Gasphasenabscheidungen werden zur Produktion dünner Schichten in der Mikro- und Nanoelektronik benutzt, um eine präzise Kontrolle der Schichtdicke im Sub-Nanometer-Bereich zu erreichen. Elektronische Eigenschaften der Schichten werden dabei von strukturellen Eigenschaften determiniert, deren Bestimmung mit hohem experimentellem Aufwand verbunden ist. Die vorliegende Arbeit erweitert ein hochparalleles Modell zur atomistischen Simulation des Wachstums und der Struktur von Dünnschichten, welches Molekulardynamik (MD) und Kinetic Monte Carlo-Methoden (KMC) kombiniert, um die Beschreibung beliebiger Gasphasenabscheidungen. KMC-Methoden erlauben dabei die effiziente Betrachtung der Größenordnung ganzer Nano-Bauelemente, während MD für atomistische Genauigkeit sorgt. Erste Ergebnisse zeigen, dass das Parsivald genannte Modell Abscheidungen in Simulationsräumen mit einer Breite von 0.1 µm x 0.1 µm effizient berechnet, aber auch bis zu 1 µm x 1 µm große Räume mit 1 Milliarden Atomen beschreiben kann. Somit lassen sich innerhalb weniger Tage Schichtabscheidungen mit einer Dicke von 100 Å simulieren. Die kristallinen und amorphen Schichten zeigen glatte Oberflächen, wobei auch mehrlagige Systeme auf die jeweilige Lagenrauheit untersucht werden. Die Struktur der Schicht wird hauptsächlich durch die verwendeten molekulardynamischen Kraftfelder bestimmt, wie Untersuchungen der physikalischen Gasphasenabscheidung von Gold, Kupfer, Silizium und einem Kupfer-Nickel-Multilagensystem zeigen. Stark strukturierte Substrate führen hingegen zu Artefakten in Form von Nanoporen und Hohlräumen aufgrund der verwendeten KMC-Methode. Zur Simulation von chemischen Gasphasenabscheidungen werden die Precursor-Reaktionen von Silan mit Sauerstoff sowie die Hydroxylierung von alpha-Al2O3 mit Wasser mit reaktiven Kraftfeldern (ReaxFF) berechnet, allerdings ist weitere Arbeit notwendig, um komplette Abscheidungen auf diese Weise zu simulieren. Mit Parsivald wird somit die Erweiterung einer Software präsentiert, die Gasphasenabscheidungen auf großen Substraten effizient simulieren kann, dabei aber auf passende molekulardynamische Kraftfelder angewiesen ist.:Inhaltsverzeichnis Abbildungsverzeichnis Tabellenverzeichnis Abkürzungsverzeichnis Symbolverzeichnis 1 Einleitung 2 Grundlagen 2.1 Gasphasenabscheidungen 2.1.1 Physikalische Gasphasenabscheidung 2.1.2 Chemische Gasphasenabscheidung 2.1.3 Atomlagenabscheidung 2.1.4 Methoden zur Simulation von Gasphasenabscheidungen 2.2 Molekulardynamik 2.2.1 Formulierung der Molekulardynamik 2.2.2 Auswahl verfügbarer Molekulardynamik-Software 2.2.3 Molekulardynamische Kraftfelder 2.3 Kinetic Monte Carlo-Methoden 2.4 Datenstrukturen 2.4.1 Numerische Voraussetzungen an Gasphasenabscheidungen 2.4.2 Vergleich der Laufzeiten für verschiedene Datenstrukturen 2.4.3 Effiziente Datenstrukturen 2.4.4 Alpha-Form 3 Methoden und Modelle 3.1 Stand der Forschung 3.1.1 Anwendungen von KMC-Simulationen für die Gasphasenabscheidung 3.1.2 Anwendung von MD-Simulationen für die Gasphasenabscheidung 3.2 Parsivald-Modell 3.2.1 Zielsetzung für Parsivald 3.2.2 Beschreibung des Parsivald-Modells 3.2.3 Annahmen und Einschränkungen 3.2.4 Erweiterungen im Rahmen der Masterarbeit 3.2.5 Behandlung von fehlerhaften Ereignissen 3.3 Laufzeitanalyse von Parsivald-Simulationen 3.3.1 Ereignis-Laufzeit TE 3.3.2 Ereignis-Durchsatz RE 3.3.3 MD-Laufzeit TMD 3.3.4 Worker-Laufzeit Tworker 3.3.5 Serielle Laufzeit T1 3.3.6 Anzahl der parallelen Prozesse p 3.3.7 Workerdichte rhoworker 3.3.8 Parallele Laufzeit Tp 3.3.9 Speedup Sp 3.3.10 Parallele Effizienz Ep 3.3.11 Auswertung der Laufzeitparameter 3.3.12 Fazit 3.4 MD-Simulationen: Methoden und Auswertungen 3.4.1 Zeitskalen in MD-Simulationen 3.4.2 Relaxierungen 3.4.3 Strukturanalysen 3.4.4 Bestimmung der Dichte und Temperatur 3.4.5 Radiale Verteilungsfunktionen, Bindungslänge und Koordinationszahl 3.4.6 Oberfläche, Schichtdicke, Rauheit und Porösität 3.4.7 Reaktionen und Stabilität von Molekülen 4 Simulationen von Gasphasenabscheidungen 4.1 Gold-PVD 4.1.1 Voruntersuchungen 4.1.2 Thermodynamische Eigenschaften 4.1.3 Simulation von Gold-PVD 4.1.4 Skalierbarkeit mit der Simulationsgröße 4.1.5 Fazit 4.2 Kupfer-PVD 4.2.1 Voruntersuchungen 4.2.2 Thermodynamische Eigenschaften 4.2.3 Simulation von Kupfer-PVD 4.2.4 Untersuchung der maximalen Workerdichte 4.2.5 Fazit 4.3 Multilagen-PVD 4.3.1 Multilagen-Simulationen mit Parsivald 4.3.2 Vergleich mit Ergebnissen reiner MD-Simulationen 4.3.3 Vergleich der Parallelisierbarkeit 4.3.4 Fazit 4.4 Silizium-PVD 4.4.1 Voruntersuchungen 4.4.2 Simulationen von Silizium-PVD 4.4.3 Fazit 4.5 Aluminiumoxid-ALD 4.5.1 ReaxFF-Parametersätze 4.5.2 Voruntersuchungen 4.5.3 Fazit 5 Zusammenfassung und Ausblick 5.1 Zusammenfassung 5.2 Ausblick A Physikalische Konstanten und Stoffeigenschaften B Datenstrukturen B.1 Übersicht über KMC-Operationen B.2 Beschreibung grundlegender Datenstrukturen B.3 Delaunay-Triangulationen B.3.1 Ausgewählte Eigenschaften einer Delaunay-Triangulation B.3.2 Algorithmen zur Konstruktion einer Delaunay-Triangulation C Ergänzungen zur Laufzeitanalyse von Parsivald C.1 Einfluss der Ereignis-Laufzeit auf die effiziente Raumgröße weff C.2 Zusätzliche Einflüsse auf das Maximum der Prozesse pmax C.3 Abschätzung der maximalen Workerdichte per Random Sequential Adsorption D Ergänzungen zur Simulation von Gold-PVD E Multilagen-PVD E.1 Porenbildung bei Unterrelaxation E.2 Simulationen mit Lagendicken von jeweils 5 nm F Simulation der CVD-Precursormoleküle Silan und Sauerstoff F.1 Stabilität der Precursormoleküle F.2 Reaktion der Precursormoleküle Literaturverzeichnis

Nickel und Nickel (II) -oxid werden in großem Umfang in fortgeschrittenen elektronischen Geräten verwendet. In der Mikroelektronik-Industrie wird Nickel verwendet werden, um Nickelsilizid bilden. Die Nickelmono Silizid (NiSi) wurde als ausgezeichnetes Material für Source-Drain-Kontaktanwendungen unter 45 nm-CMOS-Technologie entwickelt. Im Vergleich zu anderen Siliziden für die Kontaktanwendungen verwendet wird NiSi wegen seines niedrigen spezifischen Widerstand, niedrigen Kontaktwiderstand, relativ niedrigen Bildungstemperatur und niedrigem Siliziumverbrauchs bevorzugt. Nickel in Nickelbasis-Akkus und ferromagnetischen Direktzugriffsspeicher (RAMs) verwendet. Nickel (II) oxid wird als Transistor-Gate-Oxid und Oxid in resistive RAM genutzt wird. Atomic Layer Deposition (ALD) ist eine spezielle Art der Chemical Vapor Deposition (CVD), das verwendet wird, um sehr glatte sowie homogene Dünnfilme mit hervorragenden Treue auch bei hohen Seitenverhältnissen abzuscheiden. Es basiert auf selbstabschließenden sequentielle Gas-Feststoff-Reaktionen, die eine präzise Steuerung der Filmdicke auf wenige Angström lassen sich auf der Basis. Zur Herstellung der heutigen 3D-elektronische Geräte, sind Technologien wie ALD erforderlich. Trotz der Vielzahl von praktischen Anwendungen von Nickel und Nickel (II) -oxid, sind einige Nickelvorstufen zur thermischen basierend ALD erhältlich. Darüber hinaus haben diese Vorstufen bei schlechten Filmeigenschaften führte und die Prozesseigenschaften wurden ebenfalls begrenzt. Daher in dieser Masterarbeit mussten die Eigenschaften verschiedener neuartiger Nickelvorstufen zu bewerten. Alle neuen Vorstufen heteroleptische (verschiedene Arten von Liganden) und Komplexe wurden vom Hersteller speziell zur thermischen basierend ALD aus reinem Nickel mit H 2 als ein Co-Reaktionsmittel gestaltet. Um die neuartige Vorläufer zu untersuchen, wurde eine neue Methode entwickelt, um kleine Mengen in einer sehr zeitsparend (bis zu 2 g) von Ausgangsstoffen zu testen. Diese Methodologie beinhaltet: TGA / DTA-Kurve analysiert der Vorstufen, thermische Stabilitätstests in dem die Vorläufer (<0,1 g) wurden bei erhöhter Temperatur in einer abgedichteten Umgebung für mehrere Stunden wurde die Abscheidung Experimenten und Film Charakterisierungen erhitzt. Die Abscheidungen wurden mit Hilfe der in situ Quarzmikrowaage überwacht, während die anwendungsbezogenen Filmeigenschaften, wie chemische Zusammensetzung, physikalische Phase, Dicke, Dichte, Härte und Schichtwiderstand wurden mit Hilfe von ex situ Messverfahren untersucht. Vor der Evaluierung neuartiger Nickelvorstufen ein Benchmark ALD-Prozess war vom Referenznickelvorläufer (Ni (AMD)) und Luft als Reaktionspartner entwickelt. Das Hauptziel der Entwicklung und Optimierung von solchen Benchmark-ALD-Prozess war es, Standard-Prozessparameter wie zweite Reaktionspartner Belichtungszeiten, Argonspülung Zeiten, gesamtprozessdruck, beginnend Abscheidungstemperatur und Gasströme zu extrahieren. Diese Standard-Prozessparameter mussten verwendet, um die Prozessentwicklung Aufgabe (das spart Vorläufer Verbrauch) zu verkürzen und die Sublimationstemperatur Optimierung für jede neuartige Vorstufe werden. Die ALD Verhalten wurde in Bezug auf die Wachstumsrate durch Variation des Nickelvorläuferbelichtungszeit, Vorläufer Temperatur und Niederschlagstemperatur überprüft. / Nickel and nickel(II) oxide are widely used in advanced electronic devices . In microelectronic industry, nickel is used to form nickel silicide. The nickel mono-silicide (NiSi) has emerged as an excellent material of choice for source-drain contact applications below 45 nm node CMOS technology. As compared to other silicides used for the contact applications, NiSi is preferred because of its low resistivity, low contact resistance, relatively low formation temperature and low silicon consumption. Nickel is used in nickel-based rechargeable batteries and ferromagnetic random access memories (RAMs). Nickel(II) oxide is utilized as transistor gate-oxide and oxide in resistive RAMs. Atomic Layer Deposition (ALD) is a special type of Chemical Vapor Deposition (CVD) technique, that is used to deposit very smooth as well as homogeneous thin films with excellent conformality even at high aspect ratios. It is based on self-terminating sequential gas-solid reactions that allow a precise control of film thickness down to few Angstroms. In order to fabricate todays 3D electronic devices, technologies like ALD are required. In spite of huge number of practical applications of nickel and nickel(II) oxide, a few nickel precursors are available for thermal based ALD. Moreover, these precursors have resulted in poor film qualities and the process properties were also limited. Therefore in this master thesis, the properties of various novel nickel precursors had to be evaluated. All novel precursors are heteroleptic (different types of ligands) complexes and were specially designed by the manufacturer for thermal based ALD of pure nickel with H 2 as a co-reactant. In order to evaluate the novel precursors, a new methodology was designed to test small amounts (down to 2 g) of precursors in a very time efficient way. This methodology includes: TGA/DTA curve analyses of the precursors, thermal stability tests in which the precursors (< 0.1 g) were heated at elevated temperatures in a sealed environment for several hours, deposition experiments, and film characterizations. The depositions were monitored with the help of in situ quartz crystal microbalance, while application related film properties like chemical composition, physical phase, thickness, density, roughness and sheet resistance were investigated with the help of ex situ measurement techniques. Prior to the evaluation of novel nickel precursors, a benchmark ALD process was developed from the reference nickel precursor (Ni(amd)) and air as a co-reactant. The main goal of developing and optimizing such benchmark ALD process was to extract standard process parameters like second-reactant exposure times, Argon purge times, total process pressure, starting deposition temperature and gas flows. These standard process parameters had to be utilized to shorten the process development task (thus saving precursor consumption) and optimize the sublimation temperature for each novel precursor. The ALD behaviour was checked in terms of growth rate by varying the nickel precursor exposure time, precursor temperature and deposition temperature.

Nickel und Nickel (II) -oxid werden in großem Umfang in fortgeschrittenen elektronischen Geräten verwendet. In der Mikroelektronik-Industrie wird Nickel verwendet werden, um Nickelsilizid bilden. Die Nickelmono Silizid (NiSi) wurde als ausgezeichnetes Material für Source-Drain-Kontaktanwendungen unter 45 nm-CMOS-Technologie entwickelt. Im Vergleich zu anderen Siliziden für die Kontaktanwendungen verwendet wird NiSi wegen seines niedrigen spezifischen Widerstand, niedrigen Kontaktwiderstand, relativ niedrigen Bildungstemperatur und niedrigem Siliziumverbrauchs bevorzugt. Nickel in Nickelbasis-Akkus und ferromagnetischen Direktzugriffsspeicher (RAMs) verwendet. Nickel (II) oxid wird als Transistor-Gate-Oxid und Oxid in resistive RAM genutzt wird. Atomic Layer Deposition (ALD) ist eine spezielle Art der Chemical Vapor Deposition (CVD), das verwendet wird, um sehr glatte sowie homogene Dünnfilme mit hervorragenden Treue auch bei hohen Seitenverhältnissen abzuscheiden. Es basiert auf selbstabschließenden sequentielle Gas-Feststoff-Reaktionen, die eine präzise Steuerung der Filmdicke auf wenige Angström lassen sich auf der Basis. Zur Herstellung der heutigen 3D-elektronische Geräte, sind Technologien wie ALD erforderlich. Trotz der Vielzahl von praktischen Anwendungen von Nickel und Nickel (II) -oxid, sind einige Nickelvorstufen zur thermischen basierend ALD erhältlich. Darüber hinaus haben diese Vorstufen bei schlechten Filmeigenschaften führte und die Prozesseigenschaften wurden ebenfalls begrenzt. Daher in dieser Masterarbeit mussten die Eigenschaften verschiedener neuartiger Nickelvorstufen zu bewerten. Alle neuen Vorstufen heteroleptische (verschiedene Arten von Liganden) und Komplexe wurden vom Hersteller speziell zur thermischen basierend ALD aus reinem Nickel mit H 2 als ein Co-Reaktionsmittel gestaltet. Um die neuartige Vorläufer zu untersuchen, wurde eine neue Methode entwickelt, um kleine Mengen in einer sehr zeitsparend (bis zu 2 g) von Ausgangsstoffen zu testen. Diese Methodologie beinhaltet: TGA / DTA-Kurve analysiert der Vorstufen, thermische Stabilitätstests in dem die Vorläufer (<0,1 g) wurden bei erhöhter Temperatur in einer abgedichteten Umgebung für mehrere Stunden wurde die Abscheidung Experimenten und Film Charakterisierungen erhitzt. Die Abscheidungen wurden mit Hilfe der in situ Quarzmikrowaage überwacht, während die anwendungsbezogenen Filmeigenschaften, wie chemische Zusammensetzung, physikalische Phase, Dicke, Dichte, Härte und Schichtwiderstand wurden mit Hilfe von ex situ Messverfahren untersucht. Vor der Evaluierung neuartiger Nickelvorstufen ein Benchmark ALD-Prozess war vom Referenznickelvorläufer (Ni (AMD)) und Luft als Reaktionspartner entwickelt. Das Hauptziel der Entwicklung und Optimierung von solchen Benchmark-ALD-Prozess war es, Standard-Prozessparameter wie zweite Reaktionspartner Belichtungszeiten, Argonspülung Zeiten, gesamtprozessdruck, beginnend Abscheidungstemperatur und Gasströme zu extrahieren. Diese Standard-Prozessparameter mussten verwendet, um die Prozessentwicklung Aufgabe (das spart Vorläufer Verbrauch) zu verkürzen und die Sublimationstemperatur Optimierung für jede neuartige Vorstufe werden. Die ALD Verhalten wurde in Bezug auf die Wachstumsrate durch Variation des Nickelvorläuferbelichtungszeit, Vorläufer Temperatur und Niederschlagstemperatur überprüft.:Lists of Abbreviations and Symbols VIII Lists of Figures and Tables XIV 1 Introduction 1 I Theoretical Part 3 2 Nickel and Nickel Oxides 4 2.1 Introduction and Existence 5 2.2 Material properties of Nickel and Nickel Oxide 5 2.3 Application in electronic industry 5 3 Atomic Layer Deposition 7 3.1 History 8 3.2 Definition 8 3.3 Features of thermal-ALD 8 3.3.1 ALD growth mechanism – an ideal view 8 3.3.2 ALD growth behaviour 10 3.3.3 Growth mode 11 3.3.4 ALD temperature window 11 3.4 Benefits and limitations 12 3.5 Precursor properties for thermal-ALD 13 3.6 ALD & CVD of Nickel – A literature survey 13 4 Metrology 17 4.1 Thermal analysis of precursors 18 4.2 Film and growth characterization 21 4.2.1 Quartz Crystal Microbalance 21 4.2.2 Spectroscopic Ellipsometry 24 4.2.3 X-Ray Photoelectron Spectroscopy 28 4.2.4 Scanning Electron Microscopy 29 4.2.5 X-Ray Reflectometry and X-Ray Diffraction 29 4.2.6 Four Point Probe Technique 20 5 Rapid Thermal Processing 32 5.1 Introduction 33 5.2 Basics of RTP 33 5.3 Nickel Silicides-A literature survey 33 II Experimental Part 36 6 Methodologies 37 6.1 Experimental setup 38 6.2 ALD process 41 6.2.1 ALD process types and substrate setups 41 6.2.2 Process parameters 41 6.3 Experimental procedure 42 6.3.1 Tool preparation 42 6.3.2 Thermal analysis and ALD experiments from nickel precursors 43 6.3.3 Data acquisition and evaluation 44 6.3.4 Characterization of film properties 46 7 Results and discussion 48 7.1 Introduction 49 7.2 QCM verification with Aluminum Oxide ALD process 49 7.3 ALD process from the reference precursor 50 7.3.1 Introduction 50 7.3.2 TG analysis for Ni(amd) precursor 51 7.3.3 Thermal stability test for Ni(amd) 51 7.3.4 ALD process optimization 52 7.3.5 Film properties 54 7.4 Evaluating the novel Nickel precursors 55 7.4.1 Screening tests for precursor P1 55 7.4.2 Screening tests for precursor P2 62 7.4.3 Screening tests for precursor P3 66 7.4.4 Screening tests for precursor P4 70 7.4.5 Screening tests for precursor P5 72 7.5 Comparison of all nickel precursors used in this work 74 8 Conclusions and outlook 77 References 83 III Appendix 101 A Deposition temperature control & Ellipsometry model 102 B Gas flow plan 105 / Nickel and nickel(II) oxide are widely used in advanced electronic devices . In microelectronic industry, nickel is used to form nickel silicide. The nickel mono-silicide (NiSi) has emerged as an excellent material of choice for source-drain contact applications below 45 nm node CMOS technology. As compared to other silicides used for the contact applications, NiSi is preferred because of its low resistivity, low contact resistance, relatively low formation temperature and low silicon consumption. Nickel is used in nickel-based rechargeable batteries and ferromagnetic random access memories (RAMs). Nickel(II) oxide is utilized as transistor gate-oxide and oxide in resistive RAMs. Atomic Layer Deposition (ALD) is a special type of Chemical Vapor Deposition (CVD) technique, that is used to deposit very smooth as well as homogeneous thin films with excellent conformality even at high aspect ratios. It is based on self-terminating sequential gas-solid reactions that allow a precise control of film thickness down to few Angstroms. In order to fabricate todays 3D electronic devices, technologies like ALD are required. In spite of huge number of practical applications of nickel and nickel(II) oxide, a few nickel precursors are available for thermal based ALD. Moreover, these precursors have resulted in poor film qualities and the process properties were also limited. Therefore in this master thesis, the properties of various novel nickel precursors had to be evaluated. All novel precursors are heteroleptic (different types of ligands) complexes and were specially designed by the manufacturer for thermal based ALD of pure nickel with H 2 as a co-reactant. In order to evaluate the novel precursors, a new methodology was designed to test small amounts (down to 2 g) of precursors in a very time efficient way. This methodology includes: TGA/DTA curve analyses of the precursors, thermal stability tests in which the precursors (< 0.1 g) were heated at elevated temperatures in a sealed environment for several hours, deposition experiments, and film characterizations. The depositions were monitored with the help of in situ quartz crystal microbalance, while application related film properties like chemical composition, physical phase, thickness, density, roughness and sheet resistance were investigated with the help of ex situ measurement techniques. Prior to the evaluation of novel nickel precursors, a benchmark ALD process was developed from the reference nickel precursor (Ni(amd)) and air as a co-reactant. The main goal of developing and optimizing such benchmark ALD process was to extract standard process parameters like second-reactant exposure times, Argon purge times, total process pressure, starting deposition temperature and gas flows. These standard process parameters had to be utilized to shorten the process development task (thus saving precursor consumption) and optimize the sublimation temperature for each novel precursor. The ALD behaviour was checked in terms of growth rate by varying the nickel precursor exposure time, precursor temperature and deposition temperature.:Lists of Abbreviations and Symbols VIII Lists of Figures and Tables XIV 1 Introduction 1 I Theoretical Part 3 2 Nickel and Nickel Oxides 4 2.1 Introduction and Existence 5 2.2 Material properties of Nickel and Nickel Oxide 5 2.3 Application in electronic industry 5 3 Atomic Layer Deposition 7 3.1 History 8 3.2 Definition 8 3.3 Features of thermal-ALD 8 3.3.1 ALD growth mechanism – an ideal view 8 3.3.2 ALD growth behaviour 10 3.3.3 Growth mode 11 3.3.4 ALD temperature window 11 3.4 Benefits and limitations 12 3.5 Precursor properties for thermal-ALD 13 3.6 ALD & CVD of Nickel – A literature survey 13 4 Metrology 17 4.1 Thermal analysis of precursors 18 4.2 Film and growth characterization 21 4.2.1 Quartz Crystal Microbalance 21 4.2.2 Spectroscopic Ellipsometry 24 4.2.3 X-Ray Photoelectron Spectroscopy 28 4.2.4 Scanning Electron Microscopy 29 4.2.5 X-Ray Reflectometry and X-Ray Diffraction 29 4.2.6 Four Point Probe Technique 20 5 Rapid Thermal Processing 32 5.1 Introduction 33 5.2 Basics of RTP 33 5.3 Nickel Silicides-A literature survey 33 II Experimental Part 36 6 Methodologies 37 6.1 Experimental setup 38 6.2 ALD process 41 6.2.1 ALD process types and substrate setups 41 6.2.2 Process parameters 41 6.3 Experimental procedure 42 6.3.1 Tool preparation 42 6.3.2 Thermal analysis and ALD experiments from nickel precursors 43 6.3.3 Data acquisition and evaluation 44 6.3.4 Characterization of film properties 46 7 Results and discussion 48 7.1 Introduction 49 7.2 QCM verification with Aluminum Oxide ALD process 49 7.3 ALD process from the reference precursor 50 7.3.1 Introduction 50 7.3.2 TG analysis for Ni(amd) precursor 51 7.3.3 Thermal stability test for Ni(amd) 51 7.3.4 ALD process optimization 52 7.3.5 Film properties 54 7.4 Evaluating the novel Nickel precursors 55 7.4.1 Screening tests for precursor P1 55 7.4.2 Screening tests for precursor P2 62 7.4.3 Screening tests for precursor P3 66 7.4.4 Screening tests for precursor P4 70 7.4.5 Screening tests for precursor P5 72 7.5 Comparison of all nickel precursors used in this work 74 8 Conclusions and outlook 77 References 83 III Appendix 101 A Deposition temperature control & Ellipsometry model 102 B Gas flow plan 105

<p>Postojanje ugljeničnih nanocevi (UNC), kao jedne od brojnih alotropskih modifikacija ugljenika, zabeleženo je jo&scaron; pre vi&scaron;e od pola veka. Međutim, do prave eksplozije<br />interesovanja za ovu vrstu nanomaterijala je do&scaron;lo tek 1991. godine kada ih je &quot;ponovo&quot; otkrio japanski naučnik S. Iijima. Od tada, zbog svojih izuzetnih fizičko-hemijskih osobina, UNC počinju da privlače pažnju naučne javnosti i spajaju istraživače iz različitih oblasti sa zajedničkim imeniteljem - nanotehnologija. Otkriće UNC je u znatnoj meri omogućilo razvoj visoke tehnologije u oblastima kao &scaron;to su elektronika, optika, kompozitni materijali, kataliza, za&scaron;tita životne sredine, itd. Danas, primena nanocevi sve vi&scaron;e doprinosi lak&scaron;oj implementaciji principa održivog razvoja u pomenute oblasti. Kataliza je polje od dvostrukog interesa, jer je jedan od načina dobijanja UNC upravo katalitički, a osim toga i same cevi su interesantne kao nosač novog katalizatora.<br />Istraživanje čiji su rezultati prikazani u okviru ove doktorske disertacije je obuhvatilo vi&scaron;e oblasti proučavanja UNC, počev&scaron;i od razvoja metode za njihovu sintezu, preko preči&scaron;ćavanja i funkcionalizacije finalnog proizvoda, pa do primene nanocevi u dva procesa od značaja za oblast za&scaron;tite životne sredine.</p><p>Razvoj katalitičke metode sinteze UNC započet je primenom vertikalnog cevnog kvarcnog reaktora, iz CO i CH4 kao izvora ugljenika, pri čemu su u reakciji testirani<br />monometalni katalizatori na bazi Fe, Co i Ni na Al2O3 kao nosaču (I serija katalizatora). Rezultati ovih preliminarnih eksperimenata su pokazali malu aktivnost I serije monometalnih katalizatora, &scaron;to se može pripisati, kako neadekvatnoj hidrodinamici reaktora i lo&scaron;e odabranim reakcionim parametrima, tako i neodgovarajućoj veličini katalitičkih čestica i načina njihovog pakovanja u vertikalnom<br />reaktoru. Shodno tome, u cilju postizanja boljeg prinosa nanocevi, dalji eksperimenti sinteze izvedeni su u horizontalnom reaktoru u struji C2H4 i u prisustvu II serije<br />monometalnih katalizatora sa Al2O3 i SiO2 kao nosačima, koji se u odnosu na I seriju razlikuju po udelu aktivne faze i veličini čestica katalizatora (pra&scaron;kast oblik). Katalizatori II serije su pokazali zadovoljavajuću aktivnost u reakciji sinteze UNC, a rezultati karakterizacije dobijenih uzoraka nanocevi ukazuju na različit uticaj nosača katalizatora na morfologiju sintetisanih nanocevi. Shodno ostvarenom prinosu ugljenika, a u cilju optimizacije reakcionih parametara, katalizator na bazi Fe sa SiO2 kao nosačem je odabran kao reprezentativan za ispitivanje uticaja vremena trajanja sinteze UNC, kao i zapreminskog udela C2H4 u sme&scaron;i sa azotom, na prinos<br />nanocevi i selektivnost procesa.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Optimizacija reakcionih uslova je u daljoj fazi rada dovela do uvođenja bimetalnih katalizatora sa istim tradicionalnim nosačima &ndash; Al2O3 i SiO2. Najveći prinos ugljenika ostvaren je na katalizatorima sa Fe i Co kao aktivnom fazom, bez obzira na vrstu nosača. UNC sintetisane na pomenutim katalizatorima su karakterisane u cilju<br />ispitivanja uticaja primenjenih nosača na njihove fizičkohemijske osobine, pa je shodno tome i predložen vr&scaron;ni mehanizam njihovog rasta. Rezultati ispitivanja kvaliteta sintetisanih UNC su ukazali da primena SiO2, kao nosača katalizatora, za razliku od Al2O3, favorizuje rast UNC boljeg povr&scaron;inskog i ukupnog kvaliteta. S obzirom na raznolikost mogućnosti primene UNC, istraživanja u tom smeru zahtevaju čiste UNC, pa su shodno tome proizvodi sinteze preči&scaron;ćeni metodom tečne oksidacije. Rezultati fizičko-hemijske karakterizacije preči&scaron;ćenih UNC su ukazali na efikasnost primenjene metode sa aspekta uklanjanja prisutnog katalizatora, ali i na njen različit uticaj na strukturu, odnosno kvalitet preči&scaron;ćenih uzoraka. Kao posledica promena unutar strukture UNC, kao i različitog stepena njihove funkcionalizacije, ukupni kvalitet preči&scaron;ćenih nanocevi je, u zavisnosti od primenjenog nosača katalizatora, promenjen u odnosu na odgovarajuće nepreči&scaron;ćene uzorke.<br />Poslednjih godina se posebna pažnja poklanja nanomaterijalima koji se mogu primeniti za uklanjanje različitih polutanata iz životne sredine, kako u funkciji adsorbenata, tako i u funkciji katalizatora. U okviru ove doktorske disertacije obuhvaćena je primena UNC kao adsorbenta za uklanjanje insekticida tiametoksama iz vode, kao i njihova primena kao nosača katalizatora u reakciji<br />denitracije vode. Rezultati eksperimenata adsorpcije su pokazali da UNC, prethodno tretirane u ccHNO3, predstavljaju dobar adsorbent za uklanjanje insekticida tiametoksama iz vodenog rastvora. Odabir procesnih parametara za proučavanje kinetike adsorpcije, adsorpcione ravnoteže, kao i termodinamike procesa izvr&scaron;en je primenom frakcionog faktorskog dizajna na dva nivoa, 5 1 V 2 , a dobijeni rezultati su ukazali da je pomenuti proces adsorpcije spontan i kontrolisan uglavnom unutra&scaron;njom difuzijom molekula insekticida u mezopore uzorka UNC. Performanse katalizatora sa UNC kao nosačem su testirane u reakciji katalitičke denitracije, pri čemu su dobijeni rezultati pokazali da se novoformirani katalizator karakteri&scaron;e zadovoljavajućom disperzno&scaron;ću sa udelombimetalnih Pd-Cu nanočestica koje omogućavaju 60% konverzije nitratnog jona.</p> / <p style="text-align: justify;">The existance of carbon nanotubes (CNTs), as one of the carbon allotropes, was noted over half century ago. However, the true interest for these nanomaterials appeared at 1991, when they were &quot;redescovered&quot; by Japanese scientist S. Iijima. Since then, due to their unique physico-chemical properties, CNTs begin to attract attention of the scientific community and to gather researchers from different areas within the common field of interest &ndash; nanotechnology. The CNTs discovery substantially enabled the high technology development in the fields such as electronics, optics, composite materials, catalysis, environmental protection, etc. Nowdays, the application of nanotubes is increasingly contributing to easier implementation of sustainable development principles in the above mentioned areas. Catalysis is the field of double interest &ndash; one of the CNTs synthesis method is catalytical, and the nanotubes can also be used as the support of the new catalyst.<br />The research, which results are shown within this PhD Thesis, includes few different CNTs research fields, starting from the synthesis method development, over the purification and functionalization of the final product, to the application of<br />nanotubes in two processes of significance for the field of environmental protection.<br />The development of the CNTs catalytic synthesis method was started by the use of vertical quartz tube reactor, in the flow of CO and CH4 as the carbon source, and in the presence of monometallic catalysts based on Fe, Co and Ni at Al2O3 as the support (the first series of catalysts). The results of these preliminary experiments have shown the low activity of these monometallic catalysts, which can be attributed to the inadequate reactor hydrodynamics and selected reaction parameters, as well as the inadequate size of the catalytic particles and the type of their packing in the vertical reactor. Consequently, in order to achieve the higher nanotubes yield, further synthesis experiments were carried out in a horizontal reactor in the flow of C2H4 as the carbon source, and in the presence of the second series of monometallic catalysts with Al2O3 and SiO2 as the supports. The catalysts of the second series have shown satisfactory activity in the CNTs synthesis reaction, and the results of the obtained samples characterization idicate a different influence of the catalyst support on the synthesized CNTs morphology. In order to optimize the reaction parameters, Fe/SiO2 catalyst was chosen as a representative to examine the effect of the CNTs synthesis duration, as well as the volume percentage of C2H4 in the mixture with nitrogen to the CNTs yield and process selectivity. In a further phase of work, the optimization of thereaction parameters led to the introduction of the bimetallic catalysts with the same traditional supports, Al2O3 and SiO2. The highest carbon yield was achieved over Fe, Co based catalysts, regardless of the type of the catalyst support. CNTs synthesized over the above mentioned catalysts were characterized in order to study the effect of the used supports on their physico-chemical properties, and consequently the CNTs tip growth mechanism was proposed. The results of quality examination of the synthesized CNTs showed that the use of SiO2, as a catalyst support, unlike Al2O3, favors the growth of nanotubes of better surface and overall crystalline quality. In view of the diversity of possible CNTs applications, investigation in that direction requires purified CNTs and accordingly the final CNTs products were purified by liquid oxidation method. The results of physico-chemical characterization of the purified CNTs showed that the applied purification method was effective in terms of removing the present catalyst, but on the other hand it had different influence on the structure and quality of the purified samples. As a consequence of CNTs structural changes, as well as their different degree of functionalization, the overall crystalline quality of the purified nanotubes, originating from different catalyst supports, was changed in comparison to the corresponding unpurified samples. Over the past few years, special attention was focused on<br />nanomaterials that can be applied as adsorbents or catalysts for the removal of various pollutants from the environment. This PhD Thesis considers the use of CNTs, as adsorbent, for the removal of insecticide thiamethoxam from water, as well as their use as catalyst support for water denitration reaction. The results of adsorption experiments have shown that the CNTs, pretreated in ccHNO3, represent a good adsorbent for the removal of thiamethoxam from the aqueous solutions. The<br />selection of the process parameters in order to study the adsorption kinetics and equilibrium, as well as the thermodynamics of the process, was conducted using the<br />fractional factorial design at two levels, 5 1 V 2 . The obtained results showed that the adsorption process is spontaneous and controlled mainly by an internal diffusion of molecules of insecticide in the mesopores of CNTs. The performance of the catalyst with the CNTs as the support were tested in catalytic water denitration reaction, whereby the results showed that the newly formed catalyst is characterized by satisfactory dispersion of Pd-Cu bimetallic nanoparticles which enable the 60% conversion of nitrate ions.</p>

As interessantes propriedades eletrônicas, mecânicas e óticas dos materiais orgânicos conjugados fizeram emergir diversas aplicações tecnológicas e comerciais em dispositivos baseados nesses materiais, tais como sensores, memórias, células solares e diodos emissores de luz poliméricos (LEDs). Neste sentido, o tema central desta tese é o estudo das propriedades elétricas e morfológicas e os mecanismos de transporte eletrônico de cargas no PEDOT:PSS, uma blenda polimérica que consiste de um policátion condutivo, o poli(3,4- etilenodioxitiofeno) (PEDOT) e do poliânion poli(estirenosulfonado) (PSS). PEDOT:PSS é amplamente usado como material de eletrodo em aplicações na área de eletrônica plástica, como mencionado anteriormente. Apesar da condutividade elétrica dos filmes finos de PEDOT:PSS possa variar várias ordens de grandeza, dependendo do método pela qual é processado e transformado em filme fino, as razões para este comportamento é essencialmente desconhecido. Esta tese descreve um estudo detalhado do transporte eletrônico de cargas anisotrópico e sua correlação com a morfologia, as condições e as dimensões da separação de fase entre os dois materiais, PEDOT e PSS. Antes de abordar as propriedades do PEDOT:PSS, uma camada de filme fino inorgânica usada para aumentar o tempo de vida de dispositivos orgânicos é descrita no Capítulo 2. Um importante mecanismo de degradação em LEDs poliméricos é a fotooxidação da camada ativa. Assim, isolar a camada ativa da água, oxigênio e luz, torna-se crucial para o aumento do tempo de vida. Um sistema de deposição química a partir da fase de vapor estimulada por plasma (PECVD) é usado para depositar filmes finos de nitreto de carbono em baixas temperaturas, menores que 100 °C, sobre PLEDs com a intenção de aumentar o tempo de vida destes dipositivos e diminuir a fotodegradação do poli[2-metoxi-5- (2-etil-hexiloxi)-p-fenileno vinileno] (MEH-PPV) em ambiente atmosférico. O filme fino de nitreto de carbono possui as características de um material que pode bloquear a umidade e que tem espessura e flexibilidade adequados para a nova geração de PLEDs flexíveis. As características dos filmes finos de nitreto de carbono e MEH-PPV foram investigadas usando-se técnicas de espectroscopia ótica, com particular ênfase no processo de degradação do MEHPPV sob iluminação. Os resultados mostraram que o filme fino de nitreto de carbono protege o filme polimérico e diminui consideravelmente a fotooxidação. Para avaliar o efeito do encapsulamento em dispositivos reais, LEDs poliméricos foram fabricados e pelas curvas de corrente-tensão um aumento no tempo de vida é confirmado quando a camada de nitreto de carbono é presente. O tempo de vida desejado, maior que 10.000 horas, para aplicações comerciais não foi atingido, entretanto, o encapsulamento pode ser melhorado otimizando as propriedades da camada de nitreto de carbono e combinando-as com camadas de outros materiais orgânicos e inorgânicos. Os capítulos seguintes deste trabalho aborda os estudos realizados com o PEDOT:PSS, uma vez que é amplamente usado em eletrônica orgânica, mas relativamente tem recebido pouca atenção com respeito ao transporte eletrônico de cargas, bem como sua correlação com a morfologia. No Capítulo 3, experimentos com microscopia de varredura por sonda (SPM, Scanning Probe Microscopy) e medidas de condutividade macroscópica são utilizados para estudar e obter um modelo 3D morfológico completo que explica, qualitativamente, a condutividade anisotrópica observada nos filmes finos de PEDOT:PSS depositados pela técnica de spin coating. Imagens topográficas de microscopia de varredura por tunelamento (STM) e imagens da seção transversal observadas com o microscópio de forca atômica (X-AFM) revelaram que o filme fino polimérico é organizado em camadas horizontais de partículas planas ricas em PEDOT, separadas por lamelas quasi-contínuas de PSS. Na direção vertical, lamelas horizontais do isolante PSS reduzem a condutividade e impõe o transporte eletrônico a ser realizado por saltos em sítios vizinhos próximos (nn-H, nearest-neighbor hopping) nas lamellas de PSS. Na direção lateral, o transporte eletrônico via saltos 3D em sítios a longas distâncias (3D-VRH, variable range hopping) ocorre entre as ilhas ricas em PEDOT que são separadas por barreiras muito mais finas de PSS, causando um aumento da condutividade nesta direção. Esta discussão é estendida ao Capítulo 4 com uma descrição quantitativa do transporte eletrônico de cargas predominantes. Particularmente, é demonstrado que o transporte de cargas via saltos 3D em sítios a longas distâncias ocorre entre ilhas ricas em PEDOT e não entre segmentos isolados de PEDOT ou dopantes na direção lateral, enquanto que na direção vertical o transporte de cargas via saltos em sítios vizinhos próximos ocorre dentro das lamelas do quasi-isolante PSS. Em algumas aplicações, faz-se necessário usar PEDOT:PSS com alta condutividade elétrica. Isso pode ser feito adicionando-se sorbitol à solução aquosa de PEDOT:PSS. Após um tratamento térmico, e dependendo da quantidade de sorbitol adicionado, a condutividade aumenta várias ordens de grandeza e as causas e consequências de tal comportamento foram investigadas neste trabalho. O Capítulo 5 investiga as várias propriedades tecnológicas do PEDOT:PSS altamente condutivo tratado com sorbitol, tais como a própria condutividade, os efeitos dos tratamentos térmicos e exposição à umidade. É observado que o aumento da condutividade elétrica, devido à adição de sorbitol na solução aquosa, é acompanhado por uma melhoria na estabilidade da condutividade elétrica em condições atmosféricas. Surpreendentemente, a condutividade elétrica do PEDOT:PSS, sem tratamento com sorbitol (~ 10-3 S/cm), aumenta mais de uma ordem de grandeza sob ambiente úmido de 30-35 % umidade relativa. Este efeito é atribuido a uma contribuição iônica à condutividade total. Análise Temogravimetrica (TGA), espectrometria de massa com sonda de inserção direta (DIP-MS) e análise calorimétrica diferencialmodulada (MDSC) foram usadas como técnicas adicionais para o entendimento dos estudos deste Capítulo. No Capítulo 6, microscopia de varredura por sonda-Kelvin (SKPM) foi empregada para medir o potencial de superfície dos filmes finos de PEDOT:PSS tratados com diferentes concentrações de sorbitol. Mostra-se que a mudança no potencial de superfície é consistente com uma redução de PSS na superfície do filme fino. Para estudar o transporte eletrônico nos filmes finos de PEDOT:PSS altamente condutivos tratados com sorbitol, o Capítulo 7 usa medidas de temperatura e campo elétrico em função da conduvitidade correlacionados com analises morfológicas realizadas por STM. É observado que o transporte eletrônico por saltos, na direção lateral, muda de 3D-VRH para 1D-VRH quando o PEDOT:PSS é tratado com sorbitol. Esta transição é explicada por uma auto-organização das ilhas ricas em PEDOT em agregados 1D, devido ao tratamento com sorbitol, tornando-se alinhadas em domínios micrométricos, como observado pelas imagens de STM. / Employing the unique mechanical, electronic, and optical properties of the conjugated organic and polymer materials several technological and commercial applications have been developed, such as sensors, memories, solar cells and light-emitting diodes (LEDs). In this respect, the central theme of this thesis is the electrical conductivity and mechanisms of charge transport in PEDOT:PSS, a polymer blend that consists of a conducting poly(3,4-ethylenedioxythiophene) polycation (PEDOT) and a poly(styrenesulfonate) polyanion (PSS). PEDOT:PSS is omnipresent as electrode material in plastic electronics applications mentioned above. Although the conductivity of PEDOT:PSS can vary by several orders of magnitude, depending on the method by which it is processed into a thin film, the reason for this behavior is essentially unknown. This thesis describes a detailed study of the anisotropic charge transport of PEDOT:PSS and its correlation with the morphology, the shape, and the dimension of the phase separation between the two components, PEDOT and PSS. Before addressing the properties of PEDOT:PSS, a new barrier layer is described in Chapter 2 that enhances the lifetime of organic devices. An important degradation mechanism in polymer LEDs is photo-oxidation of the active layer. Hence, isolating the active layer from water and oxygen is crucial to the lifetime. Plasma-enhanced chemical vapor deposition (PECVD) is used to deposit a thin layer of carbon nitride at low deposition temperatures, below 100 °C, on a polymer LED that uses poly[2-methoxy-5-(2´-ethylhexyloxy)-1,4- phenylene vinylene] (MEH-PPV) as active layer. A thin layer of carbon nitride acts as barrier for humidity, but is still sufficiently bendable to be used in flexible polymer LEDs. The characteristics of carbon nitride and MEH-PPV films have been investigated using optical spectroscopy, with particular emphasis on the degradation process of MEH-PPV under illumination. The measurements show that the carbon nitride coating indeed protects the polymer film and diminishes the photo-oxidation considerably. To study the effect of the encapsulation in real devices, polymer LEDs were made and their current-voltage characteristics confirm the enhanced lifetime in the presence of a carbon nitride barrier layer. However, the target, a lifetime of more than 10,000 hours for commercial applications, was not achieved. The remaining chapters of this thesis describe the investigations of PEDOT:PSS. PEDOT:PSS is widely used in organic electronics. So far, relatively little attention has, been paid to the mechanisms of charge transport in this material and the correlation of those properties to the morphology. In Chapter 3, scanning probe microscopy (SPM) and macroscopic conductivity measurements are used to obtain a full 3D morphological model that explains, qualitatively, the observed anisotropic conductivity of spin coated PEDOT:PSS thin films. Topographic scanning probe microscopy (STM) and cross-sectional atomic force microscopy images (X-AFM) reveal that the thin film is organized in horizontal layers of flattened PEDOT-rich particles that are separated by quasi-continuous PSS lamella. In the vertical direction, the horizontal PSS insulator lamellas lead to a reduced conductivity and impose nearest-neighbor hopping (nn-H) transport. In the lateral direction, 3D variable-range hopping (3D-VRH) transport takes place between PEDOT-rich clusters which are separated by much thinner barriers, leading to an enhanced conductivity in this direction. This discussion is extended in Chapter 4, where a quantitative description of the length scales of the predominant transport is obtained. Particularly, it is demonstrated that the hopping process takes place between PEDOT-rich islands and not between single PEDOT segments or dopants in the lateral direction, whilst in the vertical direction the current limiting hopping transport occurs between dilute states inside the quasi-insulating PSS lamellas. By a post-treatment it is possible to modify PEDOT:PSS to raise its conductivity, by orders of magnitude. Typically, the addition of sorbitol to the aqueous dispersion of PEDOT:PSS that is used to deposit thin films via spin coating leads to an enhancement of the conductivity after thermal annealing. The causes and consequences of such behavior were investigated in detail. Chapter 5 describes the various properties of the highly conductive sorbitol-treated PEDOT:PSS, such as the conductivity itself, and the effects of thermal annealing and exposure to moisture. It is found that the conductivity enhancement upon addition of sorbitol is accompanied by a better environmental stability. Surprisingly, the electrical conductivity of PEDOT:PSS thin films without sorbitol treatment is increased by more than one order of magnitude in an environment with more than 30-35 % relative humidity. This effect is attributed to an ionic contribution to the overall conductivity. Thermal gravimetric analysis (TGA), direct insert probe-mass spectrometry (DIP-MS) and modulation differential scanning calorimetry (MDSC) were used as additional tools to demonstrate that, after thermal treatment, the concentration of sorbitol in the final PEDOT:PSS layer is negligibly small. In Chapter 6, scanning Kelvin probe microscopy (SKPM) is employed to measure the surface potential and work function of this PEDOT:PSS films that were deposited from water with different sorbitol concentrations. It is shown that work function of PEDOT:PSS is reduced with increasing sorbitol concentration. This shift can be explained by and is in agreement with- a reduction in the surface enrichment with PSS of the film. To study the charge transport properties of the highly conductive sorbitoltreated PEDOT:PSS films, temperature dependent and electric field dependent measurements are correlated with morphological analysis by STM in Chapter 7. It is found that by sorbitol treatment the hopping transport changes from 3DVRH to 1D-VRH. This transition is explained by a sorbitol-induced selforganization of the PEDOT-rich grains into 1D aggregates that are aligned within micrometer sized domains, as observed in STM images.

L'objectif de cette thèse est de développer un procédé plasma qui puisse se substituer au procédé de dépôt électrolytique de laiton, actuellement appliqué sur les fils d'acier utilisés comme matériaux de renforcement dans un pneu, pour les faire adhérer au caoutchouc. La stratégie employée consiste à déposer une couche mince organochlorée en continu sur un fil d'acier zingué, qui traverse une décharge à barrière diélectrique tubulaire, fonctionnant à la pression atmosphérique, dans une configuration fil-cylindre. Dans un premier temps, les travaux se concentrent sur la caractérisation de la décharge et de la couche mince déposée à la fois en mode statique (substrat immobile dans le réacteur) et dynamique (substrat en défilement). Des relations sont établies entre les paramètres plasma (puissance dissipée dans la décharge, fréquence de la source haute tension, flux de précurseur), les propriétés de la décharge et les caractéristiques du revêtement plasma. Des études morphologique, cinétique et chimique de la couche mince sont réalisées. Dans un second temps, la préparation de la surface du substrat et le dépôt plasma sont optimisés pour permettre d'obtenir les meilleurs niveaux d'adhésion entre l'acier zingué et le caoutchouc. À l'issue de ce travail d'optimisation, des analyses sont réalisées pour identifier la nature de la nouvelle interphase d'adhésion. Cette étude se conclut alors par une discussion sur l'origine possible des liens qui s'opèrent dans ce nouveau système / The primary objective of this thesis project is to develop a plasma process able to replace the electrolytic brass plating process, which is currently performed on steel wires used as reinforcing materials in tires to make them bond with rubber. The chosen strategy consists in depositing organo-chlorinated thin films in a continuous way on zinc-plated steel wires going across a tubular atmospheric pressure dielectric barrier discharge in a wire-cylinder configuration. In a first time, works focus on characterization of both the discharge and the plasma layer, deposited in the static (substrate stationary in the reactor) and dynamic (moving substrate) modes. Relationships are established between the plasma parameters (power dissipated in the discharge, high voltage source frequency, precursor flow rate), the discharge properties and the thin film characteristics. Morphological, kinetic and chemical studies of the plasma layer are carried out. In a second time, the substrate surface preparation and the coating are optimized to enhance the adhesion between zinc-plated steel wires and rubber. Analyses are performed to identify the new adhesion interface nature. At the end of this study, hypotheses concerning the adhesion origin in this system are formulated

Le carbure de silicium est un matériau souvent employé comme matrice dans les composites thermostructuraux. Le précurseur classiquement utilisé pour son élaboration par dépôt/infiltration par voie gazeuse est CH3SiCl3. La thèse vise à évaluer le remplacement de ce précurseur par des précurseurs gazeux bi-sourcés de SiC où carbone et silicium sont apportés séparément.A partir du système SiHCl3/C3H8/H2, l’influence du débit total, de la température, de la pression totale et de (C/Si)gaz sont évaluées et comparées aux résultats obtenus avec le système CH3SiCl3/H2. La mesure in situ de la vitesse de dépôt permet de définir des lois cinétiques apparentes. L’analyse IRTF de la phase gazeuse indique que les évolutions des pressions partielles des différents produits stables sont corrélées avec les transitions cinétiques et les changements de composition du solide. Les simulations numériques de l’évolution de la phase gazeuse montrent une bonne corrélation avec les résultats expérimentaux et permettent de proposer des mécanismes homogènes et hétérogènes qui pourraient expliquer les écarts à la stoechiométrie du dépôt.L’étude de six précurseurs supplémentaires permet de mieux identifier le rôle des principales espèces en phase homogène et hétérogène, et notamment les précurseurs effectifs de dépôt. Enfin, l’étude de l’infiltration de matériaux poreux modèles révèle des améliorations significatives en termes d’homogénéité de vitesse de dépôt.Ainsi, des conditions propices à l’infiltration de carbure de silicium peuvent être obtenues en adaptant la réactivité de la phase gazeuse par la sélection de précurseurs initiaux et des chemins réactionnels qui en découlent. / Silicon carbide (SiC) is material of choice for the matrix of Ceramic Matrix Composites (CMC).CH3SiCl3/H2 mixtures are currently used as gas precursor for the synthesis of the CVI-SiC matrices.The present work considers the dual-source approach with two separate carbon and silicon precursorsmolecules.In the case of SiHCl3/C3H8/H2 mixture, systematic studies of total flow rate, temperature, total pressureand C/Si ratio of initial gaseous phase are realized. Kinetics obtained with growth rate measurements and solid composition are compared with results from CH3SiCl3/H2 mixture. On the basis of the apparent reaction orders and activation energies, experimental kinetic laws are derived. Through IRTF analysis of the gas phase, the partial pressures of the different stable products are correlated with deposition kinetic and solid composition. Results obtained in gas-phase kinetic simulation show a good correlation with the experimental results and a mechanism of homogeneous decomposition is proposed. A better understanding of the role of the principal species in homogenous and heterogeneous phase is obtained through the study of six other gas systems and the roles of some effective precursors are discussed. Finally, infiltration results of porous material models with different precursor systems reveal significant improvements as homogeneity of kinetic deposit.Hence, favourable conditions to silicon carbide infiltration can be obtained by adapting the reactivity of the gas phase, with the choice of initial precursors and homogeneous chemistry associated. Asystematic study of the process evidences promising working windows for the infiltration of pure SiCin porous performs.

Le graphène est une simple couche de nid d'abeille motifs atomes de carbone. Il a suscité beaucoup d'intérêt dans la dernière décennie en raison de ses excellentes propriétés électroniques, optiques et mécaniques, etc., et montre larges perspectives d'applications dans le futur. Parfois, les propriétés du graphène doivent être modulées pour s’adapter à des applications spécifiques. Par exemple, le contrôle du niveau de dopage fournit un bon moyen de moduler les propriétés électriques et magnétiques de graphène, qui est important pour la conception de dispositifs de mémoire et de logique à base de graphène. En outre, la possibilité de régler la conductance électrique peut être utilisée pour fabriquer le transistor de graphène, et le dépôt chimique en phase vapeur (CVD) Procédé montre la possibilité d'effectuer la préparation de graphène intégrées dans les processus de fabrication de semi-conducteur. L'injection de spin et l'irradiation sont méthodes efficaces et pratiques pour adapter les propriétés de transport du graphène. Mais en raison du processus de fabrication complexe, il est difficile de préparer le dispositif de transport de spin graphène succès. La lithographie et décoller les processus qui impliquent utilisant résine photosensible va dégénérer les propriétés de transport du graphène. En outre, la sensibilité du graphène aux molécules H2O et O2 lorsqu'il est exposé à l’air ambiant entraînera faible signal de rotation et le bruit de fond. L'irradiation fournit une méthode propre à moduler les propriétés électriques de graphène qui n’impliquent pas de traitement chimique. En ions ou irradiation d'électrons, la structure de bande électronique de graphène peut être réglé et la structure en treillis est modulé aussi bien. En outre, les impuretés chargées et dopage résultant de l'irradiation peuvent modifier les propriétés électroniques du graphène comme la diffusion électron-phonon, libre parcours moyen et la densité de support. Comme indiqué, le graphène oxydation peut être induite par exposition à un plasma d'oxygène, et le N- dopage de graphène par recuit thermique dans de l'ammoniac a été démontré. En outre, la souche dans le graphène peut également être adaptée par irradiation, qui contribue également à la modification des propriétés de transport de graphène. En conclusion, l'irradiation fournit une méthode physique efficace pour moduler les propriétés structurelles et de transport de graphène, qui peuvent être appliqués dans la mémoire à base de graphène et des dispositifs logiques, transistor, et des circuits intégrés. Dans cette thèse, l'irradiation d'ions hélium a été réalisée sur le graphène cultivé sur substrat SiO2 par la méthode CVD, et les propriétés structurelles et de transport ont été étudiés. Le dopage de transfert de charge dans le graphène induite par les résultats d'irradiation dans une modification de ces propriétés, qui suggère une méthode pratique pour les adapter. En outre, l'irradiation par faisceau d'électrons a été effectuée sur graphène cultivé sur substrat de SiC. Les amorphisations progressives, contraintes et d'électrons dopage locales contribuent à la modification des propriétés structurelles et de transport dans le graphène qui peuvent être observés. / Graphene is a single layer of honeycomb patterned carbon atoms. It has attracted much of interest in the past decade due to its excellent electronic, optical, and mechanical properties, etc., and shows broad application prospects in the future. Sometimes the properties of graphene need to be modulated to adapt for specific applications. For example, control of doping level provides a good way to modulate the electrical and magnetic properties of graphene, which is important to the design of graphene-based memory and logic devices. Also, the ability to tune the electrical conductance can be used to fabricate graphene transistor, and the chemical vapor deposition (CVD) method shows the possibility to make the preparation of graphene integrated into semiconductor manufacture processes. Moreover, the sensitivity of graphene to the H2O and O2 molecules when exposed to the air ambient will result in weak spin signal and noise background. Irradiation provides a clean method to modulate the electrical properties of graphene which does not involve chemical treatment. By ion or electron irradiation, the electronic band structure of graphene can be tuned and the lattice structure will be modulated as well. Moreover, the charged impurities and doping arising from irradiation can change the electronic properties of graphene such as electron-phonon scattering, mean free path and carrier density. As reported, graphene oxidization can be induced by exposure to oxygen plasma, and N-Doping of Graphene through thermal annealing in ammonia has been demonstrated. Furthermore, the strain in graphene can also be tailored by irradiation, which also contributes to the modification of transport properties of graphene. In conclusion, irradiation provides an efficient physical method to modulate the structural and transport properties of graphene, which can be applied in the graphene-based memory and logic devices, transistor, and integrated circuits (ICs). In this thesis, Helium ion irradiation was performed on graphene grown on SiO2 substrate by CVD method, and the structural and transport properties were investigated. The charge transfer doping in graphene induced by irradiation results in a modification of these properties, which suggests a convenient method to tailor them. Moreover, electron beam irradiation was performed on graphene grown on SiC substrate. The local progressive amorphization, strain and electron doping contribute to the modification of structural and transport properties in graphene which can be observed.

To increase the survival rate from infectious- and noncommunicable diseases, reliable diagnostic during the preliminary stages of a disease onset is of vital importance. This is not trivial to achieve, a highly sensitive and selective detection system is needed for measuring the low concentrations of biomarkers available. One possible route to achieve this is through biosensing based on plasmonic nanostructures, which during the last decade have demonstrated impressive diagnostic capabilities. These nanoplasmonic surfaces have the ability to significantly enhance fluorescence- and Raman signals through localized hotspots, where a stronger then normal electric field is present. By further utilizing a periodic sub-wavelength nanohole array the extraordinary optical transmission phenomena is supported, which open up new ways for miniaturization. In this study a nanoplasmonic chip (NPC) composed of a nanohole array —with lateral size on the order of hundreds of nanometer— covered in a thin layer of gold is created. The nanohole array is fabricated using soft nanoimprint lithography on two resists, hydroxypropyl cellulose (HPC) and polymethyl methacrylate (PMMA). An in depth analysis of the effect of thickness is done, where the transmittance and Raman scattering (using rhodamine 6G) are measured for varying gold layers from 5 to 21 nm. The thickness was proved to be of great importance for optimizing the Raman enhancement, where a maximum was found at 13 nm. The nanohole array were also in general found beneficial for additionally enhancing the Raman signal. A transmittance minima and maxima were found in the region 200-1000 nm for the NPCs, where the minima redshifted as the thickness increased. The extraordinary transmission phenomena was however not observed at these thin gold layers. Oxygen plasma treatment further proved an effective treatment method to reduce the hydrophobic properties of the NPCs. Care needs be taken when using thin layers of gold with a PMMA base, as the PMMA structure could get severely damaged by the plasma. HPC also proved inadequate for this projects purpose, as water-based fluids easily damaged the surface despite a deposited gold layer on top.

Harte amorphe wasserstoffhaltige Kohlenstoffschichten (a-C:H) haben in den letzten Jahrzehnten stark an Bedeutung gewonnen. Diese Art von Hartstoffschichten wird zunehmend für die Reduzierung von Reibung und Verschleiß in unterschiedlichen Bereichen eingesetzt. In der Forschung, aber auch für Kleinserien, werden a-C:H-Schichten üblicherweise mit Hochfrequenzplasmaentladungen abgeschieden. Eine Alternative ist die Plasmaaktivierung mit einer asymmetrisch bipolar gepulsten Spannung im Mittelfrequenzbereich. Auf diese Weise wird eine homogene Beschichtung großer Substratflächen mit qualitativ hochwertigen Schichten ermöglicht. Die vorliegende Arbeit beschäftigt sich mit der plasmagestützten Abscheidung von harten a-C:H-Schichten mit mittelfrequenzgepulsten Entladungen. Zur Schichtabscheidung werden Ethin-Argon- und Isobuten-Argon-Gasgemische verwendet. Der Einfluss des Prozessdrucks auf den Abscheideprozess und die Schichteigenschaften wird untersucht. Dazu wurden Argonentladungen und Beschichtungsplasmen mittels optischer Emissionsspektroskopie charakterisiert. Zur Charakterisierung der Schichteigenschaften wurden unter anderem Nanoindentation-Messungen, elastische Rückstreudetektionsanalysen und thermische Desorptionsspektroskopie verwendet. Zur Untersuchung des Einflusses der Ionen auf das Schichtwachstum wird ein Modell zur Identifizierung von Ionenspezies in Beschichtungsplasmen vorgestellt. In Verbindung mit der Messung der Substratströme konnte der Ionenanteil am Schichtwachstum bestimmt werden. Ein weiterer Teil der vorliegenden Arbeit untersucht ein Hybridverfahren, in dem die mittelfrequenzgepulste Entladung mit einer zusätzlichen ECR-Entladung kombiniert wird. Es wird gezeigt, dass durch dieses Hybridverfahren eine deutliche Steigerung der Abscheiderate harter a-C:H-Schichten erreicht werden kann. Die abgeschiedenen Schichten wurden zusätzlich bezüglich ihrer Oberflächenstruktur und ihrer Verschleißfestigkeit untersucht.