The work described in this thesis aims to achieving surface patterning through chemical activation of thiolated silicon oxide surfaces, resulting in a spatially controlled covalent immobilization of biomolecules with high resolution. Existing chemical methods to immobilize molecules on surfaces do not reach below the micrometer scale while the ones allowing for spatial control mostly lead to non-covalent adsorption of molecules on surfaces, or require several successive chemical reactions to obtain the final covalent immobilization. Methods with improved chemical processes and novel surface modification techniques had to be developed. A basic need for studying interactions of biomolecules on chemically modified surfaces with high resolution is the ability to obtain a simple, inexpensive method resulting in ultraflat densely packed and reproducible organic monolayers. Therefore, a new method for silicon oxide chemical derivatization, fulfilling these requirements, was developed. Thiol derivatized silicon oxide surfaces allow for a diversity of activation reactions to occur, resulting in thiol-disulfide exchange. The electrooxidation of surface-bound thiol groups was investigated as a way of generating reactive thiolsulfinates/thiolsulfonates, by application of a positive potential difference to the silicon surfaces. Peptide molecules containing thiol groups were successfully immobilized to the electroactivated surfaces. In addition, this new chemical activation method offers the possibility to release the bound molecules in order to regenerate the surfaces. Subsequently, the thiolated surfaces can be reactivated for further use. Since the activated area depends directly on the size of the electrodes used for the oxidation, nanoscale activation of the thiolated surfaces was performed by use of an AFM tip as counter-electrode. Electrooxidized patterns, with a line width ranging from 70 nm to 200 nm, were obtained. A thiol-rich protein, b-galactosidase, was selectively immobilized onto the electroactivated patterns. An electrochemical version of microcontact printing was developed in order to activate large surface areas with micrometer scale patterns. Conductive soft polymer stamps were produced using an evaporated aluminum coating. Patterned electroactivation of thiols was achieved, and polystyrene beads were subsequently specifically immobilized onto the patterns. As a conclusion, these different projects resulted in a strategy enabling the achievement of nanoscale and microscale positioning and immobilization of biomolecules on silicon surfaces, with potential reversibility and reuse of the surfaces.

This thesis examines strategies to exploit existing materials and techniques to advance organic thin film transistor (OTFT) technology in device performance, device manufacture, and device integration. To enhance device performance, optimization of plasma enhanced chemical vapor deposited (PECVD) gate dielectric thin film and investigation of interface engineering methodologies are explored. To advance device manufacture, OTFT fabrication strategies are developed to enable organic circuit integration. Progress in device integration is achieved through demonstration of OTFT integration into functional circuits for applications such as active-matrix displays and radio frequency identification (RFID) tags. OTFT integration schemes featuring a tailored OTFT-compatible photolithography process and a hybrid photolithography-inkjet printing process are developed. They enable the fabrication of fully-patterned and fully-encapsulated OTFTs and circuits. Research on improving device performance of bottom-gate bottom-contact poly(3,3'''-dialkyl-quarter-thiophene) (PQT-12) OTFTs on PECVD silicon nitride (SiNx) gate dielectric leads to the following key conclusions: (a) increasing silicon content in SiNx gate dielectric leads to enhancement in field-effect mobility and on/off current ratio; (b) surface treatment of SiNx gate dielectric with a combination of O2 plasma and octyltrichlorosilane (OTS) self-assembled monolayer (SAM) delivers the best OTFT performance; (c) an optimal O2 plasma treatment duration exists for attaining highest field-effect mobility and is linked to a “turn-around” effect; and (d) surface treatment of the gold (Au) source/drain contacts by 1-octanethiol SAM limits mobility and should be omitted. There is a strong correlation between the electrical characteristics and the interfacial characteristics of OTFTs. In particular, the device mobility is influenced by the interplay of various interfacial mechanisms, including surface energy, surface roughness, and chemical composition. Finally, the collective knowledge from these investigations facilitates the integration of OTFTs into organic circuits, which is expected to contribute to the development of new generation of all-organic displays for communication devices and other pertinent applications. A major outcome of this work is that it provides an economical means for organic transistor and circuit integration, by enabling use of the well-established PECVD infrastructure, yet not compromising the performance of electronics.

This thesis examines strategies to exploit existing materials and techniques to advance organic thin film transistor (OTFT) technology in device performance, device manufacture, and device integration. To enhance device performance, optimization of plasma enhanced chemical vapor deposited (PECVD) gate dielectric thin film and investigation of interface engineering methodologies are explored. To advance device manufacture, OTFT fabrication strategies are developed to enable organic circuit integration. Progress in device integration is achieved through demonstration of OTFT integration into functional circuits for applications such as active-matrix displays and radio frequency identification (RFID) tags. OTFT integration schemes featuring a tailored OTFT-compatible photolithography process and a hybrid photolithography-inkjet printing process are developed. They enable the fabrication of fully-patterned and fully-encapsulated OTFTs and circuits. Research on improving device performance of bottom-gate bottom-contact poly(3,3'''-dialkyl-quarter-thiophene) (PQT-12) OTFTs on PECVD silicon nitride (SiNx) gate dielectric leads to the following key conclusions: (a) increasing silicon content in SiNx gate dielectric leads to enhancement in field-effect mobility and on/off current ratio; (b) surface treatment of SiNx gate dielectric with a combination of O2 plasma and octyltrichlorosilane (OTS) self-assembled monolayer (SAM) delivers the best OTFT performance; (c) an optimal O2 plasma treatment duration exists for attaining highest field-effect mobility and is linked to a “turn-around” effect; and (d) surface treatment of the gold (Au) source/drain contacts by 1-octanethiol SAM limits mobility and should be omitted. There is a strong correlation between the electrical characteristics and the interfacial characteristics of OTFTs. In particular, the device mobility is influenced by the interplay of various interfacial mechanisms, including surface energy, surface roughness, and chemical composition. Finally, the collective knowledge from these investigations facilitates the integration of OTFTs into organic circuits, which is expected to contribute to the development of new generation of all-organic displays for communication devices and other pertinent applications. A major outcome of this work is that it provides an economical means for organic transistor and circuit integration, by enabling use of the well-established PECVD infrastructure, yet not compromising the performance of electronics.

Le collage direct consiste en la mise en contact de deux surfaces suffisamment lisses et propres pour qu'une adhésion puisse se créer sans ajout de matière à l'interface. Ce procédé réalisable à l'échelle industrielle trouve son intérêt dans l'empilement de structures ou de matériaux pour la microélectronique ou les microtechnologies. Il s'avère alors important de maîtriser ce procédé et cela passe notamment par la compréhension des mécanismes physico-chimique se produisant lors du collage. Le but de ce travail de thèse est donc l'étude des mécanismes mis en jeu dans le collage hydrophobe de silicium et le collage hydrophile d'oxydes de silicium déposés.Dans cette étude, des procédés de collage direct hydrophobe de plaques de silicium (100) reconstruit ont été développés, ainsi que des collages de surfaces hydrophiles d'oxyde de silicium déposés préparées par des activations plasma azote ou oxygène ou par un procédé de polissage mécano-chimique. Le comportement de toutes ces structures a été étudié à plusieurs stades du procédé, en particulier lors des traitements thermiques de consolidation de l'interface de collage. Pour ce faire, différentes techniques de caractérisation ont été mises en oeuvre comme la mesure d'énergie de collage, l'observation de la défectivité par microscopie acoustique, la spectroscopie infrarouge et la réflectivité des rayons X. Cela a ainsi permis de suivre la fermeture de l'interface de collage en température d'un point de vue chimique et mécanique et des mécanismes de collage ont alors pu être proposés pour toutes les structures étudiées. Des recommandations ont également pu être faites pour l'obtention de collages d'oxydes de silicium déposés efficaces et de qualité. / Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact and held together at room temperature by adhesive force, without any additional material. This technology feasible at an industrial scale generates wide interest for the realization of stacked structures for microelectronics or microtechnologies. In this context, a precise understanding of bonding mechanisms is necessary. Consequently, the aim of this work is to study the bonding mechanisms for hydrophobic silicon reconstructed surfaces and hydrophilic deposited silicon oxides surfacesIn this study, bonding of hydrophobic silicon reconstructed surfaces and bonding of hydrophilic deposited silicon oxides prepared either by plasma activation or chemical-mechanical polishing were analyzed, as a function of post-bonding annealing temperature. For this, several characterization techniques have been used: bonding energy measurement, acoustic microscopy in order to observe defectivity, infrared spectroscopy and X-Ray reflectivity. Thus the bonding interface closure has been analyzed from a chemical and mechanical point of view and bonding mechanisms have been proposed for the studied bonded structures. Finally the study of deposited silicon oxide bonding prepared either by plasma activation or by chemical-mechanical polishing has lead to some recommendations for efficient and high quality deposited silicon oxides bonding.

Orientador: Jose Alexandre Diniz / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-05T17:29:59Z (GMT). No. of bitstreams: 1 Biasotto_Cleber_M.pdf: 4466326 bytes, checksum: 75500d469b99d21f5c40a3214a755168 (MD5) Previous issue date: 2005 / Resumo: Neste trabalho, filmes finos de nitreto (SixNy), oxido (SiOx) e oxinitreto (SiOxNy) de silicio sobre substrato de silicio, obtidos através da deposição química a partir da fase vapor auxiliada por plasma remoto (RPCVD), foram caracterizados e estudados para aplicações em micromáquinas (micromachining) ou sistemas micro-eletro-mecanico (MEMS). Os filmes de nitreto de silicio (SixNy) foram obtidos para aplicação em estruturas suspensas (pontes e membranas) e como mascara de proteção de dispositivos MOS para remoção do substrato, utilizando os processos de corrosão úmida do substrato de silicio pelas faces superior (front-side bulk micromachining) e inferior (back-side bulk micromachining), respectivamente. Os filmes de oxido de silicio (SiOx) foram aplicados como camada sacrificial em processos de obtenção de estruturas suspensas empregando a técnica de remoção de camadas sacrificiais na superfície (surface micromachining). Os filmes de oxinitreto de silicio (SiOxNy) foram obtidos como filmes alternativos para aplicação em estruturas suspensas (pontes e membranas), utilizando os processos de corrosão úmida do substrato de silicio pela face superior (front-side bulk micromachining). A fabricação destas estruturas e primordial para o desenvolvimento de micro-sensores e micro-atuadores. Neste trabalho foram revisadas as técnicas de processamento CVD (Chemical Vapor Deposition), apresentando a justificativa da escolha do reator ECR (Electron Cyclotron Resonance), que utiliza a tecnologia CVD com Plasma Remoto (RPCVD) para as deposições / Abstract: In this work, silicon nitride (SixNy), oxide (SiOx) and oxynitride (SiOxNy) thin films obtained by remote plasma chemical vapor deposition (RPCVD) on silicon substrate were studied and characterized for micromachining or micro electro-mechanical system (MEMS) applications. Silicon nitride films (SixNy) were used in suspended structures (membranes and bridges) and as MOS device protection mask against wet substrate etching, obtained by wet substrate etching processes using the front-side and back-side bulk micromachining techniques, respectively. Silicon oxide films (SiOx) were employed as sacrificial layers to obtain suspended surface structures using the surface micromachining technique. Silicon oxynitride (SiOxNy) films were used as alternative films in suspended structures (membranes and bridges), using the front-side bulk micromachining technique. The fabrication of these structures is primordial for the micro sensor and actuator development. In these work, CVD (Chemical Vapor Deposition) techniques are revised, presenting the choice justification of ECR (Electron Cyclotron Resonance) reactor, which uses RPCVD technology for the depositions / Mestrado / Mestre em Engenharia Elétrica

Neste trabalho são apresentados resultados da caracterização estrutural e morfológica de filmes de oxinitreto de silício (SiOxNy) depositados pela técnica de deposição química a vapor assistida por plasma (PECVD) a baixa temperatura (320°C). O objetivo deste trabalho é relacionar a composição química de ligas amorfas de SiOxNy com suas propriedades ópticas, estruturais, morfológicas e mecânicas visando sua aplicação em dispositivos elétricos, optoeletrônica e microestruturas. A proposta é dar continuidade a trabalhos prévios desenvolvidos no grupo, que demonstraram a viabilidade de controlar a composição química e, como conseqüência, controlar as propriedades como o índice de refração, constante dielétrica e fotoluminescência de filmes de SiOxNy. As condições de deposição foram ajustadas de forma a obter dois tipos de material: filmes de SiOxNy de composição química controlável entre a do SiO2 e a do de Si3N4 e filmes de SiOxNy com composição rica em Si. O material foi caracterizado pelas técnicas de elipsometria, índice de refração por prisma acoplado, RBS (Rutherford Backscattering Spectroscopy), FTIR (Fourier Transform Infrared Spectroscopy), XANES (X-Ray Absorption Near Edge Spectroscopy) na borda K do Si, O e N, medida de stress residual e microscopia eletrônica de varredura (Scanning Electron Microscopy) e de transmissão (Transmission Electron Microscopy). Os resultados mostraram que os filmes com composição química intermediária entre a do SiO2 e a do Si3N4 apresentam arranjo estrutural estável com a temperatura, mantendo as ligações e a estrutura amorfa mesmo após tratamentos térmicos a 1000°C. Também fora demonstrada a possibilidade de obter um material com baixo stress residual e índice de refração ajustável entre 1,46 e 2, resultados ótimos para aplicações em MOEMS (micro-opto-electro- mechanical systems). Já nas amostras ricas em Si foi observada a formação de diferentes fases, sendo uma delas formada por aglomerados de Si e a outra por material constituído por uma mistura de ligações Si-O e Si-N. Este material apresenta a formação de nanocristais de Si, dependendo do conteúdo de Si e das condições do tratamento térmico, permitindo assim, sua aplicação em dispositivos emissores de luz. / In this work results on the morphological and structural characterization of silicon oxynitride (SiOxNy) films deposited by plasma enhanced chemical vapor deposition technique (PECVD) at low temperature (320°C) are presented. The main goal is to correlate the chemical composition of amorphous SiOxNy alloys to their optical, structural, morphological and mechanical properties intending applications on electrical, optoelectronic and micromechanical devices. The proposal is to continue previous research developed in this group, which demonstrated the possibility of tuning the chemical composition and, consequently, the SiOxNy films properties such as refractive index, dielectric constant and photoluminescence by the precise control of the deposition parameters. The deposition conditions were adjusted in order to obtain to material types, SiOxNy films with tunable chemical composition between SiO2 and Si3N4 and silicon-rich SiOxNy. The characterization was performed by elipsometry, refractive index by coupled prism, RBS (Rutherford Backscattering Spectroscopy), FTIR (Fourier Transform Infrared Spectroscopy), XANES (X-Ray Absorption Near Edge Spectroscopy) on K edge of Si, O and N, residual stress measurement and Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM). The films with chemical composition between SiO2 and Si3N4 presented stable structural arrangement with temperature, maintaining the chemical bonds and the amorphous structure after high temperature annealing. Also the results demonstrated the possibility of producing a low residual stress material and an adjustable refractive index since in the 1.46 to 2 range, excellent result for MOEMS devices (micro-opto-electro- mechanical systems applications. For silicon rich-samples the formation of different phases was observed, one formed by Si clusters and other one by a mixture of Si-O and Si-N bonds. Depending on the Si content and on the annealing conditions this material can present nanocristals, results which allowed us to understand and to optimize this material for light emitting devices applications.

A oxidação anódica local utilizando o Microscópio de Força Atômica (AFM - Atomic Force Microscopy) foi investigada aplicando-se uma tensão negativa entre sonda de nitreto de silício e superfícies de Si. Todas as amostras foram limpas em uma solução de 1 NH4OH (30%): 1H2O2 (38%): 4H2O(DI) a 80ºC conhecida na literatura como SC1 (Standard Cleaning 1) ou, alternativamente, uma imersão em solução diluída de ácido hidrofluorídrico seguido de SC1 ou fervura em álcool isopropílico. As nano-oxidações consistiram de padrões quadrados localizados de óxido com área de 0,25 µm² e foram obtidos através do crescimento de linhas paralelas com espaço e comprimento interlinear constante (<2 nm) e várias varreduras dos quadrados em uma mesma área. Das análises de AFM, foram obtidos perfis transversais e 3D, os quais foram empregados na obtenção da espessura do óxido como função da tensão aplicada, número de varreduras e intervalo de tempo após a limpeza SC1. Foi observado que a espessura aumenta com a tensão negativa aplicada e com o número de varreduras. Também foram realizadas simulações para levantar as distribuições de tensão e de campo elétrico no sistema sonda-ar-silício ou sonda-ar-óxido-silício(substrato). Observou-se uma oxidação local assistida por um alto campo elétrico capaz de induzir difusão iônica local finita na extremidade da sonda. Foi simulado também o efeito das diferentes terminações de sonda do AFM, circular ou pontiaguda, no campo elétrico e na queda de tensão. Foram também realizadas oxidações com sondas recobertas com ouro em superfícies de Si precedidas de imersão simples em solução de ácido hidrofluorídrico seguido ou não do procedimento de limpeza SC1. Por fim, análises de absorção por infravermelho (FTIR) foram realizadas em superfícies de Si oxidadas por AFM para analisar a estrutura dos óxidos anódicos obtidos. A oxidação anódica utilizando sondas de nitreto de silício ocorre apenas após pré-limpeza terminada com SC1, sendo catalisada pelos altos campos elétricos (_ 106 V/cm), tendo como elementos reagentes, as espécies H2O adsorvidas e o óxido nativo hidrolisado na superfície após a etapa de limpeza SC1. / Local anodic oxidation of silicon using Atomic Force Microscopy (AFM) was investigated by applying a negative voltage between silicon nitride tip and Si surfaces. All samples were cleaned with an ammonium-based solution known in literature as standard cleaning 1 (SC1) or a dip in a diluted hydrofluoric acid solution followed by SC1 or, also, boiling in isopropyl alcohol. Localized squares patterns of oxide, 0.25 µm² in area, were formed by growing parallel lines with constant interlinear spacing and length and several scans in the same area. From AFM analysis with non-biased tip, it was obtained 3D and section profiles, which were used to obtain the oxide thickness as a function of the applied voltage, number of scans and interval of time after SC1 cleaning. It was noteworthy that thickness increases with the applied negative voltage and with the number of scans. Simulations were performed in order to model voltage and electric field distributions of the system tip-air-silicon or tip-air-oxide-silicon(substrate) indicating a local oxidation assisted by high electrical field and local ionic diffusion of species. It was simulated the effect of tip termination, circular or sharpen, on the electric field and voltage distributions. In addition, oxidations were performed using Au coated tips onto Si surfaces previously dipped in diluted hydrofluoric acid solution followed or not by SC1 cleaning process. Finally, infrared absorption analysis (FTIR) were performed in order to analise the structure of the obtained anodic oxides. The anodic oxidation using silicon nitride tips has occurred only after SC1 precleaning step, being catalized by high electric field (_ 106 V/cm), having as reagents, the adsorbed water species and hydrolized native oxide on the surface after the SC1 cleaning step.

La modification des propriétés optiques et électriques du silicium apportée par la réduction en taille, notamment due aux effets de confinement quantique des porteurs de charges, est aujourd'hui bien connue et a permis le développement de nouveaux systèmes en optoélectronique. Comme dans le cas du silicium massif, le dopage devrait permettre d'optimiser les propriétés du silicium nanostructuré. Cependant, les caractéristiques du dopage dans le silicium nanostructuré sont encore mal comprises et de nombreux questionnements, concernant la localisation des impuretés ainsi que leur état d'activation, restent en suspens. De plus, l'environnement des impuretés semble avoir une influence majeure sur l'ensemble des propriétés. Cette thèse vise à mieux comprendre les caractéristiques structurales du dopage à l'échelle atomique en fonction de la nature de l'impureté, de la matrice hôte et de la technique d'élaboration. Pour cela, nous avons étudié deux types de système en sonde atomique tomographique. Le premier concerne un dopage aux ions de terres rares dans les silicates d'hafnium. Nous avons mis en évidence que la formation de nano-grains de HfO2 cristallisés sous la forme cubique permet un transfert d'énergie efficace vers les ions praséodyme. Le second porte sur les dopages de type n et p de nanocristaux de silicium insérés dans la silice. Nous avons démontré l'introduction des impuretés de type n (As, P) au cœur des nanocristaux, indépendamment de la technique d'élaboration, permettant de réaliser des forts dopages. Un comportement différent a été mis en évidence pour les impuretés de type p, avec l'accumulation de Bore aux interfaces entre les nanocristaux et la matrice. / The change of silicon optical and electrical properties induced by size reduction, due to the quantum confinement of charged carriers, is a well-known effect and allowed to develop new optoelectronic devices. As in bulk silicon, doping should allow to optimize these properties in nanostructured silicon. However, the characteristics of doping of nanostructured silicon still misunderstood and many questions, concerning the location of impurities and their activation state, remain unanswered. Moreover, in these materials, the environment of impurities seems to inuence strongly all of their properties. The purpose of this thesis is to get a better understanding of structural characteristics of doping at the atomic scale in function of the nature of the impurity, the host matrix, and the elaboration technic. In this way, we have investigated two di_erent systems using atom probe tomography. The first concerns a rare earth doping of hafnium silicates. We have evidenced that the clustering of HfO2 nano-grains crystallized in their cubic form induced an efficient energy transfer with praseodymium ions. The second system concern the n and p type doping of silicon nanocrystals embedded in silica. We have demonstrated the important introduction of n type impurities (As, P) in the core of every nanocrystals, independently of the elaboration technic. This introduction of impurities should allow the formation of highly doped silicon nanocrystals. A different behavior has been observed in the case of p type doping, represented by the aggregation of Boron at the interface between the nanocrystals and the silica matrix.

No description available.

Ce travail de thèse est dédié à l'étude des transitions radiatives dans les matériaux de nitrure et d'oxyde de silicium dopés aux ions de terres rares (Er3+, Nd3+). La caractérisation optique des films minces élaborés par évaporation thermique est basée sur la spectroscopie de photoluminescence. Les études menées s'inscrivent dans la recherche de processus d'excitation indirecte des ions Er3+ et Nd3+ dans des matrices à base de silicium. Dans les nitrures et oxynitrures de silicium, un processus de transfert d'énergie permettant l'excitation indirecte des ions Er3+ est mis en évidence. Pour les couches minces amorphes, le couplage est attribué à des états électroniques localisés dans la bande interdite de la matrice. Pour les films recuits à haute température, les nanocristaux de silicium (nc-Si) jouent un rôle majeur dans l'excitation indirecte de l'erbium. Dans les matrices d'oxyde de silicium, l'existence de processus d'excitations directe et indirecte des ions Nd3+ est démontrée. Pour les films amorphes, l'excitation indirecte du Nd se fait via des états électroniques localisés dans la bande interdite de la matrice. Pour les films recuits au-delà de 1000 °C, les nc-Si jouent le rôle de sensibilisateurs pour les ions Nd3+. Les résultats suggèrent que l'excitation indirecte des ions Nd3+ grâce aux états localisés dans la bande interdite de la matrice pourrait être plus efficace que l'excitation via les nc-Si / This thesis is devoted to the study of radiative transitions in rare-earth (Er, Nd) doped silicon oxide and silicon nitride thin films. The optical characterization of thin films prepared by thermal evaporation is based on photoluminescence spectroscopy. In this work, we investigate indirect excitation processes of Er3+ and Nd3+ ions in silicon based materials. In silicon nitride and silicon oxinitride, an energy transfer leading to the indirect excitation of Er3+ ions is demonstrated. For amorphous samples, the sensitization of Er3+ ions is attributed to localized electronic states in the matrix bandgap. For samples annealed at high temperature, silicon nanocrystals play a major role in the indirect excitation of erbium. In silicon oxide thin films, we evidences that both direct and indirect excitation processes of Nd3+ ions occur. For amorphous samples, indirect excitation occurs thanks to localized electronic states in the matrix bandgap. For samples annealed at temperatures above 1000 °C, silicon nanocrystals are sensitizers of Nd3+ ions. Results suggest that indirect excitation thank to localized states in the matrix bandgap could be more efficient than indirect excitation thanks to silicon nanocrystals