En el presente documento de tesis se ha estudiado el efecto de la incorporación del coproducto procedente de la elaboración de horchata de chufa, en productos no fermentados y con diferentes niveles de fermentación. Para ello se ha estudiado su incorporación a tres niveles (5%, 10% y 20%) al procesado de chips, bases de pizza y panes. Los dos primeros niveles de sustitución se establecieron con la finalidad de obtener productos que puedan ser etiquetados como "fuente de fibra" o "alto contenido en fibra". Cuatro fueron los formatos de coproducto testados, total (obtenido directamente del procesado de la chufa), tamizado (con la finalidad de obtener la fracción blanca al eliminar en gran parte la lignina del coproducto total) y los dos anteriores triturados. En cada producto se evaluaron las propiedades fisicoquímicas en las etapas más influyentes del procesado y en el producto terminado, al que también se le realizó un análisis sensorial. Los resultados mostraron la viabilidad de la incorporación del coproducto de la elaboración de horchata en los productos elaborados, si bien es necesario tener en cuenta los efectos que su incorporación genera sobre las masas y por consiguiente en el producto final. Este efecto está ligado a la alteración de la red de gluten por parte de la fibra procedente del coproducto, la cual altera la viscoelasticidad de la masa, reduciendo su retracción y su capacidad para retener gas durante los procesos fermentativos. Aun teniendo en cuenta dicha alteración, se lograron desarrollar chips, bases de pizza y panes con niveles de sustitución de harina de trigo por coproducto de entre 5 y 10%, los cuales fueron evaluados positivamente por los consumidores. De entre los diferentes formatos de coproducto que mostraron mejores resultados, en el caso de los chips fueron los coproductos total o el total triturado, y para las bases de pizzas fueron los coproductos tamizado y tamizado triturado. Para el caso de los panes, el coproducto estudiado fue el total, el cual presentó muy buenos resultados sin la incorporación de otras harinas mejoradoras como la obtenida de semillas de chía, para incrementar el volumen de fermentación. / En el present document de tesi s'ha estudiat l'efecte de la incorporació del coproducte procedent de l'elaboració d'orxata de xufa, en productes no fermentats, semi-fermentats i fermentats. Per això, s'ha estudiat la seva incorporació a tres nivells (5%, 10% i 20%) al processat de xips, bases de pizza i pans. Els dos primers nivells de substitució es van establir amb la finalitat d'obtenir productes que puguen ser etiquetats com a "font de fibra" o "alt contingut en fibra". Quatre van ser els formats de coproducte testats, total (obtingut directament del processat de la xufa), tamisat (amb la finalitat d'obtenir la fracció blanca i eliminar en gran part la lignina del coproducte total) i els dos anteriors triturats. A cada producte es van avaluar les propietats fisicoquímiques en les etapes més influents del processat i en el producte acabat, al qual també se li va realitzar una anàlisi sensorial. Els resultats van mostrar la viabilitat de la incorporació del coproducte de l'elaboració d'orxata en els productes elaborats, si bé cal tenir en compte els efectes que la seva incorporació genera sobre les masses i, per tant, en el producte final. Aquest efecte està lligat a l'alteració de la xarxa de gluten per part de la fibra procedent del producte, la qual altera la viscoelasticitat de la massa, reduint la seva retracció i la seva capacitat per retenir gas durant els processos fermentatius. Tenint en compte aquesta alteració, es van poder desenvolupar xips, bases de pizza i pans amb nivells de substitució de farina de blat per coproducte d'entre 5 i 10%, els quals van ser avaluats positivament pels consumidors. D'entre els diferents formats de coproducte, en el cas dels xips, el total o el total triturat van ser els que van mostrar millors resultats, sent el tamisat i el tamisat triturat els que ho van mostrar per les bases de pizza. En el cas dels pans, l'estudiat va ser el total, el qual va presentar molt bons resultats sense la necessitat d'incorporar farines naturals (farina de llavor de chía) per millorar la fermentació. / In this thesis document, we have studied the effect of the incorporation of the co-product from the production of tiger-nut horchata, in non-fermented products and products with different fermentation degree. To this end, coproduct was incorporated at three levels (5%, 10% and 20%) into the processing of chips, pizza bases and breads has been studied. The first two substitution levels were established in order to obtain products that can be labeled as "fiber source" or "high fiber content". Four coproduct formats were tested, total (obtained directly from tiger-nut processing), sifted (in order to obtain the white fraction by largely eliminating lignin from the total coproduct) and both milled. The physicochemical properties were evaluated for each product in the most influential stages of the processing and in the end product. Sensory analysis were also carried out. The results showed the viability of the incorporation of the co-product in the elaborated products, although it is necessary to take into account the effects that its incorporation generates on the doughs and consequently on the end product. This effect is linked to the alteration of the gluten network by the fiber, which alters the viscoelasticity of the dough, reducing its retraction and its capacity to retain gas during the fermentation processes. Even taking into account this alteration, chips, pizza bases and breads could be developed with the substitution of wheat flour by coproduct between 5 and 10%, which were evaluated positively by consumers. Among the co-product formats, in chips, the total or the total milled were which showed the best results, being the sieving and the sieving milled those that showed it for the pizza bases. In breads, the total coproduct was studied, which presented very good results without to incorporate other improver flours (chia seed flour) to increase the fermentation volume. / Alava Pincay, CL. (2018). Utilización del subproducto de la horchata en la elaboración de productos con base de harina de trigo (chips, pizzas y panes) [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/114024

Yes / A numerical study of natural convection heat transfer in water filled cavity has been examined in 3-D for single phase liquid cooling system by using an array of parallel plate fins mounted to one wall of a cavity. The heat generated by a heat source represents a computer CPU with dimensions of 37.5∗37.5mm mounted on substrate. A cold plate is used as a heat sink installed on the opposite vertical end of the enclosure. The air flow inside the computer case is created by an exhaust fan. A turbulent air flow is assumed and k-ε model is applied. The fins are installed on the substrate to enhance the heat transfer. The applied power energy range used is between 15 - 40W. In order to determine the thermal behaviour of the cooling system, the effect of the heat input and the number of the parallel plate fins are investigated. The results illustrate that as the fin number increases the maximum heat source temperature decreases. However, when the fin number increases to critical value the temperature start to increase due to the fins are too closely spaced and that cause the obstruction of water flow. The introduction of parallel plate fins reduces the maximum heat source temperature by 10% compared to the case without fins. The cooling system maintains the maximum chip temperature at 64.68°C when the heat input was at 40W that is much lower than the recommended computer chips limit temperature of no more than 85°C and hence the performance of the CPU is enhanced.

En microélectronique, plusieurs tendances telles que l'empilement 3D et l'amincissement de puces amènent des défis thermiques grandissants. Ces défis sont exacerbés lorsqu'appliqués aux appareils mobiles où l'espace et la puissance disponibles pour le refroidissement sont limités. Le but de cette thèse est de développer des outils de conception et méthodes d'implémentation de microcanaux pour le refroidissement microfluidique de puces 2D et 3D avec points chauds destinés aux appareils mobiles.Une méthode de conception pour optimiser la configuration des microcanaux refroidissant une puce est développée utilisant un plan d'expériences numériques. La configuration optimisée propose le refroidissement à une température maximale de 89 °C d'un point chaud de 2 W par un écoulement où la perte de charge est plus petit que 1 kPa. Des prototypes avec différents empilements et distributions de microcanaux sont fabriqués par gravure profonde et apposés par pick-and-place. Un banc de caractérisation et une puce thermique test sont fabriqués pour caractériser expérimentalement les prototypes de refroidissement avec différentes configurations. Un prototype avec microcanaux limités aux alentours des points chauds et reportés sur la face arrière de la puce test atteint une résistance thermique de 2.8 °C/W. Cela est réalisé avec un débit de 9.4 ml/min et des pertes de charges de 19.2 kPa, soit une puissance hydraulique de 3 mW. Ce refroidissement extrait 7.3 W générés sur un seul serpentin à un flux thermique de 1 185 W/cm² pour un coefficient de performance de 2 430. Les résultats de l'optimisation suggèrent que la dissipation thermique soit exploitée en ajoutant des microcanaux en parallèle, plutôt qu'en allongeant les microcanaux. On observe expérimentalement comme numériquement que la résistance liée à la hausse de température du fluide domine la résistance totale. Enfin, il apparaît que les différents empilements ont un effet plus important sur la résistance thermique que les distributions de microcanaux dans les plages observées. / In microelectronics, trends such as 3D stacking and die thinning bring major thermal challenges. Those challenges are exacerbated when applied to mobile devices where the available space and power for cooling are limited. This thesis aims at developing design tools and implementation techniques for microchannels cooling on 2D and 3D chips with hot spots for mobile devices. A design technique to optimize the microchannel configuration for chip cooling is developed using numerical experimentation plans. The optimized configuration suggests a cooling configuration reaching a maximum temperature of 89 °C on a 2 W hot spot, using a flow at a pressure drop plus petit que 1 kPa. Prototypes with different stacking and microchannel distributions are fabricated using deep reactive ion etching process and stacked using pick-and-place technique. A characterization bench and a thermal test chip are fabricated for experimental characterization of the cooling prototypes from various configurations. A prototype with microchannel zones limited to the hot spot vicinity and installed on the backside of the test chip reached a thermal resistance of 2.8 °C/W. This performance is achieved using a flow rate of 9.4 ml/min with a pressure drop of 19.2 kPa, representing a hydraulic power of 3 mW. Such cooling removes 7.3 W generated on a single heat source, representing a heat flux of 1 185 W/cm² for a coefficient of performance of 2 430. The optimization results suggest that the heat spreading is better exploited using parallel microchannels, rather than lengthen microchannels. It is both observed experimentally and numerically that the thermal resistance related to the fluid temperature rise is the major contribution to the total thermal resistance. Finally, it appears that the different stacking effects on thermal resistance are more important than the microchannels distributions in the observed ranges.

Made available in DSpace on 2016-03-15T19:38:51Z (GMT). No. of bitstreams: 1 Rafael Euzebio Pereira de Oliveira.pdf: 2811606 bytes, checksum: 24b62fb14019ae86cc9e69acbf481604 (MD5) Previous issue date: 2014-08-18 / Nonlinear effects are essential for the construction of photonic devices such as modulators, optical switches and frequency converters. Aiming at the development of devices for optical frequency conversion and the generation of nonclassical states of light in photonic chips, this thesis presents the design and simulation of a frequency converter based on second harmonic generation controlled by static electric field in a silicon nitride ring resonator. The developed simulation appraises conversion efficiencies up to -8.25 dB with the advantage to provide an electrical interface to control the conversion. Optical fiber based devices are also within the scope of the thesis and a new technique is presented for manufacturing optical fibers with enhanced nonlinear response by the presence of metallic gold nanoparticles. The manufactured fibers are based on silica that is doped with aluminum and gold in the core, offering full compatibility and integration with conventional optical fibers. The nanoparticles were created by annealing in an oven or by heating with a CO2 laser beam, which offers unprecedented control over particle size and density in optical fibers. Compared to previously reported fibers with gold nanoparticles, higher concentration of nanoparticles were obtained which was estimated by the plasmonic absorption peak exceeding 800 dB/m and by a consequent increasing in the nonlinear refractive index of at least 50x under continuous wave excitation, achieving values of n2=(6,75±0,55)×10-15 m²/W. The development of these fibers and the design of the on chip frequency converter provide platforms for the development of efficient and integrated devices in fiber based optical systems and in photonic chips. / Efeitos não lineares são essenciais para construção de dispositivos fotônicos como moduladores, chaves ópticas e conversores de frequências. Esta tese apresenta o projeto e a simulação de um conversor de frequências baseado na geração de segundo harmônico controlado por campo elétrico estático em um ressonador em anel de nitreto de silício, visando o desenvolvimento de dispositivos para conversão de frequências ópticas e geração de estados não clássicos da luz em chips fotônicos. A simulação desenvolvida prevê eficiência de conversão de até -8,25 dB com o diferencial de oferecer uma interface elétrica no controle de conversão. Dispositivos baseados em fibras ópticas também são visados nesta tese e uma nova técnica para fabricação de fibras ópticas com resposta não linear aumentada pela presença de nanopartículas metálicas de ouro é apresentada. As fibras fabricadas são baseadas em sílica com dopagem de alumínio e ouro no núcleo, possuindo total compatibilidade de integração com fibras ópticas convencionais. As nanopartículas foram sintetizadas através de tratamentos térmicos em forno ou aquecimento com feixe laser de CO2, obtendo-se um controle sem precedentes das dimensões e densidade de nanopartículas em fibras ópticas. Comparadas às fibras previamente reportadas na literatura, foram obtidas maiores concentrações de nanopartículas estimadas por picos de absorções plasmônicas maiores que 800 dB/m e por um consequente aumento no índice de refração não linear de pelo menos 50x no regime de onda contínua, obtendo-se valores de n2=(6,75±0,55)×10-15 m²/W. O desenvolvimento dessas fibras e o projeto do ressonador em anel para conversão de frequências oferecem plataformas para o desenvolvimento de dispositivos eficientes e integrados para sistemas ópticos baseados em fibras ópticas e em chips fotônicos.

Chip-package interaction (CPI) has become a critical reliability issue for flip-chip packaging of Cu/low-k chip with organic substrate. The thermo-mechanical deformation and stress develop inside the package during assembly and subsequent reliability tests due to the mismatch of the coefficients of thermal expansion (CTEs) between the chip and the substrate. The thermal residual stress causes many mechanical reliability issues in the solder joints and the underfill layer between die and substrate, such as solder fatigue failure and underfill delamination. Moreover, the thermo-mechanical deformation of the package can be directly coupled into the Cu/low-k interconnect, inducing large local stresses to drive interfacial crack formation and propagation. The thermo-mechanical reliability risk is further aggravated with the implementation of ultra low-k dielectric for better electrical performance and the mandatory change from Pb-containing solders to Pb-free solders for environmental safety. These CPI-induced reliability issues in flip-chip packaging of Cu/low-k chips are investigated in this dissertation at both chip level and package level using high-resolution Moiré interferometry and Finite Element Analysis (FEA). Firstly, the thermo-mechanical deformation in flip-chip packages is analyzed using high-resolution Moiré interferometry. The effect of underfill properties on package warpage is studied and followed by a strategy study of proper underfill selection to improve solder fatigue life time and reduce the risk of interfacial delamination in underfill and low-k interconnects under CPI. The chip-package interaction is found to maximize at the die attach step during assembly and becomes most detrimental to low-k chip reliability because of the high thermal load generated by the solder reflow process before underfilling. A three-dimensional (3D) multilevel sub-modeling method combined with modified virtual crack closure (MVCC) technique is employed to investigate the CPI-induced interfacial delamination in Cu/low-k interconnects. It is first focused on the effects of dielectrics and solder materials on low-k interconnect reliability and then extended to the scaling effect where the reduction of the interconnect dimension is accompanied with an increased number of metal levels and the implementation of ultralow-k porous dielectrics. Recent studies on CPI-induced crack propagation in the low-k interconnect and the use of crack-stop structures to improve the chip reliability are also discussed. Finally, 3D integration (3DI) with through silicon vias (TSV) has been proposed as the latest solution to increase the device density without down-scaling. The thermo-mechanical reliability issues facing 3DI are analyzed. Three failure modes are proposed and studied. Design optimization of 3D interconnects to reduce the thermal residual stress and the risks of fracture and delamination are discussed. / text

5 pp. / Eight different landscape mulches were tested for their flammability using a propane torch, charcoal briquette, and a cigarette at two different times of the year. Three randomized compete blocks with eight one square meter plots were tested at three locations; Tucson, Prescott, and Flagstaff, Arizona. Each of the mulches was subjected to the heat of a handheld propane torch (15 seconds), a glowing charcoal briquette (five minutes), and a lit cigarette (until burned out). We found that the least dense mulches (pine needles and straw) burned rapidly when subjected to the torch and ignited after the briquette was removed. The medium density mulches (pine bark nuggets and wood chips) had low flame lengths and smoldered. Heavy density mulches (garden compost and shredded bark) only smoldered. The decomposed granite and sod did not ignite or smolder.

Le marché du diagnostic connait un essor considérable depuis l’avènement de labiologie moléculaire. Plus précis et souvent plus rapide, le diagnostic moléculaire in vitro(DIV) est de plus en plus utilisé dans les laboratoires d’analyses médicales. L’ensemble destests dédiés au marché du DIV répond à des contraintes socio-économiques très précisescomme : la fiabilité du résultat, le délai de réponse court, le faible coût et la facilitéd’utilisation. Les indicateurs socio-économiques montrent que la technologie des biopuces estun potentiel bon candidat pour répondre aux attentes du marché. En effet, cet outil permetl’analyse simultanée de plusieurs dizaines voire centaines de séquences nucléiques et doncl’identification d’autant d’organismes en une seule analyse. Cette technologie s’inscrit encomplément de la PCR en apportant l’avantage de l’analyse multiplexée à moyen débit. Deplus, elle permet de donner une réponse globale de la multiplicité des espèces présentes dansl’échantillon sans avoir besoin de passer par une étape de culture. Néanmoins, cettetechnologie n’est pas optimisée pour le marché du DIV. En effet, son usage est complexe, peurobuste et trop cher pour concurrencer les méthodes actuelles (microbiologie pasteurienne,PCR, Elisa, etc..). Dans le but de réduire le coût de fabrication des biopuces à ADN, il estdonc nécessaire de développer des méthodes alternatives. Dans un premier temps, l’objectif de cette thèse Cifre a été de mettre au point unprototype nouveau de dépôt de biomolécules basé sur la lithographie douce, permettant dedéposer les oligonucléotides sondes de façon multiplexée et selon des motifs micrométriques.Cette nouvelle technologie a été évaluée par rapport aux technologies de références. Puis,nous avons développé un procédé innovant de double fonctionnalisation de surface. Ceprocédé simple et rapide a pour avantages de fonctionnaliser la biopuce avec la chimie desurface et les sondes en une seule étape et d’augmenter les signaux d’hybridation. La secondepartie de la thèse a été de coupler cette nouvelle technologie à la détection des événementsd’hybridation sans marquage en utilisant la diffraction de la lumière. La principale différenceavec la méthode de détection par fluorescence repose sur l’adressage des sondes. En effet, ledépôt doit être réalisé sous forme de réseaux de lignes nanométriques diffractants de façon àce que l'interaction entre les molécules déposées et les cibles qui interagissent soit trèssensible. Cette seconde phase du projet a été très ambitieuse et innovante. La faisabilité decette méthode de détection, démontrée par des simulations théoriques, a fait l’objet d’untravail d’optimisation très important et les résultats obtenus montrent que cette technologiesans marquage est possible. / The diagnosis market increased since the advent of molecular biology. More precise and often faster, the in vitro molecular diagnosis (DIV) is more and more used in medical analyses laboratories. DNA chips technology seems to be a good candidate to answer the market expectations. Indeed, this tool allows making several hundreds of analyses simultaneously. Furthermore, it allows giving a global answer of all the present species in the sample without the need of a culture step. Nevertheless, this technology is not optimized for the market of the DIV. Indeed, its use is complex and too expensive in comparison with the current methods (Pasteur microbiology, PCR, Elisa, etc.). So it is necessary to develop an alternative method to reduce the manufacturing cost and simplify the use of DNA chips. First, the goal of this industrial PhD Cifre supported by the Dendris Company was to complete a new prototype of biomolecules deposition based on soft lithography, allowing multiplexing the deposition of oligonucleotides probes along micro and nanometric patterns.This new technology was compared with the reference technologies. Then, we developed an innovative process of surface co-functionalization. This simple and fast process permits to functionalize the DNA chips with both surface chemistry and probes in a single step and to increase the hybridization signals. The second part of this PhD thesis was to couple this new technology with label-free detection using light diffraction. The main difference with fluorescence-based detection was about probes patterning. Indeed, we needed to generate molecular gratings of nanometric lines to diffract efficiently light from a laser beam. We showed that the absolute diffraction intensity increase with the gratings thickness, which is directly correlated with, probes and targets interactions. The second phase of the project was very ambitious and innovative because we demonstrated the feasibility of this label-free detection. And now we can think that this technology will appear as an alternative method for the diagnosis

Increased chip size and reduced feature size has helped following Moores law for long decades. This has an impact on interconnect length, which is resulting in chip performance degradation. Despite the introduction of new materials with Low-K dielectrics for interconnects, their delay is expected to substantially limit the chip performance. To overcome this problem the need for new technology has arrived. One such promising technology is the three-dimensional Integrated chips (3D ICs) with multiple silicon layers. In this thesis, three dimensional integrated chip (3D IC) technology has been implemented on programmable logic arrays (PLAs). The two-dimensional PLAs are converted to three-dimensional PLAs to realize the advantages of the third dimension. Two novel approaches for partitioning of PLAs are introduced for topological optimization. Greedy algorithm is implemented on the partitioned PLAs to utilize the third dimension for further enhancement in scalability factors. This concept has been implemented on MPLA (Magic Programmable Logic Array) tool. The 3D PLA has been tested on MCNC91 benchmark suite and the results are presented. The experimental results are compared with the 2D-PLA on the same benchmark set. The results obtained indicate the efficacy of the proposed synthesis approach.

The usage of biofuel as well as wood fuel has increased in Sweden and all of Europe during recent decades, and there are several reasons to believe that this increase will continue. An important reason for this increase is that the environmental and climate problems caused by fossil fuels are becoming even more evident. By replacing fossil fuel with biofuel, the problem of emissions from, among others carbon dioxide and sulphur compounds can be alleviated. However, substitution requires in many cases high quality processed biofuel. An early stage in the processing of biofuel is drying. Previous work treats the possibility of drying wood fuel in an efficient and environmentally sustainable manner. This thesis studies the bed drying technique, conducted both experimentally and through modeling of the drying process. The experimental work is based on continuous temperature measurements in the fuel bed and provides characteristics of the drying zone that develops in the bed during drying. The character of the drying zone is affected by both the qualities of the fuel and the operating parameters, and is decisive regarding the possibility of making the drying more efficient, i.e. optimize the usage of energy and produce a fuel with low and homogeneous moisture content. A mathematical simulation model has been developed to increase the understanding of bed drying. The model is based on fundamental physical principles and is made up of five differential equations that describe vapor flow, air flow, the fuel’s moisture content, and the bed’s pressure and temperature. The modeling work complements the experimental work and a simulation of the temperature distribution, pressure and the drying zone’s dispersion is in agreement with the experimental result. The drying of wood can signify an environmental and human health risk, since volatile organic compounds (VOC) are emitted during drying. The thesis studies these emissions with regards to type and quantity. The measurements show that the majority of the emitted compounds from Norway spruce and Scots pine are volatile monoterpenes, but also that other compounds are emitted, especially higher terpenes. Further, major differences between how the compounds are emitted and the quantities of the emitted compounds from heartwood and sapwood are shown. There are also large differences between types of wood, i.e. spruce and pine. It can be stated that both emission rate and total amount of emitted compounds increase with an increase in temperature. To reduce VOC emissions, the drying temperature should be maintained low. To develop an efficient bed drying process for wood biofuels, additional parameters must be analyzed further and weighed against each other. Based on the experimental method and the simulation model presented here, the drying can be optimized towards a more efficient use of thermal energy and a low and even moisture content in the dried biofuel.

Der Asynchronous Transfer Mode (ATM) stellt die zukünftige und einheitliche Basistechnologie für das Breitband-ISDN dar. Da nahezu alle wesentlichen Protokollfunktionen in Hardware realisierbar sind, soll nachfolgend ein Überblick über bereits angebotene VLSI-Schaltkreise gegeben werden. Eine Systematisierung und Einordnung vorhandener ATM-Chips hinsichtlich ihrer Leistungsfähigkeit und ihres Funktionsumfangs erfolgt in Hinblick auf das sogenannte B-ISDN-Referenzmodell. Dieses Schichtenmodell definiert die notwendigen Protokolle und Schnittstellen für den Asynchronous Transfer Mode. Zum grundlegenden Verständnis wird einleitend eine kurze Einführung in die Basisprinzipien von ATM gegeben.