The effects of direct plasma chemistries on carbon removal from silicon nitride (SiNx) and oxynitride (SiOxNy ) surfaces and Cu have been studied by x-photoelectron spectroscopy (XPS) and ex-situ contact angle measurements. The data indicate that O2,NH3 and He capacitively coupled plasmas are effective at removing adventitious carbon from silicon nitride (SiNx) and Silicon oxynitride (SiOxNy ) surfaces. O2plasma and He plasma treatment results in the formation of silica overlayer. In contrast, the exposure to NH3 plasma results in negligible additional oxidation of the SiNx and SiOxNy surface. Ex-situ contact angle measurements show that SiNx and SiOxNy surfaces when exposed to oxygen plasma are initially more hydrophilic than surfaces exposed to NH3 plasma and He plasma, indicating that the O2 plasma-induced SiO2 overlayer is highly reactive towards ambient corresponding to increased roughness measured by AFM. At longer ambient exposures (>~10 hours), however surfaces treated by either O2, He or NH3 plasma exhibit similar steady state contact angles, correlated with rapid uptake of adventitious carbon, as determined by XPS. Surface passivation by exposure to molecular hydrogen prior to ambient exposure significantly retards the increase in the contact angle upon the exposure to ambient. The results suggest a practical route to enhancing the time available for effective bonding to surfaces in microelectronics packaging applications.

京都大学 / 0048 / 新制・課程博士 / 博士(医学) / 甲第22348号 / 医博第4589号 / 新制||医||1042(附属図書館) / 京都大学大学院医学研究科医学専攻 / (主査)教授 小柳 義夫, 教授 中川 一路, 教授 伊藤 貴浩 / 学位規則第4条第1項該当 / Doctor of Medical Science / Kyoto University / DFAM

Les convertisseurs électroniques de puissance sont aujourd’hui très largement utilisés dans tous les domaines de la conversion d’énergie. Ils sont des outils désormais incontournables de tout processus de gestion des transferts de l’énergie électriques depuis les puissances les plus faibles (quelques mW) jusqu’à plusieurs dizaines voire centaines de MW. Le domaine de l’électronique de puissance subit actuellement une double mutation liée aux possibilités offertes par les technologies d’intégration d’une part et l’arrivée de nouveaux composants à semi-conducteur de puissance de type grand-Gap d’autre part.Dans cette thèse supportée par l’ANR, nous avons étudié et évalué les potentialités associées à l’intégration de composants de puissance traditionnels (Silicium) et à base de matériaux grands Gap (GaN). Nous avons, pour cela, développé des procédés de fabrication destinés à l’intégration de composants GaN à structure latérale et de composants Silicium à structure verticale. Le contexte applicatif de cette thèse est celui de l’accroissement du niveau d’électrification dans les avions de nouvelle génération.Pour les composants grand Gap de type GaN à structure latérale (basse tension), nous avons proposé un nouveau procédé de report sur substrat céramique (DBC) et nous avons démontré que cette solution permettait d’améliorer considérablement la gestion thermique de ces composants. Sur la base de ces structures, nous avons également présenté et évalué des méthodes de modélisation permettant la conception de ces dispositifs. Cette modélisation, utilisant des méthodes numériques de type éléments finis ou des méthodes analytiques, traite de deux aspects de la conception : la prédétermination du comportement thermique et la prédétermination du comportement électrique et CEM (en ce qui concerne les aspects conduits)Pour les composants à structures verticales (haute tension), nous avons démontré la faisabilité technologique d’une solution alternative aux packagings traditionnels (assemblage sur DBC et connexion par fils de Bonding). Le process proposé permet, par enterrement des puces dans le PCB, de réaliser une interconnexion 3D permettant de réduire les inductances parasites de boucle très largement dues aux inductances parasites des fils de Bonding. Ceci a pu être démontré sur un prototype de convertisseur complet. Ce procédé d’enterrement des puces s’avère donc particulièrement adapté dans le cas de composants à commutation très rapide. / Power Electronic converters are now widely used in all areas of energy conversion. They are tools that cannot be ignored in any process of managing electrical energy transfers from the lowest powers levels (a few mW) to several tens or even hundreds of MW. Power electronics technologies are currently undergoing a double mutation linked to the possibilities offered by integration technologies on the one hand and the arrival of new Wide-Band-Gap power semiconductor components on the other hand.In this thesis supported by the French ANR, we studied and evaluated the potentialities associated with the integration of traditional power components (Silicon) as well as those based on Wide-Band-Gap materials (GaN). We have developed new technological processes for the integration of GaN components with a lateral structure and silicon components with a vertical structure. The application context of this thesis is linked to the problematic of increasing the level of electrification in new generation of aircrafts.For Wide-Band Gap GaN type power devices with a lateral structure (low voltage), we proposed a new method of device-attachment to a metalized ceramic substrate (DBC) and we demonstrated that this solution made it possible to considerably improve the thermal management of these components. On the basis of these structures, we also presented and evaluated modeling methods allowing the design of the whole packaging. This modeling, using numerical tools based on finite element method or analytical equations, deals with two aspects of the design: the predetermination of the thermal behavior and the predetermination of the electrical and electromagnetic behavior (with regard to the conducted aspects)For components with vertical structures (high voltage), we have demonstrated the technological feasibility of an alternative solution to traditional packaging (assembly on a DBC substrate and electrical connection by wire bonding process). The proposed process allows, by embedding the power dies in the PCB, to carry out a 3D interconnection making it possible to reduce the parasitic loop inductances mainly linked to the parasitic inductances of the bondwires. This has been demonstrated on a converter prototype. Embedding power devices is thus particularly suitable in the case of components with very fast switching capabilities.

Název diplomové práce v anglickém jazyce, abstrakt v anglickém jazyce a 3 klíčová slova v anglickém jazyce NÁZEV V ANGLICKÉM JAZYCE Legal aspects of prevention of generation and recovery of packaging waste KLÍČOVÁ SLOVA V ANGLICKÉM JAZYCE packaging, prevention of generation of packaging waste, circular economy ABSTRAKT V ANGLICKÉM JAZYCE This diploma thesis addresses the legal aspects of packaging and packaging waste with the focus on the prevention of generation of packaging waste. The thesis is devoted to the legislation of packaging, packaging management and packaging waste management. The subject of research is the european legislation (mainly directive 94/62/EC on packaging and packaging waste and directive 2008/98/EC on waste) and Czech legislation based on the european directives (mainly Act No. 477/2001 Coll., on packaging and Act No. 185/2001 Coll., on waste). This legal problematics is undergoing a significant evolution. Higher targets regarding minimisation of packaging waste and more ecologically acceptable ways of managing packaging waste required by european directive amendments and other new conceptual documents (most importantly A new Circular Economy Action Plan) are going to be reflected in the Czech legislation by a new act on packaging, which is being a subject of a legislation process....

Idag sker en snabb ökning av handeln med varor och tjänster över hela världen. Detta ställer krav på att genom förpackningssystem bidra till effektivitet i distributionskanaler. Det vill säga att bygga upp system av förpackningar som möter de krav som ställs hos organisationerna som samverkar för distributionen av varor. Dock finns en bristande kunskap om distributionskanalers uppbyggnad och de krav som ställs vilket leder till problem. För att undvika suboptimeringar krävs en helhetssyn av distributionskanaler. Detta är särskilt viktigt för förpackningssystem som spelar en viktig roll i distributionen av varor. Små problem i systemen kan leda till stora problem genom hela kanalen. Identifieras inte brister längs flödet kan det vara svårt för förpackningsutvecklare att ta fram nya lösningar. Holistiskt belyser examensarbetet förpackningssystemets funktioner och brister i olika distributionskanaler. Genom en vidareutveckling och IT-fierad modell presenteras systemets utförande och tänkbara förbättringsförslag längs hela logistikflödet. Syftet med examensarbetet är att påvisa att en holistisk syn kan bidra till att skapa effektivitet i distributionskanaler. Genom att skapa en modell belysa förpackningssystems bidrag till ett effektivt distributionsflöde, det vill säga flödet genom en kanal. Vidare generera analyserbar data om hur små förändringar på förpackningssystem skulle kunna leda till ökad effektivitet genom hela distributionsflödet. För att svara på de ställda frågorna har litteraturstudier och fallstudier gjorts. För att mäta förpackningssystems effektivitet i distributionskanaler har verktyget Packaging Scorecard utnyttjats. Vidare har IT-baserade verktyg använts. Fallstudier visar att små förändringar kan bidra till effektivt utnyttjande av förpackningssystem i hela distributionskanalen. En vidareutveckling av Packagning Scorecard med tillämpning av CapePack- och CAD-verktyg har resulterat i en ny modell. Resultatet visar att modellen kan bidra till ökad förståelse för hur förpackningssystem kan skapa effektivitet. Genom tillämpning av verktygen CapePack och CAD kan förpackningsrelaterade problem längs distributionskanalen illustreras för vidare analys. Arbetet har bidragit till en verifiering av verktyget och har banat väg för en IT-fiering. / Today the trade with products and services are fast moving on the global market place. This requires that the packaging system should be able to create efficiency in distribution channel. Still there is a lack of knowledge in development of the distribution channel. This leads to problems. A holistic view of the distribution channels is needed to avoid sub optimisations. This is especially important regarding packaging systems that are important for the distribution of goods. Minor problems in the system may lead to major problems in the distribution channel. It can be difficult for the designers of packaging to develop new solutions if insufficiencies are not identified in the distribution flow. The master thesis illustrates a holistic view of the packaging system’s benefit and lack in functionalities in distribution channel. Through development and an IT-fied model the systems implementation and possible proposals of improvements can be done in the distribution flow. The purpose of the master thesis has been to prove that a holistic approach may contribute to an effective distribution flow. It has also been to generate analysable data about how minor changes in packaging systems may lead to increased efficiency through the entire distribution chain. Case studies and Literature studies have been done to find answers to the questions. Packaging Scorecard has been used to measure performance of the packaging systems. Further has an IT based tool been used. The case study shows that minor changes may contribute to efficient usage of packaging systems in the complete distribution channel. Further developments of the Packaging Scorecard applying CapePack and CAD tools have resulted in a new model. The result shows that the model may contribute to increase the understanding of how the packaging systems can create efficiency. Package related problems in the distribution channel can be illustrated and analysed by using the tools CapePack and CAD .The work has contributed to a validation of the tool and also introduction for the use of IT.

Purpose As a result of globalization competition in every business has raised. This makes it imperative to show at most attention towards every part of the business process in a detailed manner. The ratio between the cost of the industrial equipment and the cost expended in packaging and repairing the damages incurred in the logistics of the equipment is very little. As a result, in current practice packaging design is not given substantial attention it deserves. Because of this several manufacturing industries incur expensive losses and degradation of their brand value primarily due of inferior packaging practices. Therefore this thesis focuses on importance of packaging in the industries and its relationship with logistics system. Problem This thesis have answered following research questions 1. How does the interaction happen between the packaging system and other systems in a manufacturing industry? 2. What are the steps that can be taken to establish an effective relationship between packaging and logistics? 3. What are the relevant key performance indicators (KPI) which affects the company’s logistics costs in context with packaging? Methodology Facts and data for this paper were gathered from literature reviews of various articles found in international journals and case studies. In addition semi-structured interviews were conducted with representatives at manufacturing industries. Basically systematic approach and qualitative research are the main two methodology followed. The course of this thesis project was executed during the period of five months at M/s. Delaval International AB, an attempt was made to investigate the effectiveness of different types of packaging solutions that can be adopted to improve the current packaging process. Discussions Below four sections where mainly discussed in this thesis 1. Optimizing logistics by better packaging 2. Increase of packaging logistics knowledge and importance in the entire organization 3. Influence of packaging 4. Information flow and exchange between packaging and logistics systems The basic values of the packaging logistics and the interactions between packaging and logistics where also discussed.

Titel: Förpackningens betydelse - En kvantitativ studie om en förpacknings påverkan på konsumenters köpvilja beroende på färg och form Nivå: Examensarbete på Grundnivå (kandidatexamen) i huvudområdet företagsekonomi. Författare: Lovisa Kallsen Lannerbäck & Fana Hakobian Handledare: Patrik Sörqvist Datum: 2021 - maj Syfte: Syftet med studien är att undersöka hur kombinationen av designelementen färg och form kan påverka konsumenters köpvilja. Metod: Studien antar ett positivistiskt synsätt och en deduktiv ansats. Studien har vidare en kvantitativ strategi och en kvasiexperimentell design. Data har samlats in genom en enkät och har analyserats i statistikprogrammet SPSS.  Resultat & slutsats: Resultatet har visat att det finns en statistisk säkerställd interaktion mellan färg, form och köpvilja. Resultatet har även påvisat att könsidentitet har en effekt på orsakssambandet men inte ålder. Examensarbetets bidrag: Studien har bidragit till det empiriska material som finns gällande preferenser för färg och form, hur färger och former av en förpackning interagerar med varandra samt hur de påverkar konsumenters köpvilja Förslag till fortsatt forskning: Forskning om preferensskillnader mellan olika åldrar, främst för form. Genomföra en liknande studie som inkluderar frågor som tar reda på vilka känslor/tankar respondenterna får från olika stimuli. Eventuellt genomföra en liknande studie men med utökade variabler eller andra variabler helt och hållet. Nyckelord: Förpackning, förpackningsdesign,  konsumentbeteende, köpvilja / Title: The importance of packaging -  a quantitative study of the impact of a package on consumers' willingness to buy depending on colour and shape Level: Student thesis, final assignment for Bachelor Degree in Business Administration. Authors: Lovisa Kallsen Lannerbäck & Fana Hakobian Supervisor: Patrik Sörqvist Date: 2021- May Aim: The purpose of the study is to investigate how the combination of the design elements shape and color can affect consumers' willingness to buy. Method: The study assumes a positivistic research philosophy and a deductive approach. The study also has a quantitative strategy and a quasi-experimental design. Data has been collected through a survey and has been analyzed in the statistical program SPSS. Result & conclusions: The results have shown that there is a statistically significant interaction between color, shape and willingness to buy. The results have also shown that gender identity has an effect on the causal relationship, but age does not.  Contribution of the thesis: The study has contributed to the empirical material that exists regarding preferences for color and shape, how colors and shapes of a package interact with each other and how they affect consumers' willingness to buy.  Suggestions for future research: More research on preference differences between different ages, mainly for shape. Conducting a similar study that includes questions that are intended to find out what feelings/thoughts the respondents have when they are presented with the different designs. Possibly conduct a similar study to this one but with expanded variables or different variables altogether. Key words: Packaging, packaging design, consumer behavior, willingness to buy

The global amount of waste generated by households, including food packaging waste, has been increasing continuously across the world, posing a massive threat to societies and the environment. Proper waste management, therefore, has become a challenging environmental issue and a priority for governments. Along with the technological advances, such as material recovery technologies, more stress has been placed on the strategies for moving away from disposal to waste prevention, separation, and recycling. Considerable efforts are being made to not only limit the overall production and the negative impact of waste on the environment and human health but also to minimize the cost of waste management. Separation of wastes at the source (i.e., source separation) is an integral part of such efforts toward enhancing the purity of collected waste and improving the quality of materials for recycling. Furthermore, sorting of waste as a habitual performance can serve as a practice for improving residents' recycling/sorting behavior. The packaging waste, including food packaging, forms a significant part of the municipal solid waste. The design of food packaging, therefore, has received a lot of attention as a useful tool to influence the consumers' sorting behavior, making it an interesting concept for research related to waste management. Presumably, the design of food packaging can meet consumers' sorting demands while being instructive and facilitating the sorting process, thus enhancing the recycling rate of the food packaging waste. Finding the ideal form of food packaging, however, requires an in-depth understanding of the packaging-consumer interactions throughout the sorting process. Considering the different characteristics of food packaging, it is expected that different food packages tend to influence a consumer in different ways. Nevertheless, the current knowledge is somewhat too general to be used by packaging developers to improve the sorting of the food packaging. Hence, the present thesis aims to provide a more in-depth insight into the influence of food packaging, as a product and service provider, on the consumer's/user's decision-making on sort of food packaging waste. The results assert that packaging to be sorted properly requires proper design to manifest its sorting related abilities such as easy to empty, easy to clean, and easy to fold, for the consumer. Selecting material, visual attributes, form, and function can amplify or reduce these sorting abilities of food packaging.

In mobile and handheld consumer electronic markets, product use conditions drive the requirement for mechanical strength and device durability. The majority of relatively large form factor electronic components in a laptop, mobile internet device, PDA, or mobile phone use an adhesive as a stiffener to help protect the component from physical stresses imposed by daily wear and tear. Described herein is an innovative solution referred to as Solid State Pre-Formed Electronics Adhesive (SPEA), which enables a decrease in circuit board manufacturing throughput time while increasing mechanical durability with a consistent and characterized adhesive application process. Today, many consumer electronic ODM's (Original Design Manufacturers) and CM's (Contract Manufacturers) use a liquid adhesive dispensed after placement of an electronic component within the SMT (Surface Mount Technology) process. On average, this adds up to 60 seconds to the throughput time of a typical motherboard as the material needs to be applied and then cured. In addition, the current adhesive dispense application process is not tightly controlled and is highly variable depending on operator, material type, and circuit board density. Data will demonstrate that the effect of the adhesive deposition profile and consistency in application directly affects repeatable margin increase gains in a dynamic stress event. In partnership with a specialty chemical company, a unique thermoset epoxy compound was designed to provide maximum component to circuit board interconnect strength while maintaining its form at ambient temperatures. When applied to electronics manufacturing, the compound has the following advantages over current solutions: 1. Reduced Manufacturing Processing Time: Enables a solution that can be transitioned transparently into a circuit board manufacturing facility which reduces the average processing time for a typical device motherboard. 2. Improved Application Repeatability: Enables a solution that increases adhesive deposition consistency and placement repeatability, critical in achieving improved dynamic performance. 3. Delivers a Reference, Characterized Solution: Current industry adhesive application techniques and materials vary widely and component manufacturers cannot validate reliability performance with a confident baseline. This is due to the high variability of performance in commercially available adhesives. SPEA provides a characterized adhesive solution with a clear baseline margin increase on which to evaluate dynamically stressed system performance. The need to continually increase the resistance to component damage through dynamic testing is a critical aspect to consider given market trends and device roadmaps. Large component manufacturers have the opportunity to further embed themselves into untapped markets where portability and performance converge and drive the need for more robust packaging solutions. The development and application of SPEA will continue to maintain silicon and packaging reliability as consumer devices continue to shrink, becoming ever more portable.

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