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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
291

Thermal Chemistry of Adsorbed Molecules Containing Azido and Cyano Groups on a Copper Surface

Yu, Pao-tao 23 July 2009 (has links)
In the organometallic chemistry, the imido complexes are an interesting species because it of their rich reactivity. Imido has two forms, where M=N-R form is nucleophilic and M¡ÝN-R form is elctrophilic. The thermo- or photochemical- decomposition of metal azido complexes is known to result in the formation of the corresponding metal nitride(M¡ÝN) or imido complexes. These reactions are oxidative cleavage type. As far as we know, imido species have not been generated on metal surfaces; therefore, we attempt to use the azidotrimethylsilane((CH3)3Si-N3 ; TMSN3) as precursors to produce imido species(TMSN=Cu) by N2 extrusion mechanism on Cu(111). The process was explored by a combination of temperature-programmed desorption (TPD), reflection absorption infrared spectroscopy (RAIRS), and X-ray photoemission spectroscopy (XPS) techniques. In addition, density functional theory (DFT) calculations were conducted to obtain the optimized geometries for the various surface intermediates. The computed IR spectra facilitated the vibrational mode assignments. TPD spectra show that TMSN=Cu was hydrogenated to the TMSNH2 amine product around 520 K. We propose that the hydrogen source is adsorbed methyl groups, invoking the cleavage of the Si-C bond. TMSCH2N3 molecule was also investigated. In this case, N2 and H2 molecules were found to desorb around 260 K and 320K. A novel TMSC¡ÝN product was observed around 280K. We suggest it is a result of the metathesis reaction from ethylidyne (TMSC¡ÝCu) and nitride(N¡ÝCu) species. The TMSC¡ÝCu species are produced by double £\-hydride elimination of TMSCH2-Cu groups. The N¡ÝCu may be generated by the thermaldecomposition of copper azide(N=N=N-Cu). RAIRS reveal that there are three kinds of azido vibrations,where the higher frequency is assigned to the N=N=N-Cu species. This product is verified by the TPD of adsorbed TMSC¡ÝN molecule. Intriguingly, the thermal chemistry of TMSC¡ÝN molecule indicates that the isomeric molecule TMSN¡ÝC could be formed around 210 K, evidenced by a notable change in the RAIRS. The higher frequency £hC¡ÝN of TMSC¡ÝN transforms into a lower frequency £hC¡ÝN for TMSN¡ÝC. The coverage-dependent studies of RAIRS and XPS performed at 160 K surface temperature show that the isomerization may be intermolecular. The back-£k bonded TMSN¡ÝC molecule is desorbed around 410 K. XPS and RAIRS at 800 K show that isocyanide could polymerize to polyisocyanide, with an imine structure, and the characteristic C¡ÝN stretching mode disappeared.
292

none

Huang, Shih-Yi 04 August 2009 (has links)
none
293

Crystallisation Processing of Al-base Alloys

Fjellstedt, Carl Jonas January 2001 (has links)
No description available.
294

Processing of Nanostructured WC-Co Powders and Sintered Steels

Zhang, Zongyin January 2003 (has links)
<p>Processing of nanostructured WC-Co and W-Co powders,modelling of Fe-Mn-Si alloy, swelling of Fe-Cu alloy, andmechanical properties and sintering of Fe-Mn-Si steels havebeen studied in the present thesis.</p><p>W-Co precursors made by chemical synthesis were used toproduce nanostructured WCCo and W-Co powders by calcination,reduction and carburization. The phase constituents in thecalcined powders depend on temperature and atmospheres. Cobaltcan accelerate the reduction rate of the W-Co precursors as acatalyst, and cobalt influences the formation of intermediatephases during the reduction of the precursors.</p><p>The ratio of carbon monoxide to carbon dioxide controlscarburization process, gives different intermediate phases andcarburization rates. There exist several intermediate phases: W<sub>6</sub>Co<sub>6</sub>C, W<sub>3</sub>Co<sub>3</sub>C, W<sub>2</sub>C due to varying carbon monoxide content in thecarburization gases. Nanostructured WC-Co powders with aparticle size of 20-50 nm have been obtained.</p><p>The effect of silicon content on the particle sizedistribution of milled Fe-Mn-Si master alloy powders is muchmore significant than that of manganese content. A finer finalparticle size can be obtained in the alloy powders with highersilicon compositions. Long time milling results in theagglomeration of small particles. The grinding process can bedescribed using classic batch grinding equation based on thepopulation balance model. A swelling model for Fe-Cu alloyssintered at the temperatures above the melting point of copperhas been established based on the penetration mechanism. In themodel, the particle coordination number and heating rate wereused to express the porosity and the thickness of the diffusionlayers between iron and copper particles respectively.</p><p>The effects of sintering temperature and time on theproperties of sintered steels have been studied. Fe-Mn-Simaster alloys made by cast-milling, atomizing, and acombination of atomization and milling have been covered. Themilled, and atomizationmilled alloy steels showed goodmechanical properties with small dimensional change. Transientliquid phase of the Fe-Mn-Si alloys accelerates densification,and offer fast diffusion of alloying elements. The addition ofa small amount of Fe-Mn-Si master alloy to Astaloy 85Mo powdercan lead to high strength with zero dimensional change.</p><p><b>Key words:</b>Processing; Modelling; Nanostructured powder;WC-Co; W-Co; Calcination; Reduction; Carburization; Particlesize; Sintered steel; Fe-Cu alloy; Swelling; Fe-Mn-Si masteralloy; Mechanical properties; Sintering parameters.</p>
295

Elektromigrationsuntersuchungen an der Grenzfläche zwischen Kupferleitbahn und Kupferdiffusionsbarriere / Electromigration investigation at the interface of copper pathway and copper diffusion barrier

Walther, Tillmann 01 June 2015 (has links) (PDF)
Aufgrund von guten Eigenschaften als Kupferdiffusionsbarriere und guter elektrischer Leitfähigkeit könnte sich Ruthenium und Ruthenium basierte Legierungen als Kupferdiffusionsbarriere eignen. Auf eine theoretische Aufarbeitung von Elektromigrationsmechanismen und in der Praxis eingesetzte Elektromigrationsteststrukturen folgen beschleunigte elektrische Elektromigrationstestergebnisse. Es konnte gezeigt werden, dass das System Kupfer, Ruthenium, Tantalnitrid Elektromigrationsstabiler als das konventionelle System Kupfer, Tantal, Tantalnitrid ist.
296

Foraminiferal assemblages as bioindicators of potentially toxic elements in Biscayne Bay, Florida

Carnahan, Elizabeth A 01 June 2005 (has links)
Heavy-metal pollution is an issue of concern in estuaries such as Biscayne Bay that are heavily influenced by agricultural, urban, and harbor activities. The goals of this study were to provide a state of the bay assessment that can be used to interpret changes that have occurred over the past 60 years in Biscayne Bay, to provide a baseline to compare changes in the ecosystems during and after execution of the Comprehensive Everglades Restorations Plan (CERP), and to determine if benthic foraminiferal assemblages in Biscayne Bay reflect heavy-metal contamination in sediments. Surficial samples were collected at 147 sites throughout the bay. Analyses included geochemical assessment of the mud fraction for 32 chemical parameters, grain-size analysis, and assessment of foraminiferal assemblages at the genus level. Geochemical analyses revealed elevated concentrations of a suite of heavy metals in the sediments of the northern bay, between Miami and Key Biscayne, and the periphery of the southern bay from Black Creek Canal south to Turkey Point. Cluster analysis, multi-dimensional scaling, and multivariate-correlation analyses revealed three distinct foraminiferal assemblages. One assemblage, characteristic of the northern bay, was defined by stress-tolerant taxa including Ammonia, Cribroelphidium, Nonion, and Haynesina, which were present in low abundances. Distribution of this assemblage correlated with the most elevated concentrations of heavy metals. The assemblage that defined the southwestern margin of the bay was dominated by Ammonia and Quinqueloculina. This assemblage is characterized by the lowest diversities and highest abundances, and is likely influenced by both reduced salinity and elevated organic-carbon concentrations.
297

Colloidal and Electrochemical Aspects of Copper-CMP

Sun, Yuxia January 2007 (has links)
Copper based interconnects with low dielectric constant layers are currently used to increase interconnect densities and reduce interconnect time delays in integrated circuits. The technology used to develop copper interconnects involves Chemical Mechanical Planarization (CMP) of copper films deposited on low-k layers (silica or silica based films), which is carried out using slurries containing abrasive particles. One issue using such a structure is copper contamination over dielectric layers (SiO2 film), if not reduced, this contamination will cause current leakage. In this study, the conditions conducive to copper contamination onto SiO2 films during Cu-CMP process were studied, and a post-CMP cleaning technique was discussed based on experimental results. It was found that the adsorption of copper onto a silica surface is kinetically fast (< 0.5 minute). The amount of copper absorbed is pH and concentration dependent and affected by presence of H2O2, complexing agents, and copper corrosion inhibitor Benzotrazole. Based on de-sorption results, DI water alone was unable to reduce adsorbed copper to an acceptable level, especially for adsorption that takes place at a higher pH condition. The addition of complex agent, citric acid, proved effective in suppressing copper adsorption onto oxide silica during polishing or post-CMP cleaning by forming stable copper-CA complexes. Surface Complexation Modeling was used to simulate copper adsorption isotherms and predict the copper contamination levels on SiO2 surfaces.Another issue with the application of copper CMP is its environmental impact. CMP is a costly process due to its huge consumption of pure water and slurry. Additionally, Cu-CMP processing generates a waste stream containing certain amounts of copper and abrasive slurry particles. In this study, the separation technique electrocoagulation was investigated to remove both copper and abrasive slurry particles simultaneously. For effluent containing ~40 ppm dissolved copper, it was found that ~90% dissolved copper was removed from the waste streams through electroplating and in-situ chemical precipitation. The amount of copper removed through plating is impacted by membrane surface charge, type/amount of complexing agents, and solid content in the slurry suspension. The slurry particles can be removed ~90% within 2 hours of EC through multiple mechanisms.
298

Investigation of the segregation behaviour in nanocrystalline materials

Wille, Catharina Gabriele 30 October 2009 (has links)
No description available.
299

Heterogene Interdiffusion von nanokristallinen Cu/Co/Au-Schichten / Heterogenous interdiffusion of nanocrystalline Cu/Co/Au-layers

Lang, Christian 30 October 2001 (has links)
No description available.
300

The role of internal stresses on the plastic deformation of the Al–Mg–Si–Cu alloy AA6111

Poole, Warren J., Proudhon, H., Wang, X., Brechet, Y. January 2008 (has links)
In this work, we have investigated the internal stress contribution to the flow stress for a commercial 6xxx aluminium alloy (AA6111). In contrast to stresses from forest and precipitation hardening, the internal stress cannot be assessed properly with a uniaxial tensile test. Instead, tension-compression tests have been used to measure the Bauschinger stress and produce a comprehensive study which examines its evolution with i) the precipitation structure and ii) a wide range of applied strain. A large set of ageing conditions was investigated to explore the effect of the precipitation state on the development of internal stress within the material. It is shown that the Bauschinger stress generally increases with the applied strain and critically depends on the precipitate average radius and is thus linked to the shearable/non shearable transition. Further work in the case of non-shearable particles shows that higher strain eventually lead to particle fracture and the Bauschinger stress then rapidly decreases. Following the seminal work of Brown et al, a physically based approach including plastic relaxation and particle fracture is developed to predict the evolution of the internal stress as a function of the applied strain. Knowing the precipitation structure main characteristics –such as the average precipitate radius, length and volume fraction– allows one to estimate accurately the internal stress contribution to the flow stress with this model.

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