A novel modification to the standard cascode amplifier architecture is presented in SiGe which allows for an optimal separation of gain and breakdown functions through the mixed breakdown cascade architecture, opening the door for moderate power amplifiers in SiGe. Utilizing this technique, a two-stage, high-gain amplifier operating at X-Band is fabricated and measured. The 20 dB of gain per stage represents the highest gain at X-Band at the time of publication. Additionally, a near one Watt power amplifier is designed and fabricated at X-Band, which represents the highest output power in SiGe at X-Band at time of publication. Related to the power amplifier design, thermal considerations are also investigated. The validity of utilizing lumped mutual thermal coupling in SiGe devices is presented. Using this finding, a thermal coupling model and network which are compliant for use with commonly available HBT models and circuit simulators is presented. This model and network is used to thermally optimize SiGe PA cells based upon layout spacing.

Orientador: Alberto Martins Jorge / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-09T08:44:01Z (GMT). No. of bitstreams: 1 MingotoJunior_CarlosRoberto_M.pdf: 657421 bytes, checksum: dc6ef4bc58fb70a90293781871a969c6 (MD5) Previous issue date: 2005 / Resumo: Os circuitos quaternários são uma alternativa para o processamento das informações, que, atualmente, acontece de forma binária. Ainda em fase de definições, a lógica multivalores mostra-se como um campo de pesquisas que pode auxiliar a busca pelo incremento de desempenho e redução de área de ocupação dos transistores de um circuito integrado. A lógica multi-valores utilizando-se de quatro dígitos na representação das informações é a lógica quaternária. Neste trabalho são propostos alguns blocos básicos de circuitos eletrônicos quaternários que, progressivamente, são aglutinados formando blocos mais complexos para finalmente construir-se um circuito meio-somador, um somador completo e um multiplicador quaternários. As montagens são feitas e testadas em simulador de circuitos eletrônicos e operam em modo corrente com transistores bipolares NPN e PNP / Abstract: The quaternary circuits are an alternative to data processing that, nowadays, occurs in a binary way. Still in a definition stage, the multiple-valued logic seems to be a research area to aid the increase of performance and reduction of area of the transistors inside an integrated circuit. The multiple-valued logic using four digits to represent the data is called quaternary logic. In this work are proposed some basic blocks of electronic quaternary circuit which are progressively joined to become more complex blocks and finally a half-adder, a full adder and a multiplier. The configurations are done and evaluated in a circuit simulator operating in a current-mode with bipolar NPN and PNP transistors / Mestrado / Eletrônica, Microeletrônica e Optoeletrônica / Mestre em Engenharia Elétrica

Orientador: Elnatan Chagas Ferreira / Texto em inglês / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação / Made available in DSpace on 2018-08-20T11:54:01Z (GMT). No. of bitstreams: 1 Dias_PedroCarvalhaes_M.pdf: 7362254 bytes, checksum: dd839cf652cbbda17a2a5d9b6cecbdc3 (MD5) Previous issue date: 2012 / Resumo: A constante preocupação em aumentar a produtividade das plantações de uma forma sustentável e otimizando o uso dos insumos agrícolas (água, fertilizantes, pesticidas e produtos para correção do PH) levou ao desenvolvimento da agricultura de precisão, que permite determinar a quantidade correta de insumos para cada região do solo (tipicamente um hectare), evitando o desperdício. Sensores de umidade de solo de baixo custo e fácil aplicação no campo são fundamentais para permitir um controle preciso da atividade de irrigação, sendo que os sensores que melhor atendem estes requisitos são os chamados sensores de dissipação de calor ou sensores de transferência de calor. Estes sensores, entretanto, apresentam um problema de baixa sensibilidade na faixa de umidade mais importante para as plantas (umidade de solo 'teta'v variando entre 5% e 35%), pois, para cobrir esta variação de 30% em 'teta'v com resolução de 1%, é necessário medir variações de temperatura de aproximadamente 0,026 ºC nos sensores de pulso de calor a duas pontas e 0,05 ºC para os sensores de pulso de calor de ponta simples. Neste trabalho foi desenvolvido um novo sensor de umidade de solo do tipo pulso de calor de ponta simples, baseado em um único elemento: um transistor bipolar de junção npn, que é usado tanto como aquecedor e como sensor de temperatura de alta precisão. Resultados experimentais, obtidos em medidas realizadas através de uma técnica de interrogação especialmente desenvolvida para este novo sensor mostram que neste trabalho foi possível obter uma sensibilidade cerca de uma ordem de grandeza maior do que nos sensores de pulso de calor com uma ponta e cerca de 20 vezes maior do que nos sensores de pulso de calor de duas pontas. Outra vantagem da técnica desenvolvida é que o aumento da sensibilidade não é obtido às custas do aumento da corrente drenada da bateria para aquecer o sensor. No sensor desenvolvido é utilizada uma corrente de apenas 6 mA para gerar o aquecimento (com energia dissipada de 1,5 J), enquanto que que os sensores de pulso de calor com ponta simples requerem cerca de 50 mA (com 2,4 J de energia dissipada) para operar. Os sensores de pulso de calor de ponta dupla também são fabricados com resistores que requerem cerca de 50 mA para o aquecimento (0.8 J de energia dissipada) para operar corretamente / Abstract: The concern regarding sustainable development and crop inputs optimization (such as water, fertilizers, pesticides and soil PH correction products) has led to the development of the precision agriculture concept, that allows to determine the exact amount of each input required on each ground section (typically one hectare), avoiding waste of inputs. Low-cost and easily handled soil moisture sensors are very important for allowing a precise irrigation control. The class of sensors which fulfill those requirements are the heat transfer sensors, where there are basically two types of devices: dual (or multi) probe heat pulse sensors and single probe heat pulse sensors. However, these sensors have a low sensitivity in the most important range of soil humidity 'teta'v for plants (usually from 5% ? 'teta'v ? 35%). To cover this 30% soil humidity range with 1% resolution it is necessary to measure temperature with a resolution of 0,026 ºC in the dual/multi probe heat pulse sensors and 0,05 ºC in the single probe heat pulse sensor. In this work it was developed a new type of single probe heat pulse sensor, comprised of a single element: an npn junction bipolar transistor, that plays the role of both the heating element and a high accuracy temperature sensor. Experimental results, obtained through an interrogation technique especially developed for this sensor, show sensitivity about one order of magnitude greater than the typical sensitivity of the single probe heat pulse sensors and 20 times greater than dual probe heat pulse sensors. Another great advantage of the developed interrogation technique is that the increase in sensibility is not obtained through a higher current being drained from the batteries that power the sensor. The developed sensor operates at a much lower current level than the other sensors, draining only 6 mA from the battery (with an energy of 150 mW). The single probe heat pulse sensor requires 50 mA and 1.5 J of energy to operate, whilst the dual probe heat pulse sensors are manufactured with resistors which also drain 50 mA from the battery with 0.8 J of dissipated energy / Mestrado / Eletrônica, Microeletrônica e Optoeletrônica / Mestre em Engenharia Elétrica

Recent years have shown real advances of microwave monolithic integrated circuits (MMICs) for millimeter-wave frequency systems, such as wireless communication, advanced imaging, remote sensing and automotive radar systems, as MMICs can provide the size, weight and performance required for these systems. Traditionally, GaAs pseudomorphic high electron mobility transistor (pHEMT) or InP based MMIC technology has dominated in millimeter-wave frequency applications because of their high fT and fmax as well as their superior noise performance. But these technologies are very expensive. Thus, for low cost and high performance applications, InGaP/GaAs heterojunction bipolar transistors (HBTs) are quickly becoming the preferred technology to be used due to their inherently excellent characteristics. These features, together with the need for only one power supply to bias the device, make InGaP/GaAs HBTs very attractive for the design of high performance fully integrated MMICs. With the smaller dimensions for improving speed and functionality of InGaP/GaAs HBTs, which dissipate large amount of power and result in heat flux accumulated in the device junction, technology reliability issues are the first concern for the commercialization. As the thermally triggered instabilities often seen in InGaP/GaAs HBTs, a carefully derived technique to define the stress conditions of accelerated life test has been employed in our study to acquire post-stress device characteristics for the projection of long-term device performance degradation pattern. To identify the possible origins of the post-stress device behaviors observed experimentally, a two iv dimensional (2-D) TCAD numerical device simulation has been carried out. Using this approach, it is suggested that the acceptor-type trapping states located in the emitter bulk are responsible for the commonly seen post-stress base current instability over the moderate base-emitter voltage region. HBT-based MMIC performance is very sensitive to the variation of core device characteristics and the reliability issues put the limit on its radio frequency (RF) behaviors. While many researchers have reported the observed stress-induced degradations of GaAs HBT characteristics, there has been little published data on the full understanding of stress impact on the GaAs HBTbased MMICs. If care is not taken to understand this issue, stress-induced degradation paths can lead to built-in circuit failure during regular operations. However, detection of this failure may be difficult due to the circuit complexity and lead to erroneous data or output conditions. Thus, a practical and analytical methodology has been developed to predict the stress impacts on HBTbased MMICs. It provides a quick way and guidance for the RF design engineer to evaluate the circuit performance with reliability considerations. Using the present existing EDA tools (Cadance SpectreRF and Agilent ADS) with the extracted pre- and post-stress transistor models, the electrothermal stress effects on InGaP/GaAs HBT-based RF building blocks including power amplifier (PA), low-noise amplifier (LNA) and oscillator have been systematically evaluated. This provides a potential way for the RF/microwave industry to save tens of millions of dollars annually in testing costs. v The world now stands at the threshold of the age of advanced GaAs HBT MMIC technology and researchers have been exploring here for years. The reliability of GaAs HBT technology is no longer the post-design evaluation, but the pre-design consideration. The successful and fruitful results of this dissertation provide methods and guidance for the RF designers to achieve more reliable RF circuits with advanced GaAs HBT technology in the future.

The objective of this research is to explore the possibilities of developing transmit/receive (T/R) modules using silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) BiCMOS technology to integrate with organic liquid crystal polymer (LCP) packages for the next-generation phased-array radar system. The T/R module requirements are low power, compact, lightweight, low cost, high performance, and high reliability. All these requirements have provided a very strong motivation for developing fully monolithic T/R modules. SiGe HBT BiCMOS technology is an excellent candidate to integrate all the RF circuit blocks on the T/R module into a single die and thus, reducing the overall cost and size of the phase-array radar system. In addition, this research also investigates the effects and the modeling issues of LCP package on the SiGe circuits at X-band.

This thesis presents an overview of the simulation, design, and measurement of state-of-the-art Silicon-Germanium Hetro-Junction Bipolar Transistor (SiGe HBT) low-noise amplifiers (LNAs). The LNA design trade-off space is presented and methods for achieving an optimized design are discussed. In Chapter 1, we review the importance of LNAs and the benefits of SiGe HBT technology in high frequency amplifier design. Chapter 2 introduces LNA design and basic noise theory. A graphical LNA design approach is presented to aid in understanding of the high-frequency LNA design process. Chapter 3 presents an LNA design optimization method for power constrained applications. Measured results using this design technique are highlighted and shown to have record performance. Lastly, in Chapter 4, we highlight cryogenic noise performance and present measured results from cryogenic operation of SiGe HBT LNAs. We demonstrate in this thesis that SiGe HBT LNAs have the capability to meet the demanding needs for next generation wireless systems. The aim of the analysis presented herein is to provide designers with the fundamentals of designing SiGe HBT LNAs through relevant design examples and measured results.

This work represents several years' research into the field of radiation hardening by design. The unique characteristics of a SiGe HBT, described in Chapter 1, make it ideally suitable for use in extreme environment applications. Chapter 2 describes the total ionizing dose effects experienced by a SiGe HBT, particularly those experienced on an Earth-orbital or lunar-surface mission. In addition, the effects of total dose are evaluated on passive devices. As opposed to the TID-hardness of SiGe transistors, a clear vulnerability to single-event effects does exist. This field is divided into three chapters. First, the very nature of single-event transients present in SiGe HBTs is explored in Chapter 3 using a heavy-ion microbeam with both bulk and SOI platforms [31]. Then, in Chapter 4, a new device-level SEU-hardening technique is presented along with circuit-design techniques necessarily for its implementation. In Chapter 5, the circuit-level radiation-hardening techniques necessarily to mitigate the effects shown in Chapter 3 are developed and tested [32]. Finally, in Chapter 6, the performance of the SiGe HBT in a cryogenic testing environment is characterized to understand how the widely-varying temperatures of outer space may affect device performance. Ultimately, the built-in performance, TID-tolerance, and now-developing SEU-hardness of the SiGe HBT make a compelling case for extreme environment electronics. The low-cost, high-yield, and maturity of Si manufacturing combine with modern bandgap engineering and modern CMOS to produce a high-quality, high-performance BiCMOS platform suitable for space-borne systems.

In this doctoral dissertation, the author presents the theoretical foundation, the analysis and design of analog and RF circuits, the chip level implementation, and the experimental validation pertaining to a new radio frequency integrated circuit (RFIC) power amplifier (PA) architecture that is intended for wireless portable transceivers. / A method called Gated Envelope Feedback is proposed to allow the automatic hardware reconfiguration of a stand-alone RFIC PA in multiple states for power efficiency improvement purposes. The method uses self-operating and fully integrated circuitry comprising RF power detection, switching and sequential logic, and RF envelope feedback in conjunction with a hardware gating function for triggering and activating current reduction mechanisms as a function of the transmitted RF power level. Because of the critical role that RFIC PA components occupy in modern wireless transceivers, and given the major impact that these components have on the overall RF performances and energy consumption in wireless transceivers, very significant benefits stem from the underlying innovations. / The method has been validated through the successful design of a 1.88GHz COMA RFIC PA with automatic hardware reconfiguration capability, using an industry renowned state-of-the-art GaAs HBT semiconductor process developed and owned by Skyworks Solutions, Inc., USA. The circuit techniques that have enabled the successful and full on-chip embodiment of the technique are analyzed in details. The IC implementation is discussed, and experimental results showing significant current reduction upon automatic hardware reconfiguration, gain regulation performances, and compliance with the stringent linearity requirements for COMA transmission demonstrate that the gated envelope feedback method is a viable and promising approach to automatic hardware reconfiguration of RFIC PA's for current reduction purposes. Moreover, in regard to on-chip integration of advanced PA control functions, it is demonstrated that the method is better positioning GaAs HBT technologies, which are known to offer very competitive RF performances but inherently have limited integration capabilities. / Finally, an analytical approach for the evaluation of inter-modulation distortion (IMD) in envelope feedback architectures is introduced, and the proposed design equations and methodology for IMD analysis may prove very helpful for theoretical analyses, for simulation tasks, and for experimental work.

The research presented in this thesis leverages silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) technology to develop microwave front-end electronics for active phased-array antennas. The highly integrated electronics will reduce costs and improve the feasibility of snow measurements from airborne and space-borne platforms. Chapter 1 presents the motivation of this research, focusing on the technological needs of snow measurement missions. The fundamentals and benefits of SiGe HBTs and phased-array antennas for these missions are discussed as well. Chapter 2 discusses SiGe power amplifier design considerations for radar systems. Basic power amplifier design concepts, power limitations in SiGe HBTs, and techniques for increasing the output power of SiGe HBT PAs are reviewed. Chapter 3 presents the design and characterization of a robust medium power X-band SiGe power amplifier for integration into a SiGe transmit/receive module. The PA design process applies the concepts presented in Chapter 2. A detailed investigation into measurement-to-simulation discrepancies is outlined as well. Chapter 4 discusses the development and characterization of a single-chip X-band SiGe T/R module for integration into a very thin, lightweight active phased array antenna panel. The system-on-package antenna combines the high performance and integration potential of SiGe technologies with advanced substrates and packaging techniques to develop a high performance scalable antenna panel using relatively low-cost materials and silicon-based electronics. The antenna panel presented in this chapter will enable airborne SCLP measurements and advance the technology towards an eventual space-based SCLP measurement instrument that will satisfy a critical Earth science need. Finally, Chapter 5 provides concluding remarks and discusses future research directions.

Silicon-germanium (SiGe) BiCMOS technology platforms have proven invaluable for implementing a wide variety of digital, RF, and mixed-signal applications in extreme environments such as space, where maintaining high levels of performance in the presence of low temperatures and background radiation is paramount. This work will focus on the investigation of the total-dose radiation tolerance of a third generation complementary SiGe:C BiCMOS technology platform. Tolerance will be quantified under proton and X-ray radiation sources for both the npn and pnp HBT, as well as for an operational amplifier built with these devices. Furthermore, a technique known as junction isolation radiation hardening will be proposed and tested with the goal of improving the SEE sensitivity of the npn in this platform by reducing the charge collected by the subcollector in the event of a direct ion strike. To the author's knowledge, this work presents the first design and measurement results for this form of RHBD.