The reliability of a mechanical system containing electronic packages is highly affectedby the environment the system is stationed in. The difference and fluctuationsbetween the ambient temperature and the operating temperature of the electronicpackage cause accumulation of inelastic strains in the package components thusdecreasing the service life. The most common failure modes of an electronic packagehas been identified from inspection of malfunctioning machines as cracks in the solderjoint and delamination between the glue and the die. Knowledge regarding therelationships between parameters affecting these failure modes, which are importantand which are not, is of high interest when developing new and existing products. SAAB AB would like to develop a methodology using design exploration to allow forevaluation of electronic packages using nonlinear finite element methods. A surrogate model was created and parameterized with HyperMorph to be used forthree linear static variations of design of experiments, where both the performance ofthe methods themselves and the relative importance of the parameters were ofinterest. A connectivity condition was also implemented to allow for relativemovement between components while keeping the mesh intact. The designexploration was executed using a Taguchi design, a Modified extensive latticesequence design and a fractional factorial design where the three methods werecompared as well as the parameter significance analysed. An optimization was thenperformed to find the optimal parameter settings within the allowed bounds to beused where a nominal model and an optimized model are evaluated with animplemented creep law. The fatigue life of the two models were then estimated. / Tillförlitligheten hos ett mekaniskt system med elektroniska kretsar påverkas starkt av miljön systemet används i. Skillnader och fluktuationer mellan omgivningens temperatur och arbetstemperaturen för de elektroniska kretsarna orsakar ackumulering av inelastiska töjningar, därmed förkortas det mekaniska systemets livstid. Dem vanligaste fel-moderna för en elektronisk krets har identifierats genom inspektion av felande maskiner som sprickbildning i lödfogarna och delaminering mellan processorn och dess lim. Kunskap hur förhållandet mellan parametrar som påverkar dessa fel-moder, vilka som är viktiga och vilka som inte är viktiga är av högt intresse vid utveckling av nya och redan existerande produkter. SAAB AB vill utveckla en metodik som utnyttjar statistisk försöksplanering för analyserande av elektroniska kretsar med hjälp av olinjära finita element metoder för att kunna spegla dess beteende på ett realistiskt sätt. En surrogatmodell skapades och parametriserades med hjälp av HyperMorph för att användas inom tre statiskt linjära varianter av statistisk försöksplanering, där både metodens prestanda och den relativa påverkan från parametrarna var av intresse. Ett kontaktvillkor implementerades för att tillåta relativ rörelse mellan komponenter samtidigt som nätet av finita element hölls intakt. Försöksplaneringsimuleringar utfördes med en Taguchi design, en Modified extensive lattice sequence design och en fractional factorial design, där de tre metoderna jämfördes mot varandra samt analyserades vad gäller respektive parametersignifikansen. Med optimering fanns sedan en optimal modell för att kunna jämföras med en nominell modell där en kryplag implementerades i lödfogen. Livslängden beräknades sedan för båda modeller.

<p>Finite element modeling of the structural response of hollow concrete block walls subject to out-of-plane loading has become more common given the availability of computers and general-purpose finite element software packages. In order to develop appropriate models of full-scale walls with and without openings, a parametric study was conducted on simple wall elements to assess different modeling techniques. Two approaches were employed in the study, homogeneous models and heterogeneous models. The linear elastic analysis was carried out to quantify the effects of the modeling techniques for hollow blocks on the structural response of the assembly, specifically for out-of-plane bending. Three structural elements with varying span/thickness ratios were considered, a horizontal spanning strip, a vertical spanning strip and a rectangular wall panel supported on four edges. The values computed using homogeneous and heterogeneous finite element models were found to differ significantly depending on the configuration and span/thickness ratio of the wall.</p><p>Further study was carried out through discrete modeling approach to generate a three-dimensional heterogeneous model to investigate nonlinear behaviour of full-scale walls under out-of-plane loading. The Composite Interface Model, established based on multi-surface plasticity, which is capable of describing both tension and shear failure mechanisms, has been incorporated into the analysis to capture adequately the inelastic behaviour of unit-mortar interface.An effective solution procedure was achieved by implementing the Newton-Raphson method, constrained with the arc-length control method and enhanced by line search algorithm. The proposed model was evaluated using experimental results for ten full-size walls reported in the literature. The comparative analysis has indicated very good agreement between the numerical and experimental results in predicting the cracking and ultimate load values as well as the corresponding crack pattern. / Thesis / Master of Applied Science (MASc)

Made available in DSpace on 2010-04-20T20:48:40Z (GMT). No. of bitstreams: 3 49381.pdf.jpg: 12506 bytes, checksum: 3ee0e25c4384f2bc93fc720f54b20cc4 (MD5) 49381.pdf.txt: 197053 bytes, checksum: a91984dec05b70029e90078a7eb7329a (MD5) 49381.pdf: 702040 bytes, checksum: 6a1fd2185c34dda5f5940c255ee6f19f (MD5) Previous issue date: 2006-10-31T00:00:00Z / O objetivo desse trabalho é fazer um estudo exploratório acerca da cadeia de suprimentos dos pacotes de turismo, estruturados para as classes A e B, cujo destino seja o Nordeste Brasileiro. Procurou-se verificar quais as variáveis importantes e impactantes desta cadeia, o relacionamento entre os participantes da mesma e assim, avaliar se o poder da mesma está nas mãos da operadora de turismo. Para tanto, uma revisão bibliográfica foi realizada inicialmente a fim de identificar quais os aspectos relevantes da cadeia de suprimentos e de turismo. As questões teóricas serviram de base para a coleta de dados em campo, a qual foi constituída de entrevista com roteiro semi-estruturado, com 14 executivos - gerentes e diretores - das empresas constituintes dessa cadeia, complementada por meio de questionário com questões fechadas, respondido por 104 colaboradores da área operacional destas empresas. Por fim, aliando-se a teoria às informações coletadas em campo, foi possível chegar às conclusões e análises pretendidas. / The objective of this work was to conduct an exploratory study about the supply chain of tourist packages designed for publics from A and B social classes, with destination to the Brazilian northeast region. The study was focused in the identification of the most important and relevant variables of this chain as well as the relationship among the participants in order to find out if the tour operator has the main control and leadership in this chain. For this purpose, a bibliography review was done to identify which were the most relevant aspects of the supply and tourist packages. The theoretical questions were used as basis for the qualitative research through interviews with 14 executives, managers and directors from the companies involved in the chain, besides another research through structured questions asked to 104 operational employees from the companies. All this effort was aimed at checking and bringing together the results of these research works and the initial theories, and thence, make it possible to verify and confirm the conclusions.

Chip-package interaction (CPI) has become a critical reliability issue for flip-chip packaging of Cu/low-k chip with organic substrate. The thermo-mechanical deformation and stress develop inside the package during assembly and subsequent reliability tests due to the mismatch of the coefficients of thermal expansion (CTEs) between the chip and the substrate. The thermal residual stress causes many mechanical reliability issues in the solder joints and the underfill layer between die and substrate, such as solder fatigue failure and underfill delamination. Moreover, the thermo-mechanical deformation of the package can be directly coupled into the Cu/low-k interconnect, inducing large local stresses to drive interfacial crack formation and propagation. The thermo-mechanical reliability risk is further aggravated with the implementation of ultra low-k dielectric for better electrical performance and the mandatory change from Pb-containing solders to Pb-free solders for environmental safety. These CPI-induced reliability issues in flip-chip packaging of Cu/low-k chips are investigated in this dissertation at both chip level and package level using high-resolution Moiré interferometry and Finite Element Analysis (FEA). Firstly, the thermo-mechanical deformation in flip-chip packages is analyzed using high-resolution Moiré interferometry. The effect of underfill properties on package warpage is studied and followed by a strategy study of proper underfill selection to improve solder fatigue life time and reduce the risk of interfacial delamination in underfill and low-k interconnects under CPI. The chip-package interaction is found to maximize at the die attach step during assembly and becomes most detrimental to low-k chip reliability because of the high thermal load generated by the solder reflow process before underfilling. A three-dimensional (3D) multilevel sub-modeling method combined with modified virtual crack closure (MVCC) technique is employed to investigate the CPI-induced interfacial delamination in Cu/low-k interconnects. It is first focused on the effects of dielectrics and solder materials on low-k interconnect reliability and then extended to the scaling effect where the reduction of the interconnect dimension is accompanied with an increased number of metal levels and the implementation of ultralow-k porous dielectrics. Recent studies on CPI-induced crack propagation in the low-k interconnect and the use of crack-stop structures to improve the chip reliability are also discussed. Finally, 3D integration (3DI) with through silicon vias (TSV) has been proposed as the latest solution to increase the device density without down-scaling. The thermo-mechanical reliability issues facing 3DI are analyzed. Three failure modes are proposed and studied. Design optimization of 3D interconnects to reduce the thermal residual stress and the risks of fracture and delamination are discussed. / text

Different medical imaging modalities provide complementary anatomical and functional information. One increasingly important use of such information is in the clinical management of cardiovascular disease. Multi-modality data is helping improve diagnosis accuracy, and individualize treatment. The Clinical Research Imaging Centre at the University of Edinburgh, has been involved in a number of cardiovascular clinical trials using longitudinal computed tomography (CT) and multi-parametric magnetic resonance (MR) imaging. The critical image processing technique that combines the information from all these different datasets is known as image registration, which is the topic of this thesis. Image registration, especially multi-modality and multi-parametric registration, remains a challenging field in medical image analysis. The new registration methods described in this work were all developed in response to genuine challenges in on-going clinical studies. These methods have been evaluated using data from these studies. In order to gain an insight into the building blocks of image registration methods, the thesis begins with a comprehensive literature review of state-of-the-art algorithms. This is followed by a description of the first registration method I developed to help track inflammation in aortic abdominal aneurysms. It registers multi-modality and multi-parametric images, with new contrast agents. The registration framework uses a semi-automatically generated region of interest around the aorta. The aorta is aligned based on a combination of the centres of the regions of interest and intensity matching. The method achieved sub-voxel accuracy. The second clinical study involved cardiac data. The first framework failed to register many of these datasets, because the cardiac data suffers from a common artefact of magnetic resonance images, namely intensity inhomogeneity. Thus I developed a new preprocessing technique that is able to correct the artefacts in the functional data using data from the anatomical scans. The registration framework, with this preprocessing step and new particle swarm optimizer, achieved significantly improved registration results on the cardiac data, and was validated quantitatively using neuro images from a clinical study of neonates. Although on average the new framework achieved accurate results, when processing data corrupted by severe artefacts and noise, premature convergence of the optimizer is still a common problem. To overcome this, I invented a new optimization method, that achieves more robust convergence by encoding prior knowledge of registration. The registration results from this new registration-oriented optimizer are more accurate than other general-purpose particle swarm optimization methods commonly applied to registration problems. In summary, this thesis describes a series of novel developments to an image registration framework, aimed to improve accuracy, robustness and speed. The resulting registration framework was applied to, and validated by, different types of images taken from several ongoing clinical trials. In the future, this framework could be extended to include more diverse transformation models, aided by new machine learning techniques. It may also be applied to the registration of other types and modalities of imaging data.

Genetic maps are useful tools in breeding programs and evolutionary studies. Since the publication of the first map, several concepts have been proposed and implemented in various mapping software. Each software presents different characteristics for the construction of maps. For example, aspects such as availability of source code, licenses, tutorials, and operating system need to be considered. There are also important points related to the statistical methods employed. In this context, the users\' choice can often be a complicated task. The objectives here were: i) to present the main software with free licenses developed in recent years; ii) construct linkage maps using these software and, iii) evaluate them from the point of view of users. The software considered were: OneMap, Lep-MAP, HighMap, Lep-MAP2, Flipper, Lep-MAP3, ASMap, and GUSMap. This work can guide researchers about the free tools available to construct genetic maps. / Mapas genéticos são ferramentas úteis em programas de melhoramento e em estudos evolutivos. Desde a publicação do primeiro mapa, vários conceitos foram propostos e implementados em vários softwares de mapeamento. Cada software apresenta diferentes características para construção de mapas. Por exemplo, aspectos como disponibilidade do código fonte, licenças, tutoriais e sistema operacional precisam ser considerados. Há ainda pontos importantes relacionados aos métodos estatísticos empregados. Assim sendo, nem sempre a escolha pelos usuários é uma tarefa simples. Os objetivos aqui foram: i) apresentar os principais softwares com licenças gratuitas desenvolvidos nos últimos anos; ii) construir mapas de ligação utilizando esses programas e iii) avaliá-los do ponto de vista dos usuários. Os softwares considerados foram: OneMap, Lep-MAP, HighMap, Lep-MAP2, Flipper, Lep-MAP3, ASMap e GUSMap. Este trabalho poderá orientar os pesquisadores quanto às ferramentas gratuitas disponíveis para construção de mapas genéticos.

Interactive packaging is an emerging research area in recent years. It brings people convenient and smart lives, reduces consumption of traditional packaging materials and direct or indirect labor costs as well. Being integrated in interactive packaging, Radio Frequency Identification (RFID) technology becomes one of the most proactive development enablers. In this paper, an interactive and intelligent packaging solution integrating passive RFID system and Controlled Delamination Material (CDM) is given at first. Package opening action is electrically controlled by the RFID system. CDM is primarily used in aerospace applications in the past and the conductor/adhesive joint can be easily opened by applying a little electric power on to the material. Some related works will be shown about the electrochemical characteristics of CDM in order to facilitate the system design. A demonstration system was developed and the test results have proved feasibility of the solution and shown the potential of low cost for mass production. Based on this solution, an interactive medication package for pervasive healthcare is further developed, using EPCglobal Gen2 RFID technology. It will make the medication being accessible for patient only at the prescribed dose and time, and medication taking information will be delivered as well. Such medication package will not only give unprecedented high patient compliance, but also improve the communication between patients and healthcare staffs. / QC 20111202

In this study, results of a comparison on benchmark test problems are presented to investigate the performance of Primavera V.4.1 with its two resource allocation priority rules and MS Project 2003. Resource allocation capabilities of the packages are measured in terms of deviation from the upper bound of the minimum makespan. Resource constrained project scheduling problem instances are taken from PSPLIB which are generated under a factorial design from ProGen. Statistical tests are applied to the results for investigating the significance effectiveness of the parameters.

Darbo „Duomenų kompiuterinės statistinės analizės technologijos“ tikslas – išanalizuoti ir palyginti įvairių populiarių statistinių paketų galimybes bei pateikti rekomendacijas vartotojui. Šiame darbe buvo išanalizuoti SPSS 8.0 for Windows, STATISTICA 7 ir Minitab 15 English statistiniai paketai. Atlikti statistiniai skaičiavimai su anketos „Apie tai, kaip tu gyveni“ duomenimis, panaudojant minėtus statistinius paketus. Įvertintos šių statistinių paketų galimybės. Sudarytos statistinių paketų lyginamosios analizės lentelės. Pateiktos rekomendacijos vartotojui, padedančios jam pagrįstai pasirinkti tinkamiausią statistinį paketą, atsižvelgiant į vartotojo poreikius ir galimybes. Statistiniam paketui STATISTICA 7 sukurtos dvi makrokomandos, panaudojant šiame pakete integruotą VISUAL BASIC programavimo kalbą. Pirmoji makrokomanda skaičiuoja tiriamųjų anketų užpildymo baigtumo laipsnius. Antroji makrokomanda filtruoja pasirinkto kintamojo duomenis pagal pasirinktą kriterijų. Darbas inovatyvus tuo, kad sukurtos dvi makrokomandos, praplečiančios statistinio paketo STATISTICA 7 galimybes. / The aim of work “The technologies of computer-based statistical analysis of data”- to analyse and to compare the potentials of various popular statistical packages and to propose the recommendations for the consumer. In this work there were analysed SPSS 8.0 For Windows, STATISTICA 7 and Minitab 15 English statistical packages. Using these mentioned packages there were accomplished statistical calculations according to the questionnaire “About that, how do you live” data. There were assessed the potentials of these statistical packages. There were composed the charts of comparative analysis of the statistical packages. Recommendations were given for the consumer, helping him to pick reasonably the best statistical package, considering consumer’s requirements and possibilities. For the statistical package STATISTICA 7 there were created two macros, using VISUAL BASIC computerese integrated in this package. The first macro calculates the completeness degrees of the investigative questionnaires filling. The second macro filters the data of chosen variable according to the chosen criterion. This work is innovative that there were created two macros, extending potentials of statistical package STATISTICA 7.

Šio darbo tikslas išspręsti stochastinio programavimo uždavinį panaudojant matematinius paketu. Šiems sprendimams atlikti suprojektuojamas sprendimo algoritmas pagal analizuojama stochastinio programavimo matematinį modelį. Pagal sudarytą sprendimo algoritmą realizuojamas programinis kodas Mathcad, Maple ir MatLab matematiniuose paketuose. Gautų galutinių rezultatų analizė. Darbo metu išskiriamos atitinkamos funkcijos matematiniuose paketuose, kurios naudojamos realizuojant sprendimo algoritmą programiniu kodu. Pateikiamas nelygybių sprendimo struktūrinis modelis kiekvienam iš pasirinktųjų matematinių paketų. Darbo aprašyme pateikiamos sutrumpintos atliekamo tyrimo ir jo dalių teorinės ir praktinės žinios. / The aim of this work is to solve stochastic programming task using mathematical packages. For solving these tasks is projected algorithm according to analyzed stochastic programming mathematical model. Also, according to projected algorithm there is written programmed code for mathematical packages Mathcad, Maple and MatLab. Analyze of work’s results. There is a list of functions used in mathematical packages during project. Also, structural model for solving equalities systems is given for all chosen mathematical packages. In description of this work, you can find a brief theoretical and practical knowledge of this research and its parts.