this area of research.

Regression is a central problem in statistics and machine learning with applications everywhere in science and technology. In probabilistic regression the relationship between a set of features and a real-valued target variable is modelled as a conditional probability distribution. There are cases where this distribution is very complex and not properly captured by simple approximations, such as assuming a normal distribution. This thesis investigates how conditional Generative Adversarial Networks (GANs) can be used to properly capture more complex conditional distributions. GANs have seen great success in generating complex high-dimensional data, but less work has been done on their use for regression problems. This thesis presents experiments to better understand how conditional GANs can be used in probabilistic regression. Different versions of GANs are extended to the conditional case and evaluated on synthetic and real datasets. It is shown that conditional GANs can learn to estimate a wide range of different distributions and be competitive with existing probabilistic regression models.

Ce travail de thèse ce focalise sur la croissance et la caractérisation de Nanofils (NFs) et de Microfils (µFs) de GaN. L'élaboration de telles structures est obtenue par épitaxie en phase vapeur d'organométalliques à partir de deux stratégies de croissances: l'une dite auto-organisée, réalisée sur substrat saphir, l'autre appelée sélective ou localisée, obtenue sur template GaN de polarité Ga. Quelque soit la stratégie employée, nous montrons que la croissance de structures verticales suivant l'axe c requièrent l'utilisation d'un flux de NH3 et d'un rapport V/III faible, lorsque nous les comparons avec les valeurs utilisées pour la réalisation de couches planaires de GaN. Les paramètres et les étapes de croissances ayant une influence sur le rapport d'aspect (hauteur/diamètre) sont étudiées et mises en évidence pour chacune des stratégies employées. Par ailleurs, les mécanismes de croissance ainsi que les propriétés structurales et optiques de ces objets sont caractérisés par MEB, MET, CL et µPL. En particulier, les expériences réalisées sur les µFs auto-organisés permettent d'observer et d'expliquer l'origine de la double polarité, de mettre en lueur la différence d'incorporation de dopants/d'impuretés entre les domaines Ga et N, d'identifier la présence de deux sections de propriétés électriques et optiques différentes, et de révéler la présence de deux types de résonances optiques: des Modes de galerie et des Modes de Fabry-Perot. D'autres part, nous étudions la courbure des dislocations vers les surfaces libres des NFs localisés et µFs auto-organisés, et pointons la présence de fautes d'empilement basales dans des régions de faibles dimensions. / This work focus on growth and characterization of GaN Nanowires (NWs) and Microwires (µWs). Such structures are obtained by Metal Organic Vapor Phase Epitaxy with two growth strategies: one called self-organized which is realized on sapphire, and the other named selective area growth which is obtained on a GaN Ga-polar template. Whatever the growth strategies employed, vertical growth of structures along the c axis requires the use of a low NH3 flux and V/III ratio, when they are compared with values used for planar growth of GaN. The influence of growth parameters and growth steps on aspect ratio (height/diameter) are studied and highlight for each growth strategies employed. Beside, growth mechanisms and structural and optical properties of such objects are characterized by SEM, TEM, CL and µPL. In particular, experiments realized on self-organized µWs enable us to observe and explain the origin of the double polarity, to highlight the dopants/impurities incorporation difference between Ga and N-domain, to identify two sections with differences in electrical and optical properties, and to reveal the presence of two types of optical resonances, identify as Whispering Gallery Modes and Fabry-Perot Modes. On the other hand, we study the bending of dislocations on free walls of localized NWs and self-organized µWs, and pointed out the presence of basal stacking faults in regions of small dimensions.

Cette thèse est une contribution aux développements de HEMTS AlGaN/GaN sur substrat de silicium pour des applications basses fréquences sous fortes tensions (typiquement 600V) comme les commutateurs pour la domotique ou les circuits de puissance des véhicules électriques. Elle a été menée en collaboration étroite avec Picogiga International qui a réalisé toutes les épitaxies. Elle est composée de trois parties : développement d'une technologie de fabrication, étude des courants de fuite, amélioration du pouvoir isolant de la barrière et recherche d'un comportement “normally off”. La réalisation de contacts ohmiques peu résistifs est l’étape cruciale de la fabrication des HEMTs AlGaN/GaN de puissance. Une optimisation de l'empilement des métaux utilisés, de la température et du temps de recuit ainsi que la recherche d'un compromis sur la distance métallisation – gaz d'électrons, nous a permis de réaliser des contacts ohmiques proches de l'état de l'art (0,5 Ohm.mm). L’origine des courants de fuite a été systématiquement étudiée sur cinq types d'épitaxies différentes. La distance grille – drain et les courants de fuites ont été identifiés comme étant les deux facteurs limitant la tension de claquage. Selon la structure, les courants de fuite ont lieu soit à travers la grille (~e-8 A/mm à 210V), soit en parallèle au canal (e-5 A/mm). Dans les deux cas, ces courants sont comparables aux courants de fuite au travers du tampon (i.e. courants mesurés entre deux mésas). Ces courants de fuite, ont été attribués aux couches de transition nécessaires à l'adaptation de l'épitaxie des couches de nitrure sur le substrat de silicium. La réalisation de HEMT AlGaN/GaN sur silicium pour les applications à haute tension passera donc par une amélioration de ces couches tampons.Nous avons démontré qu'il est possible d'améliorer l'isolation de la barrière en AlGaN grâce à une hydrogénation du matériau. En effet un traitement de surface des transistors par un plasma hydrogène permet, par diffusion, d'y incorporer de l'hydrogène qui passive les dislocations traversantes. Après traitement, les courants de fuite de grille sont réduits et la tension de claquage est repoussée à 400V avec des courants de fuite de l'ordre de e-6 A/mm. Dans ces conditions, le claquage a alors lieu en surface de l'échantillon, il n'est plus limité que par la distance grille-drain. Ce résultat ouvre la voie à la réalisation de HEMT à forte tension de claquage (V~600V).L’effet du plasma fluoré SF6 sur les caractéristiques électriques des HEMT (AlN/GaN)/GaN (la barrière est en super-réseaux AlN/GaN) a été étudié pour la première fois dans cette thèse. Les ions fluor incorporés dans cette barrière agissent comme des donneurs qui font augmenter la densité du gaz bi-dimensionnel d'électrons et décaler la tension de pincement vers les tensions négatives. Cet effet est à l'opposé de celui observé dans les HEMT à barrière en AlGaN. Ce résultat élimine la possibilité de réaliser les HEMT (AlN/GaN)/GaN “normally off” par un dopage au fluor, une technique simple et efficace qui donne de bons résultats sur les HEMT à barrière AlGaN. D’autre part, il apporte quelques réponses expérimentales aux prévisions théoriques d'utiliser le fluor pour les dopages de type n ou p dans les nitrures d'éléments III. / This thesis is a contribution to the development of AlGaN/GaN HEMTs on silicon substrates for low frequency and applications under high voltages (typically 600V) as switches for home automation or power circuits of electric vehicles. It was conducted in close collaboration with Picogiga who made all epitaxy. It is composed of three parts: development of manufacturing technology, study of leakage currents, improving the insulating barrier and search behavior “normally”.The realization of low resistivity ohmic contacts is the crucial step in the manufacture of AlGaN / GaN HEMTs power. Optimization of the stack of metal used, the temperature and annealing time and the search for a compromise on the distance metallization - electron gas, has allowed us to achieve ohmic contacts around the state s (0.5 Ohm. mm).The origin of the leakage current has been systematically studied in five different kinds epitaxy. The distance gate - drain and leakage currents were both identified as being factors limiting the breakdown voltage. According to the structure, the leakage currents take place either through the grid (~ e-8 A/mm at 210V), or in parallel to the channel (e-5A/mm). In both cases, these currents are comparable to leakage currents through the buffer (ie current measured between two mesas). These leakage currents were attributed to transition layers required for the adaptation of the epitaxial nitride layers on the silicon substrate. Achieving AlGaN HEMT / GaN on silicon for high voltage applications pass through to an improvement in these buffer layers.We have demonstrated that it is possible to improve the insulation of the AlGaN barrier through hydrogenation of the material. In effect a surface treatment by a hydrogen plasma allows, by diffusion, to incorporate hydrogen which passivates the through dislocations. After treatment, the gate leakage current is reduced and the breakdown voltage of 400V is pushed with leakage currents of the order e-6A/mm. Under these conditions, when the breakdown occurs at the surface of the sample, is no longer limited by the gate-drain distance. This result opens the way for the realization of HEMT with high breakdown voltage (V ~ 600V).The effect of plasma fluorinated SF6 on the electrical characteristics of the HEMT (AlN/GaN)/GaN (barrier is AlN/GaN superlattices) was studied for the first time in this thesis. The fluorine ions incorporated in the barrier act as donors that increase the density of the two-dimensional gas of electrons and the shifting to the voltage clamping negative voltages. This effect is opposite to that observed in the HEMT in AlGaN barrier. This result eliminates the possibility of the HEMT (AlN/GaN)/GaN "normally off" by fluorine doping, a simple and effective technique that gives good results on AlGaN HEMT barrier. On the other hand, it brings some experimental answers to theoretical predictions using fluorine doping for n-type or p in III nitrides.

The thesis focuses on the gas flow profile optimization of a non-conventional injector in a hot-wall MOCVD system. The injector’s gas flow profile is simulated with CFD and demonstrates awell-behaved laminar flow with a parabolic profile. To ensure the theory is in coherence with the reality, a qualitative study with five thermocouples in a test graphite piece of the was performed. First the thesis will take you through an introduction of the semiconductor field to arrive in a problem formulation. Then you will read about the principles of MOCVD systems, fluid dynamics principles and thermocouple theory. The experiment’s way of approach is thendescribed through all steps from blue print to results. A discussion about the result and the conclusion will be read before the proposals of future work based on the thesis work. The laminar flow is confirmed according to the resulting data and the limitations of the system is set to two different cases depending on background temperature. At 1000 °C a laminar flow is strongly indicated to be obtained at position 3A, closest to the growth area, within the gas flow range of 25 SLM regardless of background pressure, except for 700 mBar indicating turbulent flow for 15 SLM an up. At 20 and 200 mBar the laminar flow limit is suggested by data to be even higher and reaching a value of 35 SLM. At 450 °C the data indicate a laminar flow up to 20 SLM at position 3A regardless of background pressure condition, except for 700 mBar where the data indicate a laminar flow at 35 and 40 SLM. 50 mBar strongly indicates a laminar flow profile up to a gas flow of 35 SLM. With a background pressure of 20 mBar, the data suggests a laminar flow profile up to at least 25 SLM. At 100 mBar the data indicates a laminar flow within the range of 30 SLM.

Im Rahmen dieser Arbeit wurde der pseudo-halogenide Gasphasenepitaxie (PHVPE)-Prozess für die GaN-Kristallzüchtung entwickelt. Dieser Prozess basiert auf dem Zyanid als Transportmittel für Ga. Das HCN wurde aus der Reaktion von heißem NH3 entweder mit Graphit oder einem gasförmigen Kohlenstoffträger gewonnen. Als Quelle für reaktiven Stickstoff diente NH3. Im ersten Ansatz wurde ein Reaktor aus Graphit genutzt. In diesem Fall wurden Wachstumsraten von 60 um=h erreicht. Außerdem zeigte der Kristall eine geringe Perfektion mit hoher V-Grubendichte. Im zweiten Ansatz bestand der Reaktor aus mit pyrolytischem Graphit beschichteten Teilen. Diese Änderung des Konzeptes half die Kristallqualität zu verbessern, reduzierte aber gleichzeitig die Wachstumsrate drastisch, weil das Ga-transportmittel nicht mehr ausreichend zur Verfügung stand. Der neu konstruierte, graphitfreie Aufbau stellt den dritten Zugang zur PHVPE dar. In diesem Fall entsteht HCN während eines Degussa-Prozesses am Pt-Katalysator im Züchtungsreaktor. Zur Untersuchung der Reaktionswege wurde ein FTIR-basiertes insitu Abgasmesssystem entwickelt. GaN-Kristalle wurden auf Saphir und Ga2O3 Substraten, AlN/Al2O3 und GaN/Al2O3 Templates gezüchtet. Eine Selbstseparation wurde für dicke GaN-Schichten auf Ga2O3 erreicht. Die Proben wurden mit verschiedenen Methoden charakterisiert, z.B. mit der Röntgenbeugungs-Spektroskopie (XRD) und Elektronenrückstreubeugung (EBSD) für die Kristallperfektion und kristallographische Orientierung, der Transmissionselektronenmikroskopie (TEM) zur Untersuchung von Versetzungen und der Grenzfläche zwischen GaN und dem Ga2O3, der Rasterelektronenmikroskopie (REM) für die Oberflächenmorphologie und Schichtdicke, der energiedispersiven Röntgenspektroskopie (EDX) für die Kristallzusammensetzung, sowie der ex-situ und in-situ Abgasanalyse mit der Fourier-Transform-Infrarotspektroskopie (FTIR) zum Studium der Reaktionswege. / Within the frame of this work the pseudo halide vapor phase epitaxy process (PHVPE) was developed for GaN crystals growth. The process is based on cyanide as a transport agent for Ga. The source of HCN was the reaction of hot NH3 with either graphite or gaseous carbon precursor. Source of reactive nitrogen was NH3. In the first approach the reactor made of graphite was used. In this case growth rate of 60 um/h was achieved. Additionally, the crystals exhibit poor quality with high V-pit density. The second approach was to provide the reactor with pyrolytical boron nitride covered parts. Changing the concept helped to improve the crystals'' quality but simultaneously reduced drastically the growth rate, due to the lack of sufficient supply of Ga transport agent. Newly designed graphite free setup is used in the third approach for PHVPE. In this case, HCN forms during Degussa process on Pt catalyst, inside the growth reactor. For investigation of the reaction paths, an in-situ exhaust gas measurement system based on FTIR was developed. GaN crystals were grown on sapphire and Ga2O3 substrates, AlN/Al2O3 and GaN/Al2O3 templates. Self separation was achieved for thick GaN crystals grown on Ga2O3. The samples were characterized by various methods i.e. x-ray diffraction spectroscopy (XRD) and electron back scattering diffraction EBSD for crystal quality and crystallographic orientation, transmission electron microscopy (TEM) for investigating dislocations and interface between GaN and Ga2O3, scanning electron microscopy (SEM) for surface morphology and layer thickness, energy dispersive x-ray spectroscopy (EDX) for crystals compositions, ex-situ and in-situ exhaust gas analysis by Fourier transform infrared spectroscopy (FTIR) for investigation of the reaction paths.