A crescente utilização de equipamentos inteligentes na área de automação industrial tem assegurado eficiência e qualidade na produção. Em conseqüência deste crescimento, existe uma grande quantidade de equipamentos interligados abrangendo áreas geográficas distantes. Este cenário criou a demanda de sistemas que permitissem o acesso às informações geradas no chão de fábrica a partir de qualquer computador localizado na área industrial ou em qualquer outro ponto do planeta. A Internet propiciou uma nova opção para gerenciamento e monitoramento de equipamentos inteligentes a longa distância. Assim, este trabalho propõe um algoritmo para monitorar, via Internet, os eventos gerados por equipamentos inteligentes instalados em plantas industriais. Com o monitoramento contínuo, é possível analisar o desempenho dos equipamentos, detectar problemas e tomar decisões de forma a garantir que toda uma malha de controle não venha a parar inesperadamente. / The increasing usage of smart field devices in the industrial automation area has assured efficiency and quality of production. Thanks to this expansion, a large number of devices can be interconnected through distant geographical areas. This scenario created the need of computational systems that would make the information from the plant floor accessible to any computer in the local industrial area or any other earth wide location. The Internet has created a new possibility of remote managing and monitoring of smart devices. This work proposes an algorithm to monitor, via Internet, the events generated by smart devices installed in industrial plants. The continuous monitoring makes it possible to analyze the performance of the devices, detect problems and make decisions to ensure that an entire control loop does not come to an unexpected halt.

Submitted by isabela.moljf@hotmail.com (isabela.moljf@hotmail.com) on 2016-08-16T12:25:59Z No. of bitstreams: 1 thaylasoarespaixao.pdf: 1445990 bytes, checksum: fe8b8cd6a930406b786e040447c5ff0f (MD5) / Approved for entry into archive by Adriana Oliveira (adriana.oliveira@ufjf.edu.br) on 2016-08-16T12:54:18Z (GMT) No. of bitstreams: 1 thaylasoarespaixao.pdf: 1445990 bytes, checksum: fe8b8cd6a930406b786e040447c5ff0f (MD5) / Approved for entry into archive by Adriana Oliveira (adriana.oliveira@ufjf.edu.br) on 2016-08-16T12:54:28Z (GMT) No. of bitstreams: 1 thaylasoarespaixao.pdf: 1445990 bytes, checksum: fe8b8cd6a930406b786e040447c5ff0f (MD5) / Made available in DSpace on 2016-08-16T12:54:28Z (GMT). No. of bitstreams: 1 thaylasoarespaixao.pdf: 1445990 bytes, checksum: fe8b8cd6a930406b786e040447c5ff0f (MD5) Previous issue date: 2016-04-28 / FAPEMIG - Fundação de Amparo à Pesquisa do Estado de Minas Gerais / Este estudo busca analisar o projeto de educação integral conduzido pelo CENPEC na realidade educacional pública brasileira. As questões norteadoras da pesquisa são as seguintes: Em que consiste a formulação de educação integral do CENPEC para a educação escolar pública brasileira? Como o CENPEC difunde tal formulação? O objetivo geral foi assim delineado: analisar as formulações políticas e pedagógicas do CENPEC sobre educação integral para a escola pública brasileira. Os objetivos específicos foram: identificar e analisar a concepção pedagógica que fundamenta as formulações do CENPEC sobre educação integral; identificar e analisar as possíveis estratégias políticas de difusão de tais formulações no campo educacional. Para responder as questões norteadoras e os objetivos, realizamos uma pesquisa documental referenciada no materialismo histórico. O corpus documental envolveu documentos autorais e/ou que contaram com a participação do CENPEC em sua elaboração. Foram analisadas quinze publicações a partir de três categorias de pesquisa, quais sejam: (1) ―Projeto de Educação Escolar‖; (2) ―Trabalho Educativo‖; e (3) Redes de Articulação Política. No primeiro capítulo, empreendemos a discussão sobre a dialética entre classe social e educação, fato que nos possibilitou definir as categorias de análise. No segundo, discutimos sobre as reformas educativas coordenadas pelos empresários no interior da ―mundialização da educação‖, evidenciado os princípios e os eixos das reformas. No terceiro, buscamos identificar como a temática educação integral foi conduzida no período de 1985 a 2015, considerando o posicionamento do CENPEC. No quarto, falamos especificamente sobre o CENPEC, considerando a trajetória de sua fundadora e a trajetória do organismo no campo da educação escolar. No quinto, realizamos a exposição dos resultados de análise sobre o projeto de educação integral do CENPEC com base nas três categorias. Em síntese, a pesquisa revela que o projeto de educação integral do CENPEC vai ao encontro dos princípios e eixos contidos nas reformas educacionais neoliberais. O CENPEC também busca redefinir a responsabilidade pelo trabalho educativo e passa a difundir orientações pedagógicas pragmáticas que secundarizam o papel do conhecimento sistematizado. Para afirmar o seu projeto de educação integral, o CENPEC estabelece conexões políticas com organizações da sociedade civil e instâncias da aparelhagem estatal, aumentando as chances de legitimar as suas expectativas e valores na formação humana dos filhos da classe trabalhadora. / This study aims at analyzing the educational project carried out by CENPEC in the reality of Brazilian public education. The research‘s guiding questions are the following: in what consists the formulation of CENPEC‘s full-time education for the Brazilian public scholarly education? How is such formulation disseminated by CENPEC? The general obejective was, thus outlined: to analyze CENPEC‘s political and pedagogical formulations regarding fulltime education for the Brazilian public schools. The specific objectives were: identifying and analyzing the pedagogical conception which grounds the CENPEC‘s formulations about fulltime education; identifying the possible political strategies for the dissemination of these formulations in the educational field. In order to answer the guiding questions and the objectives, we carried out a documental research referenced in historical materialism. The documental corpus involved documents created by us and/or elaborated in partnership with CENPEC. Fifteen publications were analyzed comprehending three research categories, which are: (1) ―Scholarly Educational Project‖; (2) ―Educational Work‖; e (3) ―Public Articulation Networking‖. In the first chapter, we raised a discussion about the dialetics between social class and education, a fact which enabled us to define the categories for analysis. In the second, we discussed about the educational reforms coordinated by the entrepreneurs within the ―globalization of education‖, evidencing the principles and articulations of such reforms. In the third chapter, we aimed at identifying how the theme of full-time education was conducted in the period from 1985 to 2015, considering CENPEC‘s position. In the fourth, when we talk specifically about CENPEC, considering its founder‘s trajectory and also that of the organization in the educational field. In the fifth chapter, we showed the analysis‘s results about the CENPEC‘S educational project based on three categories. To sum up, the research reveals that CENPEC‘s educational Project meets the principles and guidelines contained in the neoliberal educational reforms. CENPEC also aims at redefining the responsibility for the educational work and disseminates pedagogical pragmatic orientations which diminishes the role of systematized knowledge. In order to affirm its full-time educational project, CENPEC establishes political connections with civil organizations and state instances, enhancing the chances of legitimating its expectations and values in the humane formation of working-class children.

Submitted by Michele Mologni (mologni@unoeste.br) on 2017-08-30T13:15:11Z No. of bitstreams: 1 Fláive Loyze Baldassarini Silva.pdf: 2001999 bytes, checksum: e6f3c3f0169423517f9b8ffac6f5f788 (MD5) / Made available in DSpace on 2017-08-30T13:15:11Z (GMT). No. of bitstreams: 1 Fláive Loyze Baldassarini Silva.pdf: 2001999 bytes, checksum: e6f3c3f0169423517f9b8ffac6f5f788 (MD5) Previous issue date: 2017-06-27 / The association between proline metabolism in the plant and the pentose phosphate pathway has been proposed as a model to stimulate one of the biosynthetic routes of secondary metabolism related to the production of the different phenolic compounds in plants, known as the shikimic acid pathway. In transgenic plants in which overexpression of the P5CS gene Δ1-pyrroline-5-carboxylate synthetase encoding the key enzyme of proline biosynthesis occurs, in addition to increased tolerance to abiotic stresses, there is the possibility of promoting the synthesis of phenolic compounds as a pleiotropic effect. The objective of this work was to evaluate the role of proline "per se" in relation to the production of phenolic compounds in transgenic tobacco plants accumulating this amino acid (Nicotiana tabacum cv. Petit Havana SR1) and to verify if water stress would modify this answer. The experiment was carried out under greenhouse conditions, at Campus II of Universidade do Oeste Paulista, Presidente Prudente - SP. A completely randomized design was used in the factorial scheme 3x2 consisting of 3 genotypes (two transgenic events with constitutive expression 35S::P5CSF129A and untransformed control plants) and two levels of water regime, with daily water replenishment of 100% and 30% of field capacity (water stress). The role of proline "per se" was evaluated by means of biometric growth analyzes (plant height, shoot and root dry mass and leaf number) in addition to proline analyzes, glucose-6-phosphate dehydrogenase activity (G6PDH), phenylalanine ammonia lyase (PAL), total phenolic compounds in leaves and lignin. In a natural response to water stress, a reduction in biometric parameters was observed for all genotypes. The accumulation of proline occurred in a greater proportion in the transgenic plants as expected by the constitutive expression of the P5CS gene, but the activity of the G6PDH enzyme was lower in the transgenic plants. The link between increased proline endogenous content and increased phenol synthesis occurred both under normal hydration conditions (for E2 event) and in the presence of water stress (for both transgenic events), as well as PAL activity. Lignin contents increased in all genotypes in response to stress. Thus, the results of this research lead us to affirm the existence of distinct responses between exogenous application of proline reported in the literature and endogenous cellular metabolism. It was not possible to confirm the hypothesis that the proline metabolism linked to the pentose phosphate pathway induces the synthesis of phenolic compounds, since the activity of the G6PDH enzyme was lower in the transgenic plants in the two water conditions. It is suggested that the precursors to the pathway of phenolic compounds linked to proline may be provided by other metabolic pathways such as glycolysis and the Calvin cycle. Further study will be needed to clarify this issue. / A associação entre o metabolismo de prolina na planta e a via pentose fosfato tem sido proposta como um modelo para se estimular uma das rotas do metabolismo secundário relacionada à produção dos diferentes compostos fenólicos em plantas, denominada via do ácido chiquímico. Em plantas transgênicas nas quais ocorrem a superexpressão do gene P5CS Δ1-pirrolina-5-carboxilato sintetase, que codifica a enzima-chave da biossíntese de prolina, além do aumento de tolerância a estresses abióticos, existe a possibilidade de promoção da síntese de compostos fenólicos como um efeito pleiotrópico. O objetivo deste trabalho foi avaliar o papel da prolina “per se” em relação à produção de compostos fenólicos em plantas transgênicas de tabaco acumuladoras deste aminoácido (Nicotiana tabacum cv. Petit Havana SR1) e verificar se o estresse hídrico modificaria essa resposta. O experimento foi realizado em condições de casa de vegetação, no Campus II da Universidade do Oeste Paulista, Presidente Prudente - SP. Utilizou-se o delineamento experimental em arranjo inteiramente casualizado, no esquema fatorial 3x2, formado por 3 genótipos (dois eventos transgênicos com expressão constitutiva 35S::P5CSF129A e plantas controle não transformadas) e dois níveis de regime hídrico, com reposições diárias de água de 100% e de 30% da capacidade de campo (estresse hídrico). O papel da prolina “per se” foi avaliado por meio de análises biométricas de crescimento (altura de plantas, massas seca de parte aérea e raiz e número de folhas) além das análises de prolina, atividade das enzimas glicose-6-fosfato-desidrogenase (G6PDH), fenilalanina amônia liase (FAL), compostos fenólicos totais nas folhas e lignina. Em resposta natural ao estresse hídrico, foi observado uma redução nos parâmetros biométricos para todos os genótipos. O acúmulo de prolina ocorreu em maior proporção nas plantas transgênicas como esperado pela expressão constitutiva do gene P5CS, porém a atividade da enzima G6PDH foi menor nas plantas transgênicas. A vinculação entre um maior conteúdo endógeno de prolina com a síntese aumentada de fenóis ocorreu tanto em condições normais de hidratação (para o evento E2) como na presença de estresse hídrico (para ambos os eventos transgênicos), assim como a atividade da FAL. Os teores de lignina aumentou em todos os genótipos em resposta ao estresse. Desta forma, os resultados dessa pesquisa levam-nos a afirmar a existência de respostas distintas entre aplicação exógena de prolina relatada na literatura e o metabolismo endógeno celular. Não foi possível confirmar a hipótese de que o metabolismo de prolina vinculado à via pentose fosfato induz a síntese de compostos fenólicos, pois a atividade da enzima G6PDH foi menor nas plantas transgênicas nas duas condições hídricas. Sugere-se que os precursores para a via dos compostos fenólicos ligados a prolina podem ser fornecidos por outras vias metabólicas tais como a glicólise e o ciclo de Calvin. Estudos mais aprofundados serão necessários para esclarecer esta questão.

Neste estudo, foi investigado o efeito da dieta larval no desenvolvimento de características morfológicas casta-específicas e na expressão de alguns genes durante o desenvolvimento da abelha sem ferrão Scaptotrigona aff. depilis . Nesta espécie, as castas femininas são determinadas pela quantidade de alimento consumida durante o desenvolvimento larval. Grupos experimentais larvas criadas in vitro foram feitos com duas quantidades diferentes de alimento larval, obtido de favos recém provisionados nesta espécie. As larvas do primeiro grupo receberam 32l de alimento larval, correspondente a quantidade média de alimento recebida por larvas de operárias naturalmente, já as larvas do segundo grupo receberam 130l, correspondente a quantidade média encontrada naturalmente em células reais. Todas as larvas criadas com 130l de alimento larval se desenvolveram em rainhas, como esperado; da mesma forma, a maioria das larvas criadas com 32l se desenvolveram em operárias. Interessantemente, porém, algumas larvas deste grupo se desenvolveram em rainhas miniaturas, sugerindo que outros fatores, além do trófico, estejam envolvidos na determinação de castas em S. aff. depilis. Subsequentemente, analisamos os títulos de hormônio juvenil (HJ) na hemolinfa por radioimunoensaio durante quatro estágios do último instar larval e encontramos que as larvas do grupo de 130l de dieta apresentaram maiores títulos no estágio defecante (LD) (p=0,034, t-test), se comparado com as larvas do grupo de 32l. Os níveis de expressão de determinados genes que foram previamente descritos em outras espécies como expressos preferencialmente em rainhas. Um destes genes, dnmt-3, codifica a DNA metiltransferase envolvida na metilação do DNA. Para este gene, encontramos maiores níveis de transcritos nas larvas alimentadas como rainhas (130l) nos estágios LPD e LD (p=0,029, Mann-Whitney), do que as larvas que receberam 32l. Analisamos também dois genes envolvidos no metabolismo do HJ, e para um deles, jheh, codificador de uma epóxido-hidrolase do hormônio juvenil, não encontramos diferença nos níveis de mRNA entre larvas de rainhas e operárias. Para jhe, o qual codifica a esterase do hormônio juvenil, encontramos maiores níveis de transcritos no estágio LD nas larvas criadas com 130l de alimento. Isso indica que a expressão de jhe pode ser induzida pelo aumento dos títulos de HJ neste estágio. Os dois genes, hmgr e mfe, envolvidos no passo inicial e final da síntese do HJ, respectivamente, o primeiro mostrou uma pequena variação nos níveis de expressão, sendo que a expressão de mfe foi menor nas larvas criadas com 32l de alimento larval e foi encontrado um pico de expressão no estágio LPD nas larvas alimentadas com 130l. O produto desse gene, metilfarnesoato epoxidase, está envolvido no passo limitante da síntese de HJ em Apis mellifera. Dois outros genes analisados foram o homólogo ao EcR, codificador do receptor de ecdisona e o usp, codificador do potencial receptor do HJ. Seus níveis de expressões foram maiores nos estágios LPD e LD, respectivamente, nas larvas alimentadas com 130l de alimento e os níveis de EcR se correlacionaram com o perfil dos títulos de ecdisona e os de usp com os títulos de HJ, publicados para esta espécie. Não houve diferença nos níveis de expressão dos genes selecionados que pudessem relacionar ou permitir distinguir as rainhas miniaturas das operárias durante os estágios do desenvolvimento estudados. Uma análise morfométrica de adultos faratos indica claramente que as rainhas miniaturas são rainhas autênticas. / In this work we investigated the role played by the larval diet in the development of caste-specific morphological traits and in the expression of candidate genes during the development of the stingless bees, Scaptotrigona aff. depilis. In this species, the female castes are determinate by the amount of food consume during larval development. Experimental groups of larvae were reared in vitro on two different quantities of larval food obtained from newly provisioned brood cells of this species. Larvae of the first group received 32l of larval food, corresponding to the quantity usually received by the workers larva, whereas larvae of the second group received 130l, corresponding to the quantity normally deposited in queen cells. All larvae reared on 130l of larval food developed into queens, as expected, and similarly, most of the larvae reared on 32l developed into workers. Interestingly, however, some larvae of this group developed into miniature queens, suggesting that factors additional to the trophic ones may be involved in caste determination in S. aff. depilis. We subsequently analyzed the hemolymph juvenile hormone (JH) titers by radioimmunoassay during four stages of the last larval instar and we found that larvae of the 130l diet group had higher JH titer in the defecating stange (LD) (p=0,034, t-test) than larvae of the 32l diet group. Next we analyzed the expression levels of set of candidate genes that had previously been described as preferentially expressed in queens of others bee species. One of these genes dnmt-3, encodes DNA methyltransferase involved in DNA methylation. For this gene we found higher transcripts levels in prospective queens during the final larval stage (both in pre-defecating larvae LPD and defecating larvae- LD) (p=0,029, Mann-Whitney). We also analyzed two genes involved in JH metabolism, and for one of them jheh, encoding a juvenile hormone epoxide hydrolase, we did not find any differences in mRNA levels for queens and workers larvae. For jhe, which codes juvenile hormone esterase we found higher transcript levels in the LD stage in larvae reared on 130l of larval food. This indicates that jhe expression may be induced by an elevated JH titer during this stage. For two genes, hmgr and mfe, involved in an initial and a final step of JH synthesis, respectively, the first one showed little variation in expression levels, whereas mfe expression was lower in larvae reared on 32l of larval food and we found an expression peak in the LPD stage (p=0,029, Mann-Whitney) of larvae reared on 130l larval food. The product of this gene, a methylfarnesoate epoxidase, has been shown to be involved in a rate-limiting step of JH sunthesis in the honey bee, Apis mellifera. The other two genes analyzed were the EcR homolog encoding an ecdysone receptor and usp coding for potencial JH receptor. Their expressions were higher during LPD (p=0,006, t-test) stages and LD (p=0,026, t-test), respectively, in larvae fed with 130l of food and the levels of transcripts of EcR correlated with changes in the ecdysone titer and usp with the JH titer published for this species. We did not find differences in expressions levels for any of these candidate genes that could related to and allow to distinguish between prospective miniature queens and workers in these stages. A morphometric analysis of pharate adults, however, clearly demonstrated that the miniature queens are authentic queens.

The present study has been based on the investigation about the origin and evolution of the Fourteen Stations of the Cross that make up the Viacrucis, the revision of sources documents and their iconographic repercussion throughout history. In the XVIII century, the Franciscan Leonardo of Porto Mauricio established the basis for unifying a series of Christian devotions which, despite having a common spiritual substrate based on the mysticism exacerbated by the human nature of Christ and the pathos of the cross, lacked unity of worship and official recognition by the Church. During the first half of the eighteenth century, the Catholic spiritual exercise of the Viacrucis was finally established as the only devotional form dedicated to the Way of the Cross recognized by the Papacy, based on follow the steps that Christ walked carrying the cross until his death through the meditation by fourteen scenes, known as stations. The complex development of Passionist spirituality, cradle of the Viacrucis, had two main focuses: Europe where, especially from the Middle Ages, there arose an endless devotions to the passion of Jesus resulting from the rise of spiritual and mystical literature; and Jerusalem, where European pilgrims traveled to visit the Holy Places. Both centers had a vital interrelationship for the birth of the stations of the Viacrucis. While travelers wanted to know the Palestinian sites that European spirituality had imagined, the European faithful wanted to recreate in their land the sites described by the pilgrims, especially those of the passion suffered by Christ, which they could hardly access in any other way. In this intricate historical development are located the keys to the theoretical and iconographic understanding that supports the functional and aesthetic value of the art of Viacrucis, born after the official devotion establishment to which the Way of the Cross makes reference in the eighteenth century, and reasoned not only on the New Testament Gospels, but also in the underlying tradition of Passionist apocryphal texts and mystical and spiritual literature. / El presente estudio se ha fundamentado en la investigación del origen y evolución de las Catorce Estaciones que conforman el Viacrucis, la revisión de las fuentes escritas y su repercusión iconográfica a lo largo de la historia. En el siglo XVIII, el franciscano Leonardo de Porto Mauricio estableció las bases que unificaran una serie de devociones cristianas que, pese a tener un sustrato espiritual común basado en el misticismo exacerbado hacia la naturaleza humana de Cristo y hacia el pathos de la cruz, carecían de unidad de culto y de reconocimiento oficial por parte de la Iglesia. Durante la primera mitad del siglo XVIII, quedó finalmente establecido el ejercicio espiritual católico del Viacrucis como la única forma devocional dedicada al Camino de la Cruz reconocida por el Papado, basada en seguir los pasos que Jesucristo recorrió cargado con la cruz hasta su muerte mediante la meditación de catorce escenas, conocidas como estaciones. El complejo desarrollo de la espiritualidad pasionista, cuna del Viacrucis, tuvo dos focos principales: Europa donde, especialmente a partir de la Edad Media, surgieron un sinfín de devociones a la Pasión de Jesús resultado del auge de la literatura espiritual y mística; y Jerusalén, donde los peregrinos europeos viajaban para visitar los Santos Lugares. Ambos focos tuvieron una estrecha interrelación vital para el nacimiento de las estaciones del Viacrucis pues, mientras que los viajeros querían conocer los lugares palestinos que la espiritualidad europea había imaginado, los fieles europeos querían recrear en su tierra los sitios descritos por los peregrinos, especialmente los de la Pasión sufrida por Cristo, a los cuales difícilmente podrían acceder de otra forma. En este intrincado desarrollo histórico se sitúan las claves para la comprensión teórica e iconográfica que sustenta el valor funcional y estético del Viacrucis artístico, nacido tras el establecimiento oficial de la devoción a la que hace referencia en el siglo XVIII, y fundamentado no sólo en las narraciones neotestamentarias, sino en la tradición subyacente de los textos apócrifos y de la literatura mística y espiritual pasionistas. / El present estudi s'ha fonamentat en la investigació de l'origen i evolució de les Catorze Estacions que conformen el Viacrucis, la revisió de les fonts escrites i la seua repercussió iconogràfica al llarg de la història. En el segle XVIII, el franciscà Leonardo de Porte Mauricio va establir les bases que unificaren una sèrie de devocions cristianes que, a pesar de tindre un substrat espiritual comú basat en el misticisme exacerbat cap a la naturalesa humana de Crist i cap al pathos de la creu, no tenien unitat de culte i de reconeixement oficial per part de l'Església. Durant la primera meitat del segle XVIII, va quedar finalment establit l'exercici espiritual catòlic del Viacrucis com l'única forma devocional dedicada al Camí de la Creu reconeguda pel Papat, basada a seguir els passos que Jesucrist va recórrer carregat amb la creu fins a la seua mort per mitjà de la meditació de catorze escenes, conegudes com a estacions. El complex desenvolupament de l'espiritualitat passionista, bressol del Viacrucis, va tindre dos focus principals: Europa on, especialment a partir de l'Edat Mitjana, van sorgir una infinitat de devocions a la passió de Jesús resultat de l'auge de la literatura espiritual i mística; i Jerusalem, on els pelegrins europeus viatjaven per a visitar els Sants Llocs. Ambdós focus van tindre una estreta interrelació vital per al naixement de les estacions del Viacrucis perquè, mentre que els viatgers volien conéixer els llocs palestins que l'espiritualitat europea havia imaginat, els fidels europeus volien recrear en la seua terra els llocs descrits pels pelegrins, especialment els de la Passió patida per Crist, als quals difícilment podrien accedir d'una altra forma. En aquest intricat desenvolupament històric se situen les claus per a la comprensió teòrica i iconogràfica que sustenta el valor funcional i estètic del Viacrucis artístic, nascut després de l'establiment oficial de la devoció a què fa referència en el segle XVIII, i fonamentat no sols en les narracions neotestamentàries, sinó en la tradició subjacent dels textos apòcrifs i de la literatura mística i espiritual passionistes. / Buleo Espada, MI. (2017). EL VIACRUCIS TRADICIONAL. REVISIÓN HISTÓRICO-ARTÍSTICA SOBRE EL ORIGEN Y EVOLUCIÓN DE LAS CATORCE ESTACIONES DE LA CRUZ. REPERCUSIÓN ICONOGRÁFICA EN LOS TEMAS DE LA PASIÓN [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/90543 / TESIS

In this paper, processing effects of electroplating and post- plating annealing on via extrusion are investigated. The study is based on two TSV structures with identical geometry but different processing conditions. Via extrusion, stress and material behaviors of the TSV structures were first compared. Electron backscatter diffraction (EBSD) and time-of-flight secondary ion mass spectroscopy (TOF-SIMS) were used to characterize the microstructure of TSVs and the additives incorporated during electroplating. Based on the results, processing effects on via extrusion and its mechanism are discussed, including grain growth, local plasticity, and diffusional creep.

For mobile electronics such as Smartphones, Smartcards or wearable devices there is a trend towards an increasing functionality as well as miniaturisation. In this development Micro Electro- Mechanical Systems (MEMS) are an important key element for the realisation of functions such as motion detection. The specifications given by such devices together with the limited available space demand advanced packaging technologies. The 3D-Wafer Level Packaging (3D-WLP) enables one solution for a miniaturised MEMS package by using techniques such as Wafer Level Bonding (WLB) and Through Silicon Vias (TSV). This technology increases the effective area of the MEMS device by elimination dead space, which is typically required for other approaches based on wire bond assembly. Within this thesis, different TSV technology concepts with respect to a 3D-WLP for MEMS have been developed. Thereby, the focus was on a copper based technology as well as on two major TSV implementation methods. This comprises a Via Middle approach based on the separated TSV fabrication in the cap wafer as well as a Via Last approach with a TSV implementation in either the MEMS or cap wafer, respectively. For each option with its particular challenges, corresponding process modules have been developed. In the Via Middle approach, the wafer-related etch rate homogeneity determines the TSV reveal from the wafer backside Here, a reduction of the TSV depth down to 80 μm is favourable as long as the desired Cu-thermo-compression bonding (Cu-TCB) is performed before the thinning. For the TSV metallisation, a Cu electrochemical deposition method was developed, which allows the deposition of one redistribution layer as well as the bonding patterns for Cu-TCB at the same time. In the Via Last approach, the TSV isolation represents one challenge. Chemical Vapour Deposition processes have been investigated, for which a combination of PE-TEOS and SA-TEOS as well as a Parylene deposition yield the most promising results. Moreover, a method for the realisation of a suitable bonding surface for the Silicon Direct Bonding method has been developed, which does not require any wet pre treatment of the fabricated MEMS patterns. A functional MEMS acceleration sensor as well as Dummy devices serve as demonstrators for the overall integration technology as well as for the characterisation of electrical parameters. / Im Bereich mobiler Elektronik, wie z.B. bei Smartphones, Smartcards oder in Kleidung integrierten Geräten ist ein Trend zu erkennen hinsichtlich steigender Funktionalität und Miniaturisierung. Bei dieser Entwicklung spielen Mikroelektromechanische Systeme (MEMS) eine entscheidende Rolle zur Realisierung neuer Funktionen, wie z.B. der Bewegungsdetektion. Die Anforderungen derartiger Bauteile zusammen mit dem begrenzten zur Verfügung stehenden Platz erfordern neuartige Technologien für die Aufbau- und Verbindungstechnick (engl. Packaging) der Bauteile. Das 3D-Wafer Level Packaging (3D-WLP) ermöglicht eine Lösung für eine miniaturisierte MEMS-Bauform unter Nutzung von Techniken wie dem Waferlevelbonden (WLB) und den Siliziumdurchkontaktierungen (TSV von engl. Through Silicon Via). Diese Technologie erhöht die effektive aktive Fläche des MEMS Bauteils durch die Reduzierung von Toträumen, welche für andere Ansätze wie der Drahtbond-Montage üblich sind. In der vorliegenden Arbeit wurden verschiedene Technologiekonzepte für den Aufbau von 3D-WLP für MEMS erarbeitet. Dabei lag der Fokus auf einer Kupfer-basierten Technologie sowie auf zwei prinzipiellen Varianten für die TSV-Implementierung. Dies umfasst den Via Middle Ansatz, welcher auf der TSV Herstellung auf einem separaten Kappenwafer beruht, sowie den Via Last Ansatz mit einer TSV Herstellung entweder im MEMS-Wafer oder im Kappenwafer. Für beide Varianten mit individuellen Herausforderungen wurden entsprechende Prozessmodule entwickelt. Beim Via Middle Ansatz ist die Wafer-bezogene Ätzratenhomogenität des Siliziumtiefenätzen entscheidend für das spätere Freilegen der TSVs von der Rückseite. Hier hat sich eine Reduzierung der TSV-Tiefe auf bis zu 80 μm vorteilhaft erwiesen insofern, das Kupfer-Thermokompressionsbonden (Cu-TKB) vor dem Abdünnen erfolgt. Zur Metallisierung der TSVs wurde ein Cu Galvanikprozess erarbeitet, welcher es ermöglicht gleichzeitig eine Umverdrahtungsebene sowie die Bondstrukturen für das Cu-TKB zu erzeugen. Beim Via Last Ansatz ist die TSV Isolation eine Herausforderung. Es wurden CVD (Chemische Dampfphasenabscheidung) Prozesse untersucht, wobei eine Kombination aus PE-TEOS und SA-TEOS sowie eine Parylene Beschichtung erfolgversprechende Ergebnisse liefern. Des Weiteren wurde eine Methode zur Erzeugung bondfähiger Oberflächen für das Siliziumdirektbonden erarbeitet, welche eine Nass-Vorbehandlung des MEMS umgeht. Ein realer MEMS-Beschleunigungssensor sowie Testaufbauten dienen zur Demonstration der Gesamtintegrationstechnologie sowie zur Charakterisierung elektrischer Parameter.

For mobile electronics such as Smartphones, Smartcards or wearable devices there is a trend towards an increasing functionality as well as miniaturisation. In this development Micro Electro- Mechanical Systems (MEMS) are an important key element for the realisation of functions such as motion detection. The specifications given by such devices together with the limited available space demand advanced packaging technologies. The 3D-Wafer Level Packaging (3D-WLP) enables one solution for a miniaturised MEMS package by using techniques such as Wafer Level Bonding (WLB) and Through Silicon Vias (TSV). This technology increases the effective area of the MEMS device by elimination dead space, which is typically required for other approaches based on wire bond assembly. Within this thesis, different TSV technology concepts with respect to a 3D-WLP for MEMS have been developed. Thereby, the focus was on a copper based technology as well as on two major TSV implementation methods. This comprises a Via Middle approach based on the separated TSV fabrication in the cap wafer as well as a Via Last approach with a TSV implementation in either the MEMS or cap wafer, respectively. For each option with its particular challenges, corresponding process modules have been developed. In the Via Middle approach, the wafer-related etch rate homogeneity determines the TSV reveal from the wafer backside Here, a reduction of the TSV depth down to 80 μm is favourable as long as the desired Cu-thermo-compression bonding (Cu-TCB) is performed before the thinning. For the TSV metallisation, a Cu electrochemical deposition method was developed, which allows the deposition of one redistribution layer as well as the bonding patterns for Cu-TCB at the same time. In the Via Last approach, the TSV isolation represents one challenge. Chemical Vapour Deposition processes have been investigated, for which a combination of PE-TEOS and SA-TEOS as well as a Parylene deposition yield the most promising results. Moreover, a method for the realisation of a suitable bonding surface for the Silicon Direct Bonding method has been developed, which does not require any wet pre treatment of the fabricated MEMS patterns. A functional MEMS acceleration sensor as well as Dummy devices serve as demonstrators for the overall integration technology as well as for the characterisation of electrical parameters.:Bibliographische Beschreibung 3 Vorwort 13 List of symbols and abbreviations 15 1 Introduction 23 2 Fundamentals on MEMS and TSV based 3D integration 25 2.1 Micro Electro-Mechanical systems 25 2.1.1 Basic Definition 25 2.1.2 Silicon technologies for MEMS 26 2.1.3 MEMS packaging 29 2.2 3D integration based on TSVs 33 2.2.1 Overview 33 2.2.2 Basic processes for TSVs 34 2.2.3 Stacking and Bonding 47 2.2.4 Wafer thinning 48 2.3 TSV based MEMS packaging 50 2.3.1 MEMS-TSVs 50 2.3.2 3D-WLP for MEMS 52 3 Technology development for a 3D-WLP based MEMS 57 3.1 Target integration approach for 3D-WLP based MEMS 57 3.1.1 MEMS modules using 3D-WLP based MEMS 57 3.1.2 Integration concepts 58 3.2 Objective and requirements for the proposed 3D-WLP of MEMS 60 3.2.1 Boundary conditions 60 3.2.2 Technology concepts 63 3.3 Selected approaches for TSV implementation in MEMS 64 3.3.1 Via Last Technology 64 3.3.2 Via Middle technology 69 4 Development of process modules 75 4.1 Characterisation 75 4.2 TSV related etch processes 77 4.2.1 Equipment 77 4.2.2 Deep silicon etching 78 4.2.3 Etching of the buried dielectric layer 84 4.2.4 Patterning of TSV isolation liner – spacer etching 90 4.2.5 Summary 92 4.3 TSV isolation 93 4.3.1 Principle considerations 93 4.3.2 Experiment 95 4.3.3 Results 97 4.3.4 Summary 102 4.4 Metallisation of TSV and RDL 103 4.4.1 Plating base and experimental setup 103 4.4.2 Investigations related to the ECD process 106 4.4.3 Pattern plating 117 4.4.4 Summary 123 4.5 Wafer Level Bonding 124 4.5.1 Silicon direct bonding 124 4.5.2 Thermo-compression bonding by using ECD copper 128 4.5.3 Summary 134 4.6 Wafer thinning and TSV back side reveal 134 4.6.1 Thinning processes 134 4.6.2 TSV reveal processes 136 4.6.3 Summary 145 4.7 Under bump metallisation and solder bumps 146 5 Demonstrator design, fabrication and characterisation 149 5.1 Single wafer demonstrator for electrical test 149 5.1.1 Demonstrator design and test structure layout 149 5.1.2 Demonstrator fabrication 150 5.1.3 Electrical measurement 151 5.1.4 Summary 153 5.2 Via Last based TSV fabrication in the MEMS device wafer 153 5.2.1 Layout of the MEMS device with TSVs 153 5.2.2 Fabrication of TSVs and wafer thinning 154 5.2.3 Characterisation of the fabricated device 155 5.2.4 Summary 156 5.3 Via Last based cap-TSV for very thin MEMS devices 157 5.3.1 Design 157 5.3.2 Fabrication 158 5.3.3 Characterisation 161 5.3.4 Summary 162 5.4 Via Middle approach based on thinning after bonding 163 5.4.1 Design 163 5.4.2 Results and characterisation 164 5.4.3 Summary 166 6 Conclusion and outlook 167 Appendix A: Typical requirements on a MEMS package and its functions 171 Appendix B: Classification of packaging and system integration techniques 173 B.1 Packaging of electronic devices in general 173 B.2 Single Chip Packages 174 B.3 System integration 175 B.4 3D integration based on TSVs 180 Bibliography 183 List of figures 193 List of tables 199 Versicherung 201 Theses 203 Curriculum vitae 205 Own publications 207 / Im Bereich mobiler Elektronik, wie z.B. bei Smartphones, Smartcards oder in Kleidung integrierten Geräten ist ein Trend zu erkennen hinsichtlich steigender Funktionalität und Miniaturisierung. Bei dieser Entwicklung spielen Mikroelektromechanische Systeme (MEMS) eine entscheidende Rolle zur Realisierung neuer Funktionen, wie z.B. der Bewegungsdetektion. Die Anforderungen derartiger Bauteile zusammen mit dem begrenzten zur Verfügung stehenden Platz erfordern neuartige Technologien für die Aufbau- und Verbindungstechnick (engl. Packaging) der Bauteile. Das 3D-Wafer Level Packaging (3D-WLP) ermöglicht eine Lösung für eine miniaturisierte MEMS-Bauform unter Nutzung von Techniken wie dem Waferlevelbonden (WLB) und den Siliziumdurchkontaktierungen (TSV von engl. Through Silicon Via). Diese Technologie erhöht die effektive aktive Fläche des MEMS Bauteils durch die Reduzierung von Toträumen, welche für andere Ansätze wie der Drahtbond-Montage üblich sind. In der vorliegenden Arbeit wurden verschiedene Technologiekonzepte für den Aufbau von 3D-WLP für MEMS erarbeitet. Dabei lag der Fokus auf einer Kupfer-basierten Technologie sowie auf zwei prinzipiellen Varianten für die TSV-Implementierung. Dies umfasst den Via Middle Ansatz, welcher auf der TSV Herstellung auf einem separaten Kappenwafer beruht, sowie den Via Last Ansatz mit einer TSV Herstellung entweder im MEMS-Wafer oder im Kappenwafer. Für beide Varianten mit individuellen Herausforderungen wurden entsprechende Prozessmodule entwickelt. Beim Via Middle Ansatz ist die Wafer-bezogene Ätzratenhomogenität des Siliziumtiefenätzen entscheidend für das spätere Freilegen der TSVs von der Rückseite. Hier hat sich eine Reduzierung der TSV-Tiefe auf bis zu 80 μm vorteilhaft erwiesen insofern, das Kupfer-Thermokompressionsbonden (Cu-TKB) vor dem Abdünnen erfolgt. Zur Metallisierung der TSVs wurde ein Cu Galvanikprozess erarbeitet, welcher es ermöglicht gleichzeitig eine Umverdrahtungsebene sowie die Bondstrukturen für das Cu-TKB zu erzeugen. Beim Via Last Ansatz ist die TSV Isolation eine Herausforderung. Es wurden CVD (Chemische Dampfphasenabscheidung) Prozesse untersucht, wobei eine Kombination aus PE-TEOS und SA-TEOS sowie eine Parylene Beschichtung erfolgversprechende Ergebnisse liefern. Des Weiteren wurde eine Methode zur Erzeugung bondfähiger Oberflächen für das Siliziumdirektbonden erarbeitet, welche eine Nass-Vorbehandlung des MEMS umgeht. Ein realer MEMS-Beschleunigungssensor sowie Testaufbauten dienen zur Demonstration der Gesamtintegrationstechnologie sowie zur Charakterisierung elektrischer Parameter.:Bibliographische Beschreibung 3 Vorwort 13 List of symbols and abbreviations 15 1 Introduction 23 2 Fundamentals on MEMS and TSV based 3D integration 25 2.1 Micro Electro-Mechanical systems 25 2.1.1 Basic Definition 25 2.1.2 Silicon technologies for MEMS 26 2.1.3 MEMS packaging 29 2.2 3D integration based on TSVs 33 2.2.1 Overview 33 2.2.2 Basic processes for TSVs 34 2.2.3 Stacking and Bonding 47 2.2.4 Wafer thinning 48 2.3 TSV based MEMS packaging 50 2.3.1 MEMS-TSVs 50 2.3.2 3D-WLP for MEMS 52 3 Technology development for a 3D-WLP based MEMS 57 3.1 Target integration approach for 3D-WLP based MEMS 57 3.1.1 MEMS modules using 3D-WLP based MEMS 57 3.1.2 Integration concepts 58 3.2 Objective and requirements for the proposed 3D-WLP of MEMS 60 3.2.1 Boundary conditions 60 3.2.2 Technology concepts 63 3.3 Selected approaches for TSV implementation in MEMS 64 3.3.1 Via Last Technology 64 3.3.2 Via Middle technology 69 4 Development of process modules 75 4.1 Characterisation 75 4.2 TSV related etch processes 77 4.2.1 Equipment 77 4.2.2 Deep silicon etching 78 4.2.3 Etching of the buried dielectric layer 84 4.2.4 Patterning of TSV isolation liner – spacer etching 90 4.2.5 Summary 92 4.3 TSV isolation 93 4.3.1 Principle considerations 93 4.3.2 Experiment 95 4.3.3 Results 97 4.3.4 Summary 102 4.4 Metallisation of TSV and RDL 103 4.4.1 Plating base and experimental setup 103 4.4.2 Investigations related to the ECD process 106 4.4.3 Pattern plating 117 4.4.4 Summary 123 4.5 Wafer Level Bonding 124 4.5.1 Silicon direct bonding 124 4.5.2 Thermo-compression bonding by using ECD copper 128 4.5.3 Summary 134 4.6 Wafer thinning and TSV back side reveal 134 4.6.1 Thinning processes 134 4.6.2 TSV reveal processes 136 4.6.3 Summary 145 4.7 Under bump metallisation and solder bumps 146 5 Demonstrator design, fabrication and characterisation 149 5.1 Single wafer demonstrator for electrical test 149 5.1.1 Demonstrator design and test structure layout 149 5.1.2 Demonstrator fabrication 150 5.1.3 Electrical measurement 151 5.1.4 Summary 153 5.2 Via Last based TSV fabrication in the MEMS device wafer 153 5.2.1 Layout of the MEMS device with TSVs 153 5.2.2 Fabrication of TSVs and wafer thinning 154 5.2.3 Characterisation of the fabricated device 155 5.2.4 Summary 156 5.3 Via Last based cap-TSV for very thin MEMS devices 157 5.3.1 Design 157 5.3.2 Fabrication 158 5.3.3 Characterisation 161 5.3.4 Summary 162 5.4 Via Middle approach based on thinning after bonding 163 5.4.1 Design 163 5.4.2 Results and characterisation 164 5.4.3 Summary 166 6 Conclusion and outlook 167 Appendix A: Typical requirements on a MEMS package and its functions 171 Appendix B: Classification of packaging and system integration techniques 173 B.1 Packaging of electronic devices in general 173 B.2 Single Chip Packages 174 B.3 System integration 175 B.4 3D integration based on TSVs 180 Bibliography 183 List of figures 193 List of tables 199 Versicherung 201 Theses 203 Curriculum vitae 205 Own publications 207

[pt] Nesta tese, olho para a Natureza como mais uma dimensão sobre a qual a colonialidade incide. Para isso, proponho dois movimentos teóricos. O primeiro é aprofundar a noção de colonialidade da Natureza, por entender que mesmo em um movimento crítico como o pensamento decolonial a Natureza é posta à margem, sendo necessário, portanto, reposicioná-la e compreender como a colonialidade incide sobre ela. O segundo é apresentar o Contrato Ambiental, inspirado principalmente pelo Contrato Racial de Charles Mills, enquanto um contrato subversivo que realça como o subjugo da Natureza é relevante para o domínio social, político e epistemológico colonial. Ambos os movimentos são relacionados com a disciplina de Relações Internacionais, posicionando este texto como uma proposta de pensar o internacional. Para essa análise, as metodologias escolhidas são a interseccionalidade, justamente por permitir a análise da incidência de hierarquias em mais de uma dimensão das vidas humanas e não-humanas, e a cartografia, que permite que a pesquisa seja afetada pelo campo e que o caminho também seja traçado enquanto se anda. Por fim, parto do conhecimento cultivado sobre crise climática com a intenção de propor um rompimento da hegemonia da organização social, política e produtiva centrada no Estado, no capitalismo e na colonialidade-modernidade, sem, no entanto, acreditar em uma volta ao passado e sem romantizar formas de organização não-modernas, tendo o movimento campesino de luta pela terra, em especial o Movimento de Trabalhadoras e Trabalhadores Sem Terra (MST), e em sua contraparte internacional, a Via Campesina, como práticas decoloniais e interseccionais de transformação social, política e epistemológica, bem como das relações entre humanos e a Natureza e entre grupos humanos. / [en] In this dissertation, I look at Nature as another dimension on which coloniality affects. To this end, I propose two theoretical movements. The first is to deepen the notion of coloniality of Nature, understanding that even in a critical movement such as decolonial thinking, Nature is placed on the margins, making it necessary, therefore, to reposition it and understand how coloniality affects it. The second is to present the Environmental Contract, inspired mainly by Charles Mills s Racial Contract, as a subversive contract that highlights how the subjugation of Nature is relevant to the colonial social, political and epistemological domain. Both movements are related to the discipline of International Relations, positioning this text as a proposal for thinking about the international. For this analysis, the methodologies chosen are intersectionality, precisely because it allows the analysis of the incidence of hierarchies in more than one dimension of human and non-human lives, and cartography, which allows research to be affected by the field and the path also be traced while walking. Finally, I start from the knowledge cultivated about the climate crisis with the intention of proposing a break with the hegemony of the social, political and productive organization centered on the state, capitalism and coloniality-modernity, without, however, believing in a return to the past and without romanticizing non-modern forms of organization, having the peasant movement of struggle for land, especially the Landless Workers Movement (MST), and its international counterpart, La Via Campesina, as decolonial and intersectional practices of social, political and epistemological transformation, as well as transformation of the relations between humans and Nature and between human groups. / [es] En esta tesis miro a la Naturaleza como otra dimensión sobre la que incide la colonialidad. Para ello propongo dos movimientos teóricos. El primero es profundizar la noción de colonialidad de la Naturaleza, entendiendo que incluso en un movimiento crítico como el pensamiento decolonial, la Naturaleza se coloca al margen, siendo necesario, por tanto, reposicionarla y comprender cómo la colonialidad la afecta. El segundo es presentar el Contrato Ambiental, inspirado principalmente en el Contrato Racial de Charles Mills, como un contrato subversivo que resalta cómo la subyugación de la Naturaleza es relevante para el dominio social, político y epistemológico colonial. Ambos movimientos se relacionan con la disciplina de las Relaciones Internacionales, posicionando este texto como una propuesta para pensar lo internacional. Para este análisis, las metodologías elegidas son la interseccionalidad, precisamente porque permite analizar la incidencia de las jerarquías en más de una dimensión de la vida humana y no humana, y la cartografía, que permite que la investigación se vea afectada por el campo y que el camino también sea rastreado mientras camina. Finalmente, parto del conocimiento cultivado sobre la crisis climática con la intención de proponer una ruptura con la hegemonía de la organización social, política y productiva centrada en el Estado, el capitalismo y la colonialidad-modernidad, sin creer, sin embargo, en un retorno al pasado y sin romantizar formas de organización no modernas, teniendo al movimiento campesino de lucha por la tierra, especialmente al Movimiento de los Trabajadores Sin Tierra (MST), y a su contraparte internacional, La Vía Campesina, como prácticas decoloniales e interseccionales de transformación social, política y epistemológica, así como de transformación de las relaciones entre los humanos y la Naturaleza y entre los grupos humanos.

The topic of the Diploma thesis is "Necropoleis on the Vatican Hill. The decoration analysis and its parallels in Roman art." The diploma thesis is divided into several parts that are particularly analysed. The first part is focused on the Vatican area layout in ancient world and both ancient and contemporary area layouts are compared. The second part is focused on the analysis of mausoleums along Via Cornelia and their decoration. The thesis tries to find some parallels with the mausoleums in the roman art which proclaim the use of these iconographical materials in other settings and historical backgrounds. The next part describes the necropolis along Via Triumphalis and the most important tombs within the specific sectors. The individual subchapters deal with selected motifs, which meanings intersect the pagan and Christian world. The following part analyzes selected sarcophagi and their decorative motifs. Consequently, both observed contexts are compared. The last part of the thesis provides the dating of several lamps from necropolis along Via Triumphalis. Keywords Vatican, necropolis, Via Cornelia, Via Triumphalis, antiquity, early Christian, roman art, decoration, sarcophagi