<p>The miniaturization and thinning of wearable, soft robotics and medical devices are soon to require higher performance modeling as the physical flexibility causes direct impacts on the electrical characteristics of the circuit – changing its behavior. As a representative flexible electronic component, the organic field effect transistor (OFET) has attracted much attention in its manufacturing as well as applications. However, as the strain and stress effects are integrated into multiphysics modelers with deeper interactions, the computational complexity and accuracy of OFET modeling is resurfacing as a limiting bottleneck.</p><p>The dissertation was organized into three interrelated studies. In the first study, the Mass-Spring-Damper (MSD) model for an inverted staggered thin film transistor (TFT) was proposed to investigate the TFT’s internal stress/strain fields, and the strain effects on the overall characteristics of the TFT. A comparison study with the finite element analysis (FEA) model shows that the MSD model can reduce memory usage and raises the computational convergence speed for rendering the same results as the FEA. The second study developed the generalized solid-state model by incorporating the density of trap states in the band structure of organic semiconductors (OSCs). The introduction of trap states allows the generalized solid-state model to describe the electrical characteristics of both inorganic TFTs and organic field-effect transistors (OFETs). It is revealed through experimental verification that the generalized solid-state model can accurately characterize the bending induced electrical properties of an OFET in the linear and saturation regimes. The third study aims to model the transient and steady-state dynamics of an arbitrary organic semiconductor device under mechanical strain. In this study, the fractional drift-diffusion (Fr-DD) model and its computational scheme with high accuracy and high convergence rate were proposed. Based on simulation and experimental validation, the transconductance and output characteristics of a bendable OFET were found to be well determined by the Fr-DD model not only in the linear and saturation regimes, but also in the subthreshold regime.</p>

Die fortschreitenden Entwicklungen in der Mikro- und Nanotechnologie erfordern eine solide Unterstützung durch Simulationen. Numerische Bauelementesimulationen waren und sind dabei unerlässliche Werkzeuge, die jedoch zunehmend an ihre Grenzen kommen. So basieren sie auf Parametern, die für beliebige Atomanordnungen nicht verfügbar sind, und scheitern für stark verkleinerte Strukturen infolge zunehmender Relevanz von Quanteneffekten. Diese Arbeit behandelt den Transport in Siliziumnanodrähten sowie durch NiSi2-Si-Grenzflächen. Dichtefunktionaltheorie wird dabei verwendet, um die stabile Atomanordnung und alle für den elektronischen Transport relevanten quantenmechanischen Effekte zu beschreiben. Bei der Untersuchung der Nanodrähte liegt das Hauptaugenmerk auf der radialen Abhängigkeit der elektronischen Struktur sowie deren Änderung bei Variation des Durchmessers. Dabei zeigt sich, dass der Kern der Nanodrähte für den Ladungstransport bestimmend ist. Weiterhin kann ein Durchmesser von ungefähr 5 nm identifiziert werden, oberhalb dessen die Zustandsdichte im Nanodraht große Ähnlichkeiten mit jener des Silizium-Volumenkristalls aufweist und der Draht somit zunehmend mit Näherungen für den perfekt periodischen Kristall beschrieben werden kann. Der Fokus bei der Untersuchung der NiSi2-Si-Grenzflächen liegt auf der Symmetrie von Elektron- und Lochströmen im Tunnelregime, welche für die Entwicklung von rekonfigurierbaren Feldeffekttransistoren besondere Relevanz hat. Verschiedene NiSi2-Si-Grenzflächen und Verzerrungszustände werden dabei systematisch untersucht. Je nach Grenzfläche ist die Symmetrie dabei sehr unterschiedlich und zeigt auch ein sehr unterschiedliches Verhalten bei externer Verzerrung. Weiterhin werden grundlegende physikalische Größen mit Bezug zu NiSi2-Si-Grenzflächen betrachtet. So wird beispielsweise die Stabilität anhand von Grenzflächen-Energien ermittelt. Am stabilsten sind {111}-Grenzflächen, was deren bevorzugtes Auftreten in Experimenten erklärt. Weitere wichtige Größen, deren Verzerrungsabhängigkeit untersucht wird, sind die Schottky-Barrierenhöhe, die effektive Masse der Ladungsträger sowie die Austrittsarbeiten von NiSi2- und Si-Oberflächen. Ein Beitrag zur Modellentwicklung numerischer Bauelementesimulationen wird durch einen Vergleich zwischen den Ergebnissen von Dichtefunktionaltheorie-basierten Transportrechnungen und denen eines vereinfachten Models basierend auf der Wentzel-Kramers-Brillouin-Näherung geliefert. Diese Näherung ist Teil vieler numerischer Bauelementesimulatoren und erlaubt die Berechnung des Tunnelstroms basierend auf grundlegenden physikalischen Größen. Der Vergleich ermöglicht eine Evaluierung des vereinfachten Models, welches anschließend genutzt wird, um den Einfluss der grundlegenden physikalischen Größen auf den Tunneltransport zu untersuchen.:Index of Abbreviations 1. Introduction 2. Silicon Based Devices and Silicon Nanowires 2.1. Introduction 2.2. The Reconfigurable Field-effect Transistor 2.2.1. Design and Functionality 2.2.2. Fabrication 2.3. Overview Over Silicon Nanowires 2.3.1. Geometric Structure 2.3.2. Fabrication Techniques 2.3.3. Electronic Properties 3. Simulation Tools 3.1. Introduction 3.2. Electronic Structure Calculations 3.2.1. Introduction and Basis Functions 3.2.2. Density Functional Theory 3.2.3. Description of Exchange and Correlation Effects 3.2.4. Practical Aspects of Density Functional Theory 3.3. Electron Transport 3.3.1. Introduction 3.3.2. Scattering Theory 3.3.3. Wentzel-Kramers-Brillouin Approximation for a Triangular Barrier 3.3.4. Non-equilibrium Green’s Function Formalism A. Radially Resolved Electronic Structure and Charge Carrier Transport in Silicon Nanowires A.1. Introduction A.2. Model System A.3. Results and Discussion A.4. Summary and Conclusions A.5. Appendix A: Computational Details A.6. Appendix B: Supplementary Material A.6.1. Comparison of the Band Gap Between Relaxed and Unrelaxed SiNWs A.6.2. Band Structures for Some of the Calculated SiNWs A.6.3. Radially Resolved Density of States for Some of the Calculated SiNWs B. Electron Transport Through NiSi2-Si Contacts and Their Role in Reconfigurable Field-effect Transistors B.1. Introduction B.2. Model for Reconfigurable Field-effect Transistors B.2.1. Atomistic Quantum Transport Model to Describe Transport Across the Contact Interface B.2.2. Simplified Compact Model to Calculate the Device Characteristics B.3. Results and Discussion B.3.1. Characteristics of a Reconfigurable Field-effect Transistor B.3.2. Variation of the Crystal Orientations and Influence of the Schottky Barrier B.3.3. Comparison to Fabricated Reconfigurable Field-effect Transistors B.4. Summary and Conclusions B.5. Appendix: Supplementary Material B.5.1. Band Structure and Density of States of the Contact Metal B.5.2. Relaxation Procedure B.5.3. Total Transmission Through Multiple Barriers C. Formation and Crystallographic Orientation of NiSi2-Si Interfaces C.1. Introduction C.2. Fabrication and characterization methods C.3. Model System and Simulation Details C.4. Results and discussion C.4.1. Atomic structure of the interface C.4.2. Discussion of ways to modify the interface orientation C.5. Summary C.6. Appendix: Supplementary Material D. NiSi2-Si Interfaces Under Strain: From Bulk and Interface Properties to Tunneling Transport D.1. Introduction D.2. Model System and Simulation Approach D.3. Computational Details D.3.1. Electronic Structure Calculations (Geometry Relaxations) D.3.2. Electronic Structure Calculations (Electronic Structure) D.3.3. Device Calculations D.4. Tunneling Transport From First-principles Calculations D.4.1. Evaluation of the Current D.4.2. Isotropic Strain D.4.3. Anisotropic Strain D.5. Transport Related Properties and Effective Modeling Schemes D.5.1. Schottky Barrier Height D.5.2. Simplified Transport Model D.5.3. Models for the Schottky Barrier Height D.6. Summary and Conclusions D.7. Appendix: Supplementary Material D.7.1. Schottky Barriers of the {110} Interface Under Anisotropic Strain D.7.2. Silicon Band Structure, Electric Field, and Number of Transmission Channels D.7.3. k∥-resolved Material Properties D.7.4. Evaluation of the Work Functions and Electron Affinities D.7.5. Verification of the Work Function Calculation 4. Discussion 5. Ongoing Work and Possible Extensions 6. Summary Bibliography List of Figures List of Tables Acknowledgements Selbstständigkeitserklärung Curriculum Vitae Scientific Contributions / The ongoing developments in micro- and nanotechnologies require a profound support from simulations. Numerical device simulations were and still are essential tools to support the device development. However, they gradually reach their limits as they rely on parameters, which are not always available, and neglect quantum effects for small structures. This work addresses the transport in silicon nanowires and through NiSi2-Si interfaces. By using density functional theory, the atomic structure is considered, and all electron transport related quantum effects are taken into account. Silicon nanowires are investigated with special attention to their radially resolved electronic structure and the corresponding modifications when the silicon diameter is reduced. The charge transport occurs mostly in the nanowire core. A diameter of around 5 nm can be identified, above which the nanowire core exhibits a similar density of states as bulk silicon. Thus, bulk approximations become increasingly valid above this diameter. NiSi2-Si interfaces are studied with focus on the symmetry between electron and hole currents in the tunneling regime. The symmetry is especially relevant for the development of reconfigurable field-effect transistors. Different NiSi2-Si interfaces and strain states are studied systematically. The symmetry is found to be different between the interfaces. Changes of the symmetry upon external strain are also very interface dependent. Furthermore, fundamental physical properties related to NiSi2-Si interfaces are evaluated. The stability of the different interfaces is compared in terms of interface energies. {111} interfaces are most stable, which explains their preferred occurrence in experiments. Other properties, whose strain dependence is studied, include the Schottky barrier height, the effective mass of the carriers, and work functions. A contribution to the development of numerical device simulators will be given by comparing the results from density functional theory based transport calculations and a model based on the Wentzel-Kramers-Brillouin approximation. This approximation, which is often employed in numerical device simulators, offers a relation between interface properties and the tunneling transport. The comparison allows an evaluation of the simplified model, which is then used to investigate the relation between the fundamental physical properties and the tunneling transport.:Index of Abbreviations 1. Introduction 2. Silicon Based Devices and Silicon Nanowires 2.1. Introduction 2.2. The Reconfigurable Field-effect Transistor 2.2.1. Design and Functionality 2.2.2. Fabrication 2.3. Overview Over Silicon Nanowires 2.3.1. Geometric Structure 2.3.2. Fabrication Techniques 2.3.3. Electronic Properties 3. Simulation Tools 3.1. Introduction 3.2. Electronic Structure Calculations 3.2.1. Introduction and Basis Functions 3.2.2. Density Functional Theory 3.2.3. Description of Exchange and Correlation Effects 3.2.4. Practical Aspects of Density Functional Theory 3.3. Electron Transport 3.3.1. Introduction 3.3.2. Scattering Theory 3.3.3. Wentzel-Kramers-Brillouin Approximation for a Triangular Barrier 3.3.4. Non-equilibrium Green’s Function Formalism A. Radially Resolved Electronic Structure and Charge Carrier Transport in Silicon Nanowires A.1. Introduction A.2. Model System A.3. Results and Discussion A.4. Summary and Conclusions A.5. Appendix A: Computational Details A.6. Appendix B: Supplementary Material A.6.1. Comparison of the Band Gap Between Relaxed and Unrelaxed SiNWs A.6.2. Band Structures for Some of the Calculated SiNWs A.6.3. Radially Resolved Density of States for Some of the Calculated SiNWs B. Electron Transport Through NiSi2-Si Contacts and Their Role in Reconfigurable Field-effect Transistors B.1. Introduction B.2. Model for Reconfigurable Field-effect Transistors B.2.1. Atomistic Quantum Transport Model to Describe Transport Across the Contact Interface B.2.2. Simplified Compact Model to Calculate the Device Characteristics B.3. Results and Discussion B.3.1. Characteristics of a Reconfigurable Field-effect Transistor B.3.2. Variation of the Crystal Orientations and Influence of the Schottky Barrier B.3.3. Comparison to Fabricated Reconfigurable Field-effect Transistors B.4. Summary and Conclusions B.5. Appendix: Supplementary Material B.5.1. Band Structure and Density of States of the Contact Metal B.5.2. Relaxation Procedure B.5.3. Total Transmission Through Multiple Barriers C. Formation and Crystallographic Orientation of NiSi2-Si Interfaces C.1. Introduction C.2. Fabrication and characterization methods C.3. Model System and Simulation Details C.4. Results and discussion C.4.1. Atomic structure of the interface C.4.2. Discussion of ways to modify the interface orientation C.5. Summary C.6. Appendix: Supplementary Material D. NiSi2-Si Interfaces Under Strain: From Bulk and Interface Properties to Tunneling Transport D.1. Introduction D.2. Model System and Simulation Approach D.3. Computational Details D.3.1. Electronic Structure Calculations (Geometry Relaxations) D.3.2. Electronic Structure Calculations (Electronic Structure) D.3.3. Device Calculations D.4. Tunneling Transport From First-principles Calculations D.4.1. Evaluation of the Current D.4.2. Isotropic Strain D.4.3. Anisotropic Strain D.5. Transport Related Properties and Effective Modeling Schemes D.5.1. Schottky Barrier Height D.5.2. Simplified Transport Model D.5.3. Models for the Schottky Barrier Height D.6. Summary and Conclusions D.7. Appendix: Supplementary Material D.7.1. Schottky Barriers of the {110} Interface Under Anisotropic Strain D.7.2. Silicon Band Structure, Electric Field, and Number of Transmission Channels D.7.3. k∥-resolved Material Properties D.7.4. Evaluation of the Work Functions and Electron Affinities D.7.5. Verification of the Work Function Calculation 4. Discussion 5. Ongoing Work and Possible Extensions 6. Summary Bibliography List of Figures List of Tables Acknowledgements Selbstständigkeitserklärung Curriculum Vitae Scientific Contributions

Nanomaterials are playing an increasing role in novel technologies, and it is important to develop optical methods to characterize them in situ.  To that end, backside absorbing layer microscopy (BALM) has emerged as a powerful tool, being capable to resolve sub-nanometer height profiles, with video-rate acquisition speeds and a suitable geometry to couple live experiments.  In the internship, several techniques involving BALM were developed, and applied to study optical and electrical properties of the transition metal dichalcogenide (TMD) monolayer MoS2, a type of 2-dimensional (2D) crystalline semiconductor.  A simulations toolkit was created in MATLAB to model BALM, a workflow to reliably extract linear intensities from the CMOS detector was realized, and 2D MoS2 was synthesized by chemical vapor deposition followed by transfer to appropriate substrates.  BALM data of the 2D MoS2 was acquired and combined with simulations, giving a preliminary result for its complex refractive index at 5 optical wavelengths.  In addition, the first steps towards coupling BALM with a gate biased 2D MoS2 field-effect transistor were explored.  To complement BALM measurements, the grown samples were also characterized by conventional optical microscopy, scanning electron microscopy, atomic force microscopy, photoluminescence spectroscopy, and Raman spectroscopy.  This work provides new additions to an existing platform of BALM techniques, enabling novel BALM experiments with nanomaterial systems.  In particular, it introduces a new alternative for local extraction of optical parameters and for probing of electrical charging effects, both of which are vital in the research and development of nano-optoelectronics.

The thesis is focused on the study of electric and dielectric properties of thin film organic materials that can be used as an active layer of photovoltaic cells. Primarily were studied the properties of the layers on the glass substrates, which consist of a thin active layer of phthalocyanines. On the samples were first measured current-voltage characteristics (in the dark and during the exposure) and the basic parameters of the photovoltaic conversion were determined. Finally were measured frequency dependencies (impedance spectra, in the dark and during the exposure) and the parameters of a model of the structure with organic semiconductor were determined. The obtained results will be used to optimize the properties of photovoltaic cells.

In dieser Arbeit werden organische Feldeffekttransistoren (OFETs) aus den verschiedenen Materialien Manganphthalocyanin (MnPc), [6,6]Phenyl-C61-butansäuremethylester (PCBM), 6,13-Bis(triisopropylsilyethinyl)pentacen (TIPS-Pentacen) und N,N’- Bis(n-octyl)-1,6-Dicyanoperylen-3,4:9,10-Bis(Dicarboximid) (PDI8-CN2) hergestellt. Dabei finden unterschiedliche Abscheidemethoden wie die Molekularstrahlabscheidung, die Ultraschallsprühbeschichtung und die Drehbeschichtung Anwendung. Die Morphologie sowie die Funktionsweise der Transistoren werden in Abhängigkeit von den Herstellungsparametern und bezüglich ihrer Stabilität gegenüber Lufteinfluss und elektrischer Belastung charakterisiert. Durch Aufdampfen von MnPc konnten so zum ersten Mal ambipolare MnPc-OFETs hergestellt und charakterisiert werden. Die bestimmten Löcher- und Elektronenbeweglichkeiten bestätigen die Eignung von MnPc für die Anwendung in Spintronik-Bauelementen. Desweiteren wird anhand gesprühter PCBM- und TIPS-Pentacen-OFETs gezeigt, dass die Ultraschallsprühbeschichtung eine geeignete Technik ist, um organische Halbleiter aus Lösung für die Verwendung in OFETs abzuscheiden. Die Abscheidung organischer Filme lässt sich mit einer Vielzahl an Parametern beeinflussen und die Funktionsweise von OFETs optimieren. In Verbindung mit den Untersuchungen aufgeschleuderter PDI8-CN2-OFETs konnte ein erheblicher Einfluss der Oberflächenenergie des verwendeten SiO2-Gateisolators auf die Korngröße im organischen Film festgestellt werden.

Im ersten Teil der Arbeit werden Signalverstärkungsmechanismen für Raman-Spektroskopie erschlossen und evaluiert. Die als geeignet bewerteten Methoden finden im zweiten Teil ihre Anwendung zur Untersuchung der vibronischen Eigenschaften von dünnen Manganphthalocyaninschichten, die anschließend mit Kalium interkaliert werden. Hierbei sind verschiedene Phasen identifizierbar, die ein ganzzahliges Verhältnis von Kaliumatomen zu Manganphthalocyaninmolekülen besitzen. Im dritten Teil werden die elektrischen Eigenschaften durch die Verwendung dieses Materialsystems als aktives Medium eines Feldeffekttransistors untersucht.:1. Einleitung 2. Theoretische Grundlagen der angewendeten Effekte 3. Experimentelle Details 4. Herstellung, Charakterisierung und Optimierung von Substraten für Raman-Oberflächenverstärkungseffekte 5. Untersuchung zu Verstärkungsmechanismen des Raman-Effekts an dünnen organischen Schichten 6. Interkalation mit Kalium in dünne Schichten aus Manganphthalocyanin 7. MnPc unter Spannungs- und Stromeinfluss - Der Feldeffekttransistor 8. Zusammenfassung Anhang Literatur Abbildungsverzeichnis Eidesstattliche Versicherung Lebenslauf Liste wissenschaftlicher Leistungen Danksagung

All DC/DC converter products include power electronic circuits for power conversion.It is important to find an efficient way for power conversion to reduce power losses and reduce the need for cooling and achieve environmentally friendly solutions.The use of semiconductor switches of wide band gap type is a solution to the problem.Therefore, the investigation of the SiC MOSFET in DC/DC converters is of crucial importance for the reduction of power losses.The thesis investigates the SiC MOSFET in three different tests.The efficiency test, the temperature test and the double pulse test.In the efficiency, the MOSFET STC3080KR and NTH4L022N120M3S are compared with their respective simulation made on PLECS.While in the temperature test the STC3080KR is investigated at different frequencies.In Double Pulse Test the MOSFET STC3080KR with 4-pin (TO-247 4L) package is compared with the MOSFET SCT3080KLHRC11 with 3-pin package (TO-247 N).The efficiency test shows that the MOSFET SCT3080KR in the practical test gives an efficiency in the range of 96,5-96,1% at 110kHz, 96-95,4% at 150kHz and 95,8-94,2% at 180kHz.While, the NTH4L022N120M3S gives an efficiency in the range of 98,1-97,1% at 110kHz, 96,3-96,2% at 150kHz and 96,1-95,5% at 180kHz.The efficiency given by the simulation is higher than the actual efficiency for both MOSFETs.However, the shape of the curves in the practical part matches the simulated one.The efficiency is not the same since the simulation do not consider all the losses present in the practical part.The temperature test shows that the temperature for the high side and low side increases when the frequency and the load current increases.However, some results show that when the load current increases at some point the low-side MOSFET will reach the temperature of the high-sided MOSFET and at the end it will exceed its value. This is due to the increment of the conduction losses since the low side MOSFET is basically the body diode incorporated in the MOSFET.Finally, the Double Pulse Test shows that the TO-247 N (3-pin) package switches with less source inductance compared to the TO-247 4L (4-pin) package.Therefore, the MOSFET SCT3080KLHRC11 (TO-247 N package) needs more time during the switching and which means that the switching power losses will be higher in comparison to the SCT3080KR as shown in Table 5.2 and Table 5.1. / Alla DC/DC-omvandlarprodukter inkluderar kraftelektroniska kretsar för effektomvandling. Detta gör att det är viktigt att hitta ett effektivt sätt för effektomvandlingen för att minska effektförlusterna och minska behovet av kylning och uppnå miljövänliga lösningar.Användningen av halvledaromkopplare med ett stort bandgap är en lösning på problemet.Därför är undersökningen av SiC MOSFET i DC/DC-omvandlare av avgörande betydelse för att minska effektförlusterna. Detta examensarbete undersöker SiC MOSFET i tre olika tester vilket är; Effektivitetstestet, temperaturen testet och double pulse testet.I effektivitets testet jämförs MOSFET STC3080KR och NTH4L022N120M3S med deras respektive simulering gjorda på PLECS.Medan i temperaturtestet undersöks STC3080KR vid olika frekvenser.I double pulse testet jämförs MOSFET STC3080KR med ett 4-stifts (TO-247 4L)-paket med MOSFET SCT3080KLHRC11 med ett 3-stiftspaket (TO-247 N).Effektivitetstestet visar att MOSFET SCT3080KR i det praktiska testet ger en verkningsgrad i intervallen 96,5-96,1% vid 110kHz, 96-95,4% vid 150kHz och 95,8-94,2% och vid 180kHz.Medan NTH4L022N120M3S visar en effektivitet i intervallet av 98,1-97,1% vid 110kHz, 96,3-96,2% vid 150kHz och 96,1-95,5% vid 180kHz.Verkningsgraden som ges av simuleringen är högre än den praktiska för båda MOSFET:erna.Formen på kurvorna i den praktiska delen matchar den simulerade.Verkningsgraden är inte densamma eftersom simuleringen inte tar hänsyn till alla förluster som finns i den praktiska delen.Temperaturtestet visar att temperaturen för den höga sidan och lågsidan ökar när frekvensen och belastningsströmmen ökar.Vissa resultat visar att när belastningsströmmen ökar lågsidans MOSFET når temperaturen hos den högsidiga MOSFET:en och i slutet kommer den att överstiga dess värde.Detta beror på ökningen av ledningsförlusterna eftersom MOSFET på lågsidan i grunden är kroppsdioden som ingår i MOSFET.Slutligen, visar double pulse testet att TO-247 N (3-stifts)-paketet växlar med mindre källinduktans jämfört med till TO-247 4L (4-stifts)-paketet.Därför behöver MOSFET SCT3080KLHRC11 (TO-247 N-paket) mer tid under växlingen och därför blir växlingseffektförlusterna högre jämfört med SCT3080KR, detta visas i Tabell 5.2 och Tabell 5.1.

Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric material (silicon doped hafnium oxide) were studied within the scope of the present work. Utilisation of silicon doped hafnium oxide (Si:HfO2) thin films instead of conventional perovskite ferroelectrics as a functional layer in FeFETs provides compatibility to the CMOS process as well as improved device scalability. The influence of different process parameters on the properties of Si:HfO2 thin films was analysed in order to gain better insight into the occurrence of ferroelectricity in this system. A subsequent examination of the potential of this material as well as its possible limitations with the respect to the application in non-volatile memories followed. The Si:HfO2-based ferroelectric transistors that were fully integrated into the state-of-the-art high-k metal gate CMOS technology were studied in this work for the first time. The memory performance of these devices scaled down to 28 nm gate length was investigated. Special attention was paid to the charge trapping phenomenon shown to significantly affect the device behaviour.:1 Introduction 2 Fundamentals 2.1 Non-volatile semiconductor memories 2.2 Emerging memory concepts 2.3 Ferroelectric memories 3 Characterisation methods 3.1 Memory characterisation tests 3.2 Ferroelectric memory specific characterisation tests 3.3 Trapping characterisation methods 3.4 Microstructural analyses 4 Sample description 4.1 Metal-insulator-metal capacitors 4.2 Ferroelectric field effect transistors 5 Stabilisation of the ferroelectric properties in Si:HfO2 thin films 5.1 Impact of the silicon doping 5.2 Impact of the post-metallisation anneal 5.3 Impact of the film thickness 5.4 Summary 6 Electrical properties of the ferroelectric Si:HfO2 thin films 6.1 Field cycling effect 6.2 Switching kinetics 6.3 Fatigue behaviour 6.4 Summary 7 Ferroelectric field effect transistors based on Si:HfO2 films 7.1 Effect of the silicon doping 7.2 Program and erase operation 7.3 Retention behaviour 7.4 Endurance properties 7.5 Impact of scaling on the device performance 7.6 Summary 8 Trapping effects in Si:HfO2-based FeFETs 8.1 Trapping kinetics of the bulk Si:HfO2 traps 8.2 Detrapping kinetics of the bulk Si:HfO2 traps 8.3 Impact of trapping on the FeFET performance 8.4 Modified approach for erase operation 8.5 Summary 9 Summary and Outlook

The high-frequency and low-voltage operation of organic thin-film transistors (OTFTs) is a key requirement for the commercial success of flexible electronics. Significant progress has been achieved in this regard by several research groups highlighting the potential of OTFTs to operate at several tens or even above 100 MHz. However, technology maturity, including scalability, integrability, and device reliability, is another crucial point for the semiconductor industry to bring OTFT-based flexible electronics into mass production. These requirements are often not met by high-frequency OTFTs reported in the literature as unconventional processes, such as shadow-mask patterning or alignment with unrealistic tolerances for production, are used. Here, ultra-short channel vertical organic field-effect transistors (VOFETs) with a unity current gain cut-off frequency (fT) up to 43.2 MHz (or 4.4 MHz V−1) operating below 10 V are shown. Using state-of-the-art manufacturing techniques such as photolithography with reliable fabrication procedures, the integration of such devices down to the size of only 12 × 6 μm2 is shown, which is important for the adaption of this technology in high-density circuits (e.g., display driving). The intrinsic channel transconductance is analyzed and demonstrates that the frequencies up to 430 MHz can be reached if the parasitic electrode overlap is minimized.

Thema dieser Arbeit ist die Synthese von hexagonalen GaN/(Al,Ga)N-Heterostrukturen mittels reaktiver Molekularstrahlepitaxie (MBE) auf SiC(0001)-Substraten. Der Einfluß der Wachstumsbedingungen auf die strukturellen, morphologischen, optischen und elektrischen Eigenschaften der Proben wird untersucht. Die reaktive MBE von Gruppe-III-Nitriden nutzt die katalytische Dekomposition von NH3 als Stickstoff-Precursor. Im Vergleich zur plasma-unterstützten MBE und metall-organischen Gasphasenepitaxie (MOCVD) ist dieses Abscheideverfahren eine noch wenig etablierte Methode, um kristalline (Al,Ga)N-basierende Heterostrukturen herzustellen. Es wird eine Einführung in das Verfahren und die Oberflächenchemie der reaktiven MBE gegeben. Die Synthese von (Al,Ga)N-Pufferschichten auf SiC(0001) wird diskutiert. Eine Prozedur zur Präparation der SiC-Substrate wird vorgestellt. Eine Methode zur in situ-Kontrolle der Wachstumsparameter wird erarbeitet, die auf der Beugung von hochenergetischen Elektronen (RHEED) beruht und ein reproduzierbares (Al,Ga)N-Wachstum ermöglicht. Die Pufferschichten haben atomar glatte Oberflächen, die sich für eine weitere Abscheidung von GaN/(Al,Ga)N-Heterostrukturen eignen. Es werden die strukturellen und optischen Eigenschaften solcher Strukturen studiert und mit Proben verglichen, die mittels plasma-unterstützter MBE und MOCVD hergestellt werden. Im Vergleich zu den übrigen III-V-Halbleitern zeichnen sich die hexagonalen Nitride besonders durch die Größe ihrer elektrischen Polarisationsfelder aus. GaN/(Al,Ga)N-Multiquantenwell-Strukturen (MQWs) mit unterschiedlichen Well-Dicken werden auf GaN- und (Al,Ga)N-Pufferschichten gewachsen. Es werden die Auswirkungen der spontanen Polarisation und Piezopolarisation auf die optischen Eigenschaften der MQWs studiert. Im speziellen wird - experimentell und theoretisch - gezeigt, daß die polarisationsbedingten elektrischen Felder in GaN/(Al,Ga)N-MQWs nicht durch hohe Dichten von freien Ladungsträgern abgeschirmt werden können. Ferner wird der Einfluß der GaN/(Al,Ga)N-Grenzflächenmorphologie auf die optischen Eigenschaften studiert. Das Wachstum von (Al,Ga)N/GaN-Heterostruktur-Feldeffekt-Transistoren (HFETs) auf semiisolierenden (Al,Ga)N-Puffern wird untersucht. Diese Heterostrukturen zeichnen sich durch eine geringe Dichte an Fadenversetzungen (1-2 x 108 cm-2) und durch das Fehlen jeglicher Parallelleitfähigkeit aus. Für diese Strukturen, die Beweglichkeiten von bis zu 750 cm2/Vs bei Raumtemperatur zeigen, werden Simulationen der temperaturabhängigen Beweglichkeiten unter Beachtung aller wichtigen Streumechanismen durchgeführt. In Übereinstimmung mit der Sekundärionenspektrometrie an diesen Proben wird belegt, daß die Transistoreigenschaften dominant durch tiefe Störstellen - sehr wahrscheinlich As - begrenzt werden. Es wird die Synthese von spannungskompensierten GaN/(Al,Ga)N-Bragg-Reflektoren mit Reflektivitäten von über 90% im blauen Spektralbereich vorgestellt. Die experimentelle Realisierung basiert auf der exakten Bestimmung der individuellen Schichtdicken durch die Simulation der gemessenen Röntgenbeugungsprofile und Reflektivitätsspektren. Die mittels Laserstreuung abgeschätzten Reflektivitätsverluste können durch NH3-reiche Synthesebedingungen reduziert werden. / In this thesis, we investigate the synthesis of wurtzite (Al,Ga)N heterostructures on SiC(0001) by reactive molecular beam epitaxy (MBE). We examine the impact of growth conditions on the structural, morphological, optical and electrical properties of the films. MBE of group-III nitrides is almost entirely based on the use of an N2 plasma discharge for providing reactive N. However, an alternative and attractive candidate for producing N radicals is NH3, which decomposes on the growth front by a catalytic reaction even at comparatively low temperatures. The basic growth technique and surface chemistry of reactive MBE is introduced. The deposition of (Al,Ga)N buffer layers on SiC(0001) substrates is discussed. An ex-situ cleaning procedure for the SiC substrates is presented. An in-situ method for the reproducible growth of these buffers layers is developed based on reflection high-energy electron diffraction (RHEED). The layers have atomically smooth surfaces well suited for the growth of GaN/(Al,Ga)N heterostructures. The structural and optical properties of these buffers are compared to such layers grown by plasma-assisted MBE and metal organic vapor phase deposition (MOCVD), respectively. Compared to other III-V semiconductors hexagonal nitrides exhibit huge electrical polarization fields. GaN/(Al,Ga)N multiple quantum wells (MQWs) with different well thicknesses are deposited on GaN and (Al,Ga)N buffer layers, respectively. It is demonstrated that the electric field in the quantum wells (QWs) leads to a quantum-confined Stark shift of the QW emission, which thus can fall well below the bulk GaN band-gap energy. In the opposite, it is proved that the strain state of the QWs alone has little impact on the electric fields in MQWs. The optical properties of these heterostructures are studied by stationary and time-resolved photoluminescence and compared with the results of self-consistent Schrödinger-Poisson calculations. It is shown that the recombination dynamics in heavily doped MQWs (7 x 1018 cm-3) is still controlled by residual fields, contrary to the common assumption that flat-band conditions are achieved at this doping level. Furthermore, the influence of the interface roughness on the QW emission widths is analyzed. The growth of (Al,Ga)N/GaN heterostructure field effect transistors (HFETs) on semi-insulating (Al,Ga)N buffers is studied. Temperature dependent Hall measurements show a mobility of up to 750 cm2/Vs and 1400 cm2/Vs at 300 K and 77 K, respectively. Transmission electron microscopy reveals the (Al,Ga)N/GaN interface to be abrupt and the dislocation density to be too low to limit the HFET mobility. However, secondary ion mass spectroscopy detects a significant concentration of As in the channel region. Indeed, an excellent fit to the temperature dependence of the mobility is obtained by including scattering with As. The synthesis and analysis of highly reflective and conductive GaN/(Al,Ga)N Bragg reflectors is examined. The realization of these Bragg mirrors is based on the exact determination of the structural parameters by simulating x-ray diffraction profiles and corresponding reflectivity spectra. To prevent cracking from these thick stacks, a concept of strain-balanced multilayer structure is employed. It is demonstrated that the difference between the theoretical and the measured maximum reflectivity can be minimized by growing the Bragg mirrors under NH3 stable growth conditions.