Células transformadas de E.coli DH5-&#945; expressando a proteína verde fluorescente (GFPuv, pico de excitação e emissão de 394nm e 509nm) foram submetidas a extração pelo método de partição de três fases (TPP) e o extrato obtido purificado por cromatografia de interação hidrofóbica (HIC). O objetivo principal deste trabalho foi estudar a termoestabilidade da GFPuv extraída, para avaliar a sua possível utilização como indicador biológico econômico, de resposta rápida e precisa para processos térmicos de esterilização utilizando o calor úmido. A estabilidade térmica da proteína foi estudada em diferentes soluções-tampão (acetato, fosfato e tris-HCI 10mM) no intervalo de valor de pH de 5,O a 9,0 e, em temperaturas entre 75&#176; e 95&#176;C. Os parâmetros de resistência térmica determinados foram: o tempo de redução decimal (Valor D - min), valor z (&#176;C), coeficiente Q10 e valor de energia de ativação (kcal/mol). A termoestabilidade da GFPuv, expressa em valor D, mostrou correlação linear para valores de pH &#8805; 5,50, em tampão acetato. Em tampão fosfato, para valores de pH &#8805; 7,50 a estabilidade térmica da proteína foi independente do valor de pH da solução. Em tampão tris-HCI, o valor D mostrou-se inconstante ao aumento do valor de pH da solução. No intervalo de temperatura estudada, em tampão acetato a GFPuv apresentou melhor termoestabilidade (Ea de 19,27 kcal/mol) do que em tampão fosfato (Ea de 26,18 kcal/mol ao valor de pH 6,S) e em tampão tris-HCI (Ea 28,19 kcallmol ao valor de pH 7,0). Em tampão acetato e tris-HCI ao valor de pH 7,0, a termoestabilidade da proteína mostrou-se equivalente. Entretanto, em tampão fosfato aos valores de pH 7,5 e 8,0 e em tampão tris-HCI aos valores de pH 8,0 e 8,5 a GFPuv apresentou menor estabilidade térmica A GFPuv apresenta potencialidade para ser utilizada como indicador biológico em processos térmicos que utilizam calor úmido às temperaturas inferiores a 100°C. / Transformed cells of Escheríchía coli DH5-&#945; expressing recombinant green fluorescent protein (GFPuv, excitation and emission peaks at 394nm and 509nm), were subjected to the three-phase partitioning (TPP) method and the release extracts were eluted through methyl HIC column with a buffer solution (10 mM Tris-HCI, 10mM EDTA, pH=8.0). The purpose of this work was to study the thermal stability of the TPP-extracted recombinant protein, GFPuv, to determine its utility as a quick, accurate and economical biological indicator for moist heat-treatments. The thermal stability of the extracted GFPuv was studied in different buffer solutions (acetate, phosphate and tris-HCI 10mM) in the range of pH between 5.0 and 9.0 and at temperature between 75-95°C. The thermal resistance parameters determinated were: decimal reduction times (D-values, min), z-value (&#1776C), Q<sub<10 coefficient and Activation Energy (Ea, Kcal/mol). The thermal stability of GFPuv, expressed in D-values, showed linear correlation for pH &#8805; 5.50 in acetate buffer. In phosphate buffer, for pH &#8805; 7.50 the thermal stability was independent of pH value. In tris-HCI buffer the D-value was shown variable with the increase of pH value. In the studied temperature range, the acetate buffer at pH 6.0 presented better thermal stability for GFPuv (Ea 19.27kcal/mol) than phosphate (Ea 26.18 kcal/mol at pH 6.5) and tris-HCI buffer (Ea 28.19 kcal/mol at pH 7.0). In acetate and tris-HCI buffers at pH 7.0, GFPuv showed equivalent thermal stability. However, GFPuv showed lower thermal stability in phosphate buffer at pH 7.5 and 8.0 and in tris-HCI buffer at pH 8.0 and 8.5. The TPP-extracted GFPuv has great potential to be applied as a biological indicator in moist heat processes at temperatures below 100°C.

Células transformadas de E.coli DH5-&#945; expressando a proteína verde fluorescente (GFPuv, pico de excitação e emissão de 394nm e 509nm) foram submetidas a extração pelo método de partição de três fases (TPP) e o extrato obtido purificado por cromatografia de interação hidrofóbica (HIC). O objetivo principal deste trabalho foi estudar a termoestabilidade da GFPuv extraída, para avaliar a sua possível utilização como indicador biológico econômico, de resposta rápida e precisa para processos térmicos de esterilização utilizando o calor úmido. A estabilidade térmica da proteína foi estudada em diferentes soluções-tampão (acetato, fosfato e tris-HCI 10mM) no intervalo de valor de pH de 5,O a 9,0 e, em temperaturas entre 75&#176; e 95&#176;C. Os parâmetros de resistência térmica determinados foram: o tempo de redução decimal (Valor D - min), valor z (&#176;C), coeficiente Q10 e valor de energia de ativação (kcal/mol). A termoestabilidade da GFPuv, expressa em valor D, mostrou correlação linear para valores de pH &#8805; 5,50, em tampão acetato. Em tampão fosfato, para valores de pH &#8805; 7,50 a estabilidade térmica da proteína foi independente do valor de pH da solução. Em tampão tris-HCI, o valor D mostrou-se inconstante ao aumento do valor de pH da solução. No intervalo de temperatura estudada, em tampão acetato a GFPuv apresentou melhor termoestabilidade (Ea de 19,27 kcal/mol) do que em tampão fosfato (Ea de 26,18 kcal/mol ao valor de pH 6,S) e em tampão tris-HCI (Ea 28,19 kcallmol ao valor de pH 7,0). Em tampão acetato e tris-HCI ao valor de pH 7,0, a termoestabilidade da proteína mostrou-se equivalente. Entretanto, em tampão fosfato aos valores de pH 7,5 e 8,0 e em tampão tris-HCI aos valores de pH 8,0 e 8,5 a GFPuv apresentou menor estabilidade térmica A GFPuv apresenta potencialidade para ser utilizada como indicador biológico em processos térmicos que utilizam calor úmido às temperaturas inferiores a 100°C. / Transformed cells of Escheríchía coli DH5-&#945; expressing recombinant green fluorescent protein (GFPuv, excitation and emission peaks at 394nm and 509nm), were subjected to the three-phase partitioning (TPP) method and the release extracts were eluted through methyl HIC column with a buffer solution (10 mM Tris-HCI, 10mM EDTA, pH=8.0). The purpose of this work was to study the thermal stability of the TPP-extracted recombinant protein, GFPuv, to determine its utility as a quick, accurate and economical biological indicator for moist heat-treatments. The thermal stability of the extracted GFPuv was studied in different buffer solutions (acetate, phosphate and tris-HCI 10mM) in the range of pH between 5.0 and 9.0 and at temperature between 75-95°C. The thermal resistance parameters determinated were: decimal reduction times (D-values, min), z-value (&#1776C), Q<sub<10 coefficient and Activation Energy (Ea, Kcal/mol). The thermal stability of GFPuv, expressed in D-values, showed linear correlation for pH &#8805; 5.50 in acetate buffer. In phosphate buffer, for pH &#8805; 7.50 the thermal stability was independent of pH value. In tris-HCI buffer the D-value was shown variable with the increase of pH value. In the studied temperature range, the acetate buffer at pH 6.0 presented better thermal stability for GFPuv (Ea 19.27kcal/mol) than phosphate (Ea 26.18 kcal/mol at pH 6.5) and tris-HCI buffer (Ea 28.19 kcal/mol at pH 7.0). In acetate and tris-HCI buffers at pH 7.0, GFPuv showed equivalent thermal stability. However, GFPuv showed lower thermal stability in phosphate buffer at pH 7.5 and 8.0 and in tris-HCI buffer at pH 8.0 and 8.5. The TPP-extracted GFPuv has great potential to be applied as a biological indicator in moist heat processes at temperatures below 100°C.

Accurate transistor models are important in wireless and microwave circuit design. Large-signal field-effect transistor (FET) models are generally extracted from current-voltage (IV) characteristics, small-signal S-parameters, and large-signal measurements. This dissertation describes improved characterization and measurement validation techniques for FET models that correctly account for thermal and trapping effects. Demonstration of a customized pulsed-bias, pulsed-RF S-parameter system constructed by the author using a traditional vector network analyzer is presented, along with the design of special bias tees to allow pulsing of the bias voltages. Pulsed IV and pulsed-bias S-parameter measurements can provide results that are electrodynamically accurate; that is, thermal and trapping effects in the measurements are similar to those of radio-frequency or microwave operation at a desired quiescent bias point. The custom pulsed S-parameter system is benchmarked using passive devices and advantages and tradeoffs of pulsed S-parameter measurements are explored. Pulsed- and continuous-bias measurement results for a high-power transistor are used to validate thermal S-parameter correction procedures. A new implementation of the steepest-ascent search algorithm for load-pull is presented. This algorithm provides for high-resolution determination of the maximum power and associated load impedance using a small number of measured or simulated reflection-coefficient states. To perform a more thorough nonlinear model validation, it is often desired to find the impedance providing maximum output power or efficiency over variations of a parameter such as drain voltage, input power, or process variation. The new algorithm enables this type of validation that is otherwise extremely tedious or impractical with traditional load-pull. A modified nonlinear FET model is presented in this work that allows characterization of both thermal and trapping effects. New parameters and equation terms providing a trapping-related quiescent-bias dependence have been added to a popular nonlinear ("Angelov") model. A systematic method for fitting the quiescent-dependence parameters, temperature coefficients, and thermal resistance is presented, using a GaN high electron-mobility transistor as an example. The thermal resistance providing a good fit in the modeling procedure is shown to correspond well with infrared measurement results.

En microélectronique, plusieurs tendances telles que l'empilement 3D et l'amincissement de puces amènent des défis thermiques grandissants. Ces défis sont exacerbés lorsqu'appliqués aux appareils mobiles où l'espace et la puissance disponibles pour le refroidissement sont limités. Le but de cette thèse est de développer des outils de conception et méthodes d'implémentation de microcanaux pour le refroidissement microfluidique de puces 2D et 3D avec points chauds destinés aux appareils mobiles.Une méthode de conception pour optimiser la configuration des microcanaux refroidissant une puce est développée utilisant un plan d'expériences numériques. La configuration optimisée propose le refroidissement à une température maximale de 89 °C d'un point chaud de 2 W par un écoulement où la perte de charge est plus petit que 1 kPa. Des prototypes avec différents empilements et distributions de microcanaux sont fabriqués par gravure profonde et apposés par pick-and-place. Un banc de caractérisation et une puce thermique test sont fabriqués pour caractériser expérimentalement les prototypes de refroidissement avec différentes configurations. Un prototype avec microcanaux limités aux alentours des points chauds et reportés sur la face arrière de la puce test atteint une résistance thermique de 2.8 °C/W. Cela est réalisé avec un débit de 9.4 ml/min et des pertes de charges de 19.2 kPa, soit une puissance hydraulique de 3 mW. Ce refroidissement extrait 7.3 W générés sur un seul serpentin à un flux thermique de 1 185 W/cm² pour un coefficient de performance de 2 430. Les résultats de l'optimisation suggèrent que la dissipation thermique soit exploitée en ajoutant des microcanaux en parallèle, plutôt qu'en allongeant les microcanaux. On observe expérimentalement comme numériquement que la résistance liée à la hausse de température du fluide domine la résistance totale. Enfin, il apparaît que les différents empilements ont un effet plus important sur la résistance thermique que les distributions de microcanaux dans les plages observées. / In microelectronics, trends such as 3D stacking and die thinning bring major thermal challenges. Those challenges are exacerbated when applied to mobile devices where the available space and power for cooling are limited. This thesis aims at developing design tools and implementation techniques for microchannels cooling on 2D and 3D chips with hot spots for mobile devices. A design technique to optimize the microchannel configuration for chip cooling is developed using numerical experimentation plans. The optimized configuration suggests a cooling configuration reaching a maximum temperature of 89 °C on a 2 W hot spot, using a flow at a pressure drop plus petit que 1 kPa. Prototypes with different stacking and microchannel distributions are fabricated using deep reactive ion etching process and stacked using pick-and-place technique. A characterization bench and a thermal test chip are fabricated for experimental characterization of the cooling prototypes from various configurations. A prototype with microchannel zones limited to the hot spot vicinity and installed on the backside of the test chip reached a thermal resistance of 2.8 °C/W. This performance is achieved using a flow rate of 9.4 ml/min with a pressure drop of 19.2 kPa, representing a hydraulic power of 3 mW. Such cooling removes 7.3 W generated on a single heat source, representing a heat flux of 1 185 W/cm² for a coefficient of performance of 2 430. The optimization results suggest that the heat spreading is better exploited using parallel microchannels, rather than lengthen microchannels. It is both observed experimentally and numerically that the thermal resistance related to the fluid temperature rise is the major contribution to the total thermal resistance. Finally, it appears that the different stacking effects on thermal resistance are more important than the microchannels distributions in the observed ranges.

La caractérisation thermique est cruciale pour la conception et le développement d'applications critiques dans divers domaines. Elle trouve son utilisation dans la détection de défauts et de points chauds dans la fabrication de semi-conducteurs, l'imagerie sous-sol ainsi que la recherche de transport thermique et de charge à des longueurs inférieures à 100 nm. La capacité de comprendre et de contrôler les propriétés thermiques des nanostructures à un niveau de sous-micron est essentielle pour obtenir les performances souhaitées. Pour atteindre cet objectif, la microscopie thermique à balayage (SThM) est très bien adaptée pour cartographier la conductivité thermique à la surface des matériaux et des appareils à l'échelle nanométrique.SThM est une technique d'imagerie "champ proche". C'est une méthode de contact, la sondeétant en contact avec la surface à une force contrôlée. STHM utilise une structure cantilever identique à celle des sondes utilisées dans un Microscope à Force Atomique (AFM). La principale différence est le fait qu'un capteur thermique est intégré à la pointe de la sonde. En outre, ce capteur peut également être utilisé comme chauffage dans le cas d'éléments thermorésistants tels que Pt ou Pd. Par conséquent, le SThM est le résultat d'un AFM équipé d'une sonde thermique. Cet instrument fournit une résolution sous-micromètre dans la résolution spatiale, c'est-à-dire plus que la résolution des techniques optiques dans la gamme de longueurs d'onde visible. La résolution classique qui est réalisée de nos jours est de l'ordre de moins de 100nanomètres alors que celle obtenue avec la première sonde Wollaston était environ 10 fois plus élevée.Par conséquent, mesurer la température et les propriétés thermiques de la matière à la microscales ont deux objectifs difficiles qui ont monopolisé l'énergie et le temps de nombreux chercheurs partout dans le monde depuis plusieurs décennies. Ces deux objectifs ne sont pas similaires. Tout d'abord, la mesure d'une température dans un domaine dont la dimension caractéristique est inférieure au micromètre semble moins difficile que mesurer la conductivité thermique d'un matériau à cette échelle. [...] / The objective of this thesis is to master quantitative aspects when using nearfield thermal microscopy by using the scanning thermal microscopy technique (SThM). We start by taking an in-depth look into the work performed previously by other scientist and research organizations. From there, we understand the progress the SThM probes have made through the decades, understand the probe sensitivity to the range of conductivity of the materials under investigation, verify the resistances encountered when the probe comes in contact with the sampl and the applications of SThM.Then we look into the equipment necessary for performing tests to characterize material thermal properties. The SThM we use is based on atomic force microscope (AFM) with a thermal probe attached at the end. The AFM is described in this work along with the probes we have utilized.For the purpose of our work, we are only using thermoresistive probes that play the role of the heater and the thermometer. These probes allow us to obtain sample temperature and thermalconductivity. We use two different types of thermal probes – 2-point probe and 4-point probe with SiO2 or with Si3N4 cantilever. Both the probes are very similar when it comes to functioning with the major difference being that the 4-point probe doesn’t have current limiters. Then, we present the use of recent heat-resistive probes allowing to reach a spatial resolution of the orde rof 100 nm under atmosphere and of 30 nm under vacuum. These probes can be used in passive mode for measuring the temperature at the surface of a material or component and in activemode for the determination of the thermal properties of these systems. Using thermoresistive probes means that no specialized devices are necessary for operation. Using simple commercialsolutions like simple AC or DC current and Wheatstone bridge are sufficient to provide basic thermal images. In our case we have also utilized other industrial devices and a home madeSThM setup to further improve the quality of measurement and accuracy. All the elements of the experimental setup have been connected using GPIB and that have been remotely controlled from a computer using a code developed under Python language. This code allows to make the frequency dependent measurement as well as the probe calibration. [...]

O Brasil é um dos maiores produtores mundiais de suco de laranja, da mesma forma que a produção é elevada, a geração de resíduos também é significativa. Sabe-se que estes resíduos, os quais incluem sementes, cascas e restos de polpa são ricos em nutrientes que poderiam ser utilizados como substrato por micro-organismos, seja para o crescimento ou para a obtenção de subprodutos. Esporos de Bacillus atrophaeus ATCC 9372 são utilizados como indicadores biológicos, IBs, em processos térmicos por formarem esporos termorresistentes. O objetivo deste trabalho foi avaliar o uso de resíduos do processamento de suco de laranja como um meio de cultura alternativo para obtenção de esporos de B. atrophaeus, para serem aplicados em processos industriais. Ao bagaço de laranja (de 1,0 g a 20,0 g), obtido por processamento em centrífuga de frutas, foram adicionados 100 mL de água, e incubados a 150 rpm / 37 ºC por até 6 dias. Evidenciada a viabilidade de crescimento celular (&#181;máx = 0,0238 h-1 e Px = 0,0787 g/L.h, para 5,0 g de bagaço) procedeu-se ao estudo de planejamento experimental fatorial 22 em formato estrela com 6 pontos centrais, considerando a concentração de bagaço e o volume de meio. Foram determinados os valores de pH, de biomassa, de esporos viáveis e a resistência térmica dos mesmos a 102 ºC. Observou-se que houve aumento nos valores de pH após o cultivo e que as maiores concentrações de esporos foram de 1,73 x 109 esporos /mL e 5,75 x 109 esporos /mL após 3 e 6 dias de cultivo e os tempos de redução decimal determinados variaram de D102C = 0,92 min a D102C = 2,71 min e de D102C = 1,34 min a D102C = 3,98 min após 3 e 6 dias de cultivo, respectivamente. Com base no planejamento proposto e a análise de regressão, o desenvolvimento de esporos em bagaço segue a relação: Esporos = {-1,15 + 0,0303* [bagaço (g)] - 0,00611* [volume (mL)] + 0,611* [tempo (dias)]}, p=0,000, R2 =0,452, sendo o tempo (p=0,000) o fator de maior influência na formação de esporos. Os meios preparados com bagaço de laranja apresentaram-se viáveis para a produção de esporos de B. atrophaeus termorresistentes, produto de interesse farmacêutico e industrial, agregando valor ao resíduo que seria descartado. / Brazil is one of the world´s largest producers of oranges juice, in the same way that the production is high the amount of generated waste is also significant. It is well known that these residues, which include seeds, peel and pulp, are rich in nutrients that could be used as substrate by microorganisms whether for growth or for obtaining by-products. Bacillus atrophaeus ATCC 9372 spores are used as biological indicators, BIs, in thermal processes due to their ability to form heat-resistant spores. This study aimed to evaluate the use of orange juice processing waste as an alternative culture media to obtain B. atrophaeus spores, to be applied in industrial processes. To orange\'s bagasse (from 1.0 g to 20.0 g), obtained by processing in a fruit\'s centrifuge, 100 mL of water was added, and sterilized at 121 ºC. An aliquot of 0.1g/L of Bacillus atrophaeus spores was inoculated to bagasses\'s media and incubated at 150 rpm / 37 ºC up to 6 days. As cells (&#181;máx = 0.0238 h-1 and Px = 0.0787 g/L.h, for 5.0 g of bagasse) were obtained, a factorial experimental design 22, with star-shaped model and 6 central points, was performed considering the bagasse concentration and the media volume used. Values of pH, biomass, viable spores and their thermal resistance at 102 ºC were determined. It was observed that pH increased after cultivation and major values of spore concentration achieved were 1.73 x 109 spores /mL and 5.75 x 109 spores /mL after 3 and 6 days, respectively. Decimal reduction times determined ranged from D102C = 0.92 min to D102C = 2.71 min and from D102C = 1.34 min to D102C = 3.98 min after 3 and 6 days of incubation, correspondingly. The regression analysis showed that the development of spores in bagasse can be defined by the equation: Spores = , p=0.000, R2 =0.452 and time has a positive influence in the spore formation. Results demonstrated media prepared with oranges\' bagasse were capable to grow and to develop B. atrophaeus heat-resistant spores, being an alternative to add value to a waste that would be discarded, generating a product of great importance in the pharmaceutical field.

Les environnements ont tendance à être plus sévères (plus chauds et quelquefois plus froids). À ce titre, l’électronique de puissance haute température est un enjeu majeur pour le futur. Concernant les technologies d’assemblage à haute température, les brasures haute température comme l'alliage 88Au/12Ge, 97Au/3Si et 5Sn/95Pb pourraient supporter ces niveaux de contraintes thermiques, qui sont actuellement développées pour répondre à ces exigences. Nous avons effectué les caractérisations électriques, mécaniques et thermomécaniques des matériaux d’assemblage. Une étude thermique a réalisée par des méthodes expérimentales et des simulations numériques, l’étude numérique est réalisée sous ANSYS dans le but d’estimer les influences des différents paramètres sur la performance thermique de l’assemblage. En plus, les cyclages thermiques passif de grande amplitude sont effectués pour analyser la fiabilité des modules de puissance dans ces conditions d’utilisation. / The environments tend to be more severe (hotter and sometimes colder). As such, the high temperature power electronics is a major challenge for the future. Concerning the technologies for high temperature assembly, high temperature brazing alloy as 88Au / 12Ge, 97Au / 3Si and 5Sn / 95Pb could support these levels of thermal stresses, which are being developed to answer these requirements. We performed the electric, mechanical and thermomechanical characterizations for the materials of assembly. A thermal study was realized by experimental methods and numerical simulations, the numerical study is carried out in ANSYS in order to estimate the influences of the various parameters on the thermal performance of the assembly. In addition, the passive thermal cycles of large amplitude are conducted to analyze the reliability of the power modules in these conditions.

L’amortisseur thermique étudié dans le cadre de cette thèse a pour objectif de limiter les pics de température des composants électroniques fonctionnant en régime transitoire au moyen d’une structure composite consistant en un réseau de nanotubes de carbone (NTC) rempli de matériau à changement de phase (MCP) solide-liquide, le tout étant contenu dans un boîtier en silicium (Si). Ce système passif vise à augmenter l’inertie thermique volumique du composant grâce à la chaleur latente du MCP tout en maintenant une bonne conductance thermique grâce aux NTC. Un dispositif expérimental polyvalent a été développé spécifiquement pour caractériser les différentes générations d’échantillons fabriqués par les partenaires du projet THERMA3D. L’excitation thermique de l’échantillon est réalisée au moyen d’un laser en face amont et la réponse thermique est mesurée par caméra infrarouge simultanément sur les faces amont et aval. L’application d’une peinture sélectionnée sur l’échantillon permet d’accéder à sa température après un étalonnage dédié. Des méthodes d’estimation de paramètres ont été développées pour quantifier les deux caractéristiques essentielles de l’amortisseur thermique que sont sa capacité de stockage thermique et sa résistance thermique. Les sensibilités de la résistance thermique aux caractéristiques de la connexion Si/NTC et à la longueur des NTC ont été étudiées et les résistances thermiques d’interface Si/NTC ont été identifiées comme dominantes au sein du système. Des essais de cyclage thermique ont permis d’évaluer la fiabilité de l’ensemble de manière accélérée. Le comportement du MCP et la qualité du matériau de scellement ont été analysés par voie optique. Par ailleurs, la plus élevée des deux résistances thermiques d’interface Si/NTC a été localisée grâce à la visualisation infrarouge du réseau de NTC à travers le silicium semi-transparent. Enfin, une méthode de contrôle non destructif de la qualité de l’interface Si/NTC a été développée pour les amortisseurs thermiques de dernière génération. / The purpose of the studied thermal damper is to smooth the temperature peaks of transient electronic components via a composite structure consisting of an array of carbon nanotubes (CNT) filled with solid-liquid phase change material (PCM), the whole being embedded in a silicon (Si) casing. This passive system is intended to increase the thermal inertia per unit of volume of the electronic component thanks to the latent heat of the PCM while maintaining a high thermal conductance thanks to the CNT. A versatile test bench was specifically developed in order to characterize the different generations of samples fabricated by the partners of the THERMA3D project. The thermal excitation of the front side of the sample is generated by a laser and the thermal response is measured simultaneously on the front and back sides by an infrared camera. A selected paint can be deposited on the sample in order to access its temperature by means of a dedicated calibration. Parameter estimation methods were developed in order to quantify both main characteristics of the thermal damper: its heat storage capacity and its thermal resistance. The sensitivities of the thermal resistance to the features of the Si/CNT connection and to the length of the CNT were studied and it was found out that the interfacial thermal resistances Si/CNT are dominant in the system. Thermal cycling tests enabled to assess the reliability of the thermal damper in an accelerated manner. The behavior of the PCM and the quality of the sealing material were optically analyzed. Besides, the infrared visualization of the CNT array through the semi-transparent silicon enabled to identify the highest of both Si/CNT interfacial thermal resistances. Finally, a non-destructive testing method for the evaluation of the quality of Si/CNT interfaces was developed for the latest generation of thermal dampers.

The first part of this thesis deals with the study of linear motors. The introduction of the thesis deals with the brief description of the linear motor, including its accessories. This part explains principle of linear motors, their general advantages and disadvantages. The next section contains an overview and division of the currently used linear motors. The second part deals with the theoretical description of forms of heat transfer. The third part of the thesis deals with the design of an equivalent thermal circuit model of a linear iron-core linear motor with permanent magnet. Hereafter, the proposed design will be used to calculate the temperatures of the individual motor units. The temperatures are later compared with the results obtained with finite element method.

This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.