As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New generation of the hybrid IC assembly package has become the major role recently. In order to prevent the package defects occurring in end customer sites, in this paper we try to improve the IC assembly method by using a totally different process to fix the passive component on a BGA substrate. We found that the passive component can be proceeded the current gold wire bonding process. In case of the Hybrid BGA with the current passive component attaching process, we can find the thermal effect during the surface mount process. Since the solder can be melt every time during each heating process. Therefore, we plan to improve it without solder attachment. The new improvement is to fix the passive component by a non-conductive thermal cure glue. The glue can be done in one time cure, thus the further process would not influence the quality of passive component. However in the evaluation experiment, the component coated by Gold is the best choice, but we intend to just put it in a comparison model because of the cost consideration. Both works on passive component coated by Gold and Solder were proved. The customer support for the further study on the real products is suggested.

It is an important issue for manufacturing and operation to formulate reliability about the effects of the moisture absorption and IR reflow parameters on IC packages. Two problems, the warpage of the thin IC package, and characterizing the adhesion features of IC package¡¦s interface, are studied in this dissertation. In a thin IC package, the CTE and CHE mismatch between materials are primarily attributed to the warpage which occurs when the package is being mounted on a PCB. The existence of defects in the corresponding interfaces can gradually degrade the interfacial adhesion when IC package is exposed to the high temperature and humidity. In this dissertation, the stability equations for the warpage in a thin IC package without the solder balls being subjected to hygrothermal loading, by modeling it as an initially perfect/imperfect composite plate, is developed. The analytical closed-form solutions are found and used to compute not only the critical moisture content but also the warpage occurrence before the critical loads are reached. The hygrothermal buckling phenomenon is checked by shadow moiré whole-field maps with different moisture content. The results indirectly indicate that the thin PBGA package has little imperfection. For characterizing the adhesion features of IC package¡¦s interface, the fuzzy controller is used to stabilize multiple performance characteristics, i.e., the moisture weight gain and adhesion strength, for the button shear test specimen. Parameters design, although based on the Taguchi method, can optimize the performance characteristic through the setting of process parameters and can reduce the sensitivity of the system performance to sources of variation. The control rules of the fuzzy controller were formed using the author¡¦s experience and knowledge of IC packaging process. The control parameters to be tuned were the membership functions. Therefore, the controller¡¦s performance depended on the membership functions. The fuzzy controller combined Taguchi parameter design, which makes the control performance insensitive to the operating condition change and noise, was used to determine the membership functions.

Since the emergence of knowledge economy, items discussed in traditional accounting practices seemed not to represent the real value of an enterprise effectively. Thus, the conception of intellectual capital has been proposed. However, current intellectual capital measurement methods have limitations such as confirming causation difficultly, lacking integration sufficiently. The purpose of this dissertation is to propose an effective method and process to evaluate intellectual capital. We collected data from annual reposts of IC (Integrated Circuits) design houses in Taiwan. In basis of indicators and association analysis, strategy map for IC design house can be built. Then we compared the efficiency of intellectual capital for IC design houses. The results showed small scale companies might be more efficient than large scale companies. We also observed that intellectual capital value might not be reflected only through association and efficiency analysis. Then system dynamics was adopted to analyze one case. The side effect and leverage factor that hidden in uni-direction thinking of balanced scorecard were found out. This theme also found out indicators of intellectual capital and dynamic loops for the case. Finally, we suggest the policy to increase intellectual capital value for the case.

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Technological backwardness is the common problem for all developing nations. The acquisition and creation of advanced technologies are the common dreams of these catch-up economies. How to build up the adequate technological innovation system for high-tech industries is the major challenge to all catching-up economies. Because of the success of technological development, this research will investigate the technology innovation and diffusion system by taking the IC industry in Chinese Taipei as a case study. The purpose of this research is the provide a guide for the future direction of technological innovation and diffusion systems and of share experience on the development of technology in the IC industry of Chinese Taipei with other catch-up economies. This paper first presents hottest study topics: Knowledge Management and National Innovation System (NIS), next introduced two analytical frameworks --- the technological trajectory framework and the multiple cooperation framework --- which are used as tools to describe the evolution of technological development in catch up economies. It will then propose a technological innovation and diffusion system for catch up economies. The structure and components of the system will be discussed and a questionnaire survey designed for the IC industry in Chinese Taipei. The results of the survey will be discussed and future development of the technological innovation and diffusion system of the IC industry in Chinese Taipei will be proposed by this research.

The object of the research in this thesis was semiconductor industry downstream process ~ IC Packing industry. Taiwan¡¦s IC Packing capacity has been on the top of worldwide, production technical ability also developed continuously caused by new entrants. New entrants not only bring cluster effects of capacity but also bring more pressure of competition between the IC Packing domain. But in this domain, companies seem to be similar to each other through imitation. When companies become alike it also mean that profit become more lean than before, that will impact seriously on Taiwan¡¦s IC Packing industry whose main capacity are used for no brand consignment. In this thesis, it trying to study objectively of competitive advantages and strategies with some aspects from domain industry, customers, competitor and the objected company in this study. Through the thesis with systematic and mathematical process, studied by documents, questionnaire and inquire of the person in charge to get a simplified mathematics model ~ Innovation Matrix, it can use for getting an objective and comparable strategy analysis. Besides that, in order to study forwards about the Innovation Matrix, this research identified the dynamic of causal relationship by ¡§System Thinking¡¨ about cause-effect-feedback of variances in the Innovation Matrix. Finally, to make this mathematics model ~ Innovation Matrix to become a dynamic model ~ ¡§The dynamics of competitive strategy analysis model¡¨. ¡§S Company¡¨ was the object in this research, trying to find out the interaction of ¡§S company¡¨ and its inner operation process even its hidden structure, in order to create a dynamic of causal relationship model. It¡¦s looking at ¡§S Company¡¨ from a systematic thinking to instead of linear thinking at event. Finally, to prove this ¡§The dynamics of competitive strategy analysis model¡¨ with actual performance figures between ¡§S Company¡¨ and its competitor, then submitted the leverage solution of ¡§S Company¡¨.

The research object of this paper is the Economic Daily Paper that is a newspaper specialized in economic topics. The purpose is to find out the relation between the IC semiconductor industry and the media's report by using the content analysis of dissemination as a research method. It studies and analyzes the industrial development and investor behaviors based on the front and second pages of Economic Daily in the past ten years, separated a year into four different industrial seasons starting January, April, July and October. The conclusions are as follows: 1.After the analysis, the circulation appears to be the information on the semiconductor industry and it disseminates mostly in the form of ¡§News¡¨. Because the semiconductor industry accounts for the large volume in the Economic Daily Paper, I chose this newspaper to be the reference of my paper. 2.¡§Security¡¨, as an important index to the readers, is the most valued topic because the profitability of a company affects the management efficiency of the company. Followed by ¡§security¡¨ is the ¡§management strategy¡¨. The companies of the semiconductor want to fully utilize the management skill, so they would have to focus on the business management strategies. 3.As we look at the industry development from the reports, we can easily find that the industry development obviously push forward the report of the development. 4.Semiconductor is a high technological industry, and its development can be divided into six stages: research and development, establishment, growth, maturity, expansion, and success. The sources of capital can be divided into foundation fund, development fund and expansion fund. After a high-tech company succeeds, it should make the stock listed and disperse the stocks as quickly as possible to raise the fund.

From the perspective of contingency theory, this study investigates the governance change of the organization value chain between upstream and downstream firms in three most important high-tech industries in Taiwan: PC, semiconductor, and TFT-LCD. Many scholars and experts have thoroughly studied governances of value chains. Their findings are valuable to the competitiveness of organizations and industries. However, most of them are focused on the Western industries. Very few studies are based on Taiwanese industries. Besides, most of these researches on the characteristics of Taiwanese organizations and industries emphasize the flexible production collaborative networks and the quick responses of small and medium-sized enterprises (SMEs). Even fewer studies have recognized that Taiwanese high-tech industries have evolved into large integrated business groups. This study complements previous literature from a different perspective. Employing case research method, this research has interviewed 20 experts that are familiar with the operation of these three high-tech electronic industries. It is found that all PC, IC and TFT-LCD industries adopted network models at the emerging stage. When these industries getting matured, however, the IC industry adopted the market model, while the PC and TFT-LCD industries moved to hierarchy models. Using Boolean method, this study has reached four major findings for Taiwan¡¦s high-tech industries: 1. The industries¡¦ governance of organization value chain moved toward the personal network model at the emerging stage due to technology uncertainties, relatively high profitability and not enough capital munificence. 2. The industries¡¦ governance of organization value chain moved toward the impersonal network model at the emerging stage due to technology uncertainties, low complexity of technology, relatively high profitability, and enough capital munificence. 3. The industries¡¦ governance of organization value chain moved toward the market model at the mature stage due to technology certainties, enough capital munificence, high complexity of technology and relatively high profitability. 4. The industries¡¦ governance of organization value chain moved toward the hierarchy model at the mature stage due to technology certainties, enough capital munificence, low complexity of technology and relatively low profitability. In the concluding chapter, this thesis presents management implications and future researches based on this study.

Human beings always keep seeking for a better life ,our civilization also keeps moving forward grounded on this momentum .Each economic booming implies a new application or technology developed. Liquid crystal was found by a Austrian scientist, F.REINITZER in 1968 .Japanese companies applied it into large scale display started in 90s,which urged us moving into LCD era . In this study, we will discuss the competitive advantage of Taiwanese LCD driver IC industry ,the key component of LCD supply chain . Also we will take Taiwanese LCD driver IC design house-Novatek for example . By using five-forces framework , diamond structure and co-opetition theory ,we will dig out Taiwanese LCD driver IC industry¡¦s competitive advantage and its own position among world market . This study found Taiwanese LCD driver IC industry has competitive advantages of industry cluster ,high competition ,world-class customers ,quality human resources and government¡¦s support . With those advantages , Taiwanese LCD driver IC industry plays an important role of world market . We also propose strategies to Taiwanese LCD driver IC industry based on the result of this study .

The objective of the proposed research is to analyze and develop energy optimized design techniques that can improve the operating efficiency for a wireless sensor device. To enhance the operating efficiency, all active functional blocks in a system should focus on energy conservation while achieving the required tasks. In addition, variations in the operating condition should be properly observed and compensated. Otherwise, a wireless sensor device would consume unnecessary energy for a given task or too little energy to meet the requirements. In this research, design strategies and some new circuit topologies are discussed in terms of ultra-low energy constraints. In particular, the signal processing unit, the memory unit, and the power unit in a conventional wireless sensor device will be main focus. As an example of the signal processing unit, a subthreshold current mode computation system has been designed and tested to prove the "low power consumption" feature of analog signal processing. For the memory unit, conventional SRAM cells are compared to a new fully-gated 10T-SRAM cell. For the power unit, a semi-active high-efficient CMOS rectifier with a reverse leakage control has been developed. It employs a cross-coupled NMOS pair and two leakage control comparators to reduce reverse charge leakage currents. In addition, the adaptive body bias control technique is utilized to improve the reliability of the rectifier. In addition, a novel link-variation sensing technique is proposed. The proposed technique can evaluate operational disturbances such as component mismatches and displacement variations so that the performance of a wireless sensor device in the actual environment can be close to the optimum without wasting an excessive amount of energy.