本研究引用吳思華教授提出的三個策略構面，作為研究分析之基礎，試圖分析個案公司的現況及金融海嘯侵襲下的策略因應。此策略三構面分別是營運範疇、核心資源與事業網路，亦即包括「營運範疇的界定與調整」、「核心資源的創造與累積」、「事業網路的建構與強化」三項主要工作。 2008年金融海嘯重創整個世界經濟，經營環境未曾如此險峻，因此如何掌握策略因應，讓企業渡過難關，變得非常重要，透過此項研究了解半導體產業結構及企業在面對金融海嘯危機等風險時，可利用策略三構面來探討策略因應，也可作為其他產業界参考。 本研究籍由分析個案半導體公司在金融海嘯危機時期，面對激烈的競爭環境，要如何建立其競爭優勢，以及如何調整經營策略，安然渡過危機。 本研究的目的在探討下述問題： 一、金融海嘯重創全球經濟及重創各產業，企業如何採取必要措施，安然渡過危機？ 二、金融海嘯危機下，企業如何制定經營策略及營運模式因應？ 三、金融海嘯浪潮下如何執行組織重整，建立核心資源，才適合時代潮流？ 本研究的結論如下。 一、企業透過購併同業及異業，以迅速增加運營範疇，擴大產品線廣度，拓展產品市場，分散風險，企業以選擇風險最低的作法渡過危機，並創造最佳的績效。 二、金融海嘯重創各產業，人才是企業的最基本的資產，金融海危機下，企業反而利用不景氣的時候逆勢培養人才、加强研發新產品、保住主要客戶、重建與供應商的關係、強化行銷網路，也就是擴展營運範疇、鞏固核心資源、强化事業網路來渡過危機。 三、金融海嘯侵襲下，企業會選擇風險最低的作法渡過危機，並創造最佳的績效，以下是營運模式因應。 (一) 保持健全的財務基本面 (二) 保護公司的現有業務　 (三) 適度在媒體曝光，建立企業聲譽 (四) 降低原料及供應鏈成本 (五) 維持企業的股價 四、金融海嘯浪潮下，組織變革或組織瘦身，雖然是一個理想的方式，但尚有一些創新的方法，可以在企業裡面做長期發展策略，反而利用這個機會，做平常沒有機會去做的事，也就是利用策略三構面，調整營運範疇、創造與累積核心資源以及建構與強化事業網路也可以安然渡過風暴。 / The gist of this study focuses on analyzing the current business strategic of corporation during financial crisis by which combined Dr. S.H. Wu’s “Three aspects of Strategy". There are defination and adjustmentof operation domains, the creation and accumulation of core competence, and the construct and strengthen business network. It is very important that how to manage the strategy to face the serious business environment during 2008 financial crisis. By the understanding of semiconductor industry through the study of structure and corporate financial crisis in the face of risk, the strategy can be used to explore the three dimensions of the strategy employed, but also for other industry references. The Study is analysis of the semiconductor corporation, how to build their competitive advantage, and how to adjust business strategy, to ride out the financial crisis during facing fierce competition. The target of this study is to investigate the following questions: First, how to take the necessary measures to ride out the crisis during the financial crisis hit the global economy and various industries? Second, how corporations develop business strategies and operating models in response during the financial crisis? Third, how to implement organizational restructure and establish core competence to meet the current situation during the challenge of financial crisis. The conclusions of this study are as below. First, by mergers and acquisitions and cross-industry, increase the operational areas promptly, expand the product lines markets, diversify risk, select the lowest risk business practices to ride out the crisis, and create the best performance. Second, the financial crisis hit the all industries, human power is the most basic assets of corporation during the financial crisis. The corporation used the downturn enterprises contrarian personnel training, enhance the development of new products, to keep key customers, rebuilding relationships with suppliers, strengthen the marketing network, that is, expansion of the operational areas, strengthening the core resources, and business networks to survive during crisis. Third, the corporation will choose the lowest risk to ride out and create the best performance during the financial crisis. The following is the mode of operation in response. (A) maintain the financial fundamentals (B) to protect the company's existing business (C) Show up in the media to establish the corporate reputation (D) reduce the cost of raw materials and supply chain (E) to maintain the share price Fourth, although the organizational change to reduce the pressure is the ideal for corporation, but there are some innovative actions to do long term development strategies. To process which do not have the opportunity to do the usual things, it means using “Three Aspects of Strategy” to adjust the operating domains, to create and accumulate the core competence, and build and strengthen the business network to ride out the financial crisis.

有關既有廠商面對技術改變時為何會失去領導地位，現有文獻多以技術和廠商能耐互動的供給面切入討論，其原因可能是領導廠商無法及時轉換技術、調整能耐或組織惰性等因素；對於少數新興國家的後進廠商成功挑戰既有領導廠商，成為全球領導廠商的研究，也大多依循這種供給面觀點，認為建立並不斷提升技術能耐是成功的關鍵。 深入檢視既有廠商面對技術改變失去領導地位的原因，不完全是來自供給面的問題，市場需求面也是重要的影響因素。在討論市場需求面的相關理論中，斷裂性創新架構是最典型的觀點，該觀點認為新興廠商推動斷裂性創新會持續破壞現有市場遊戲規則，造成競爭基礎的改變與產業結構的變化，此觀點主要在說明市場顧客需求的變化對新舊廠商競爭的影響，並據以補充說明技術供給面的不足。 至今斷裂性創新研究並未發展出一個有系統的架構來檢測某種創新情境是否為斷裂性創新？因而，本研究根據斷裂性創新架構觀點及個案研究法中描述性理論架構的要求，發展出斷裂性創新描述架構的相關特性要件，並用此架構來檢測台灣積體電路公司及其所促進高度發展的全球晶圓代工產業，檢測結果發現過程符合斷裂性創新的特性。後續研究將可由斷裂性創新的觀點切入，重新詮釋台積電成功成為全球領導廠商的原因。 本研究發展出來的描述架構是一個檢測斷裂性創新的良好基礎，可以作為測試其他產業是否存在斷裂性創新的參考。 / Why established incumbents loosed their leading positions facing the disruptive technology, explanation of current literatures tended to focus on the supply-side interaction of technologies and firms’ capabilities. The research on latecomer firms catching up technological gap in newly development countries also focused on the supply-side perspective and argued that consecutive advancing technological capabilities was the key to success. Closer examination of technology competition, however, reveals that technology or market transitions are not necessarily due to the supply-side difficulties, like incumbent technology’s inherent limit, incumbents’ inability to master new skill, or organizational inertness. The market demand-side is also an important factor offering a complementary set of explanations that highlight the influence of consumers’ need on technology trajectory. The most influential expression of a demand side role in technology competition is the disruptive innovation that will break the market rule, shift the bases of competition and change the industry structure. Current researches, however, did not develop systematically analytical tool or framework to identify disruptive innovation. This study followed the major perspectives of disruptive innovation and the rules of case study to develop the descriptive framework for testifying the phenomenon of disruptive innovation. The semiconductor industry development in Taiwan was identified and described under the conditions of this framework. This descriptive framework is a systematic tool for testing disruptive innovation in any industry.

興櫃股票是指已經申報上市（櫃）之公開發行公司的普通股股票，一般而言興櫃股票的流動性小、股本小，因此短線投資人多以即將掛牌上櫃的公司為主，至於中長線的投資人則以長期價值的觀點來投資，投入資金後必須等待一段時間，待上市（櫃）後，才能獲取較好的投資報酬率。長期投資須以自有資金投入，進一步瞭解該公司產業狀況及基本面表現後，應用適合未上市公司的評價模式，來做為投資的依據是很重要的。 本研究以興櫃市場中的半導體產業中的廣穎電通股份有限公司作為研究對象，以自由現金流量法為評價模型，並針對未上市公司在參數估計困難的部分作調整，使評價未上市公司時有一套可依循的流程，並加入考量未上市公司股票因流動性不足，所造成之流動性折價，以提升在評價上的合理性及正確性。 實證結果顯示，以2011 年年報來估計相關參數，運用現金流量折現法的每股理論價值為39.24 元。若考量流動性折價，以上市股票市場資料推估所得之流動性折價，廣穎電通之每股理論價值將為39.05 元；以興櫃股票市場資料推估所得之流動性折價，廣穎電通之每股理論價值將為37.93 元。

伴隨知識經濟時代的來臨，企業在全球化競爭下與產業高速變動的環境中，對於資訊與知識的質與量與日俱增，而為了因應全球經濟競爭與產業變遷，企業興起一股以知識管理為基礎的競爭優勢，作為發展與提升效能的利器。 知識管理對於傳統製造業生產流程效能的影響力已可由相關研究驗證，然而智慧型工程產業，如資本與技術密集的半導體資訊產業，是否在採取知識管理後能夠普遍提升生產流程的效能，尚待驗證，本研究係嘗試建立知識管理與半導體資訊企業生產流程效能之間的關聯性。 研究發現，半導體企業在削減變更成本、降低產品報廢率及重工率、產能擴充時間縮短、產品精密度與複雜度、以及彈性生產組態等生產流程效能上，都與知識管理中的知識管理策略、知識管理工具、知識管理網絡架構、以及知識管理流程有顯著的連結。知識管理策略與知識管理工具確實對半導體企業在削減變更成本、降低產品報廢率及重工率、產品精密度與複雜度、以及產能擴充時間縮短上，有顯著的效能表現 / The epoch knowledge economies bring high competitiveness in business market, and as well as stimulate the importance of information qualities and knowledge capacity. To face global economic developments and the transformation of industry, knowledge management thus has become the basic measure to improve the effectiveness of the developments of company. Evidently that knowledge management has been proved for the advantage of traditional industry in the effectiveness of production process, semiconductor industry however needs more verifications. The study hence is to scrutinize the connectedness between knowledge management and the effectiveness of production process in semiconductor industry. The study revealed that the overall effectiveness of production process indeed was correlated with the adoption of knowledge management system, and in detail, the strategies of knowledge management and the tools of knowledge management would enhance the effectiveness of production process in semiconductor industry.

台灣半導體產業發展成熟，產業群聚效應明顯，供應鏈完整。基於晶圓製造過程中成本花費考量，若能尋找設備、零組件、材料原廠以外的第二來源，對於台灣半導體廠商而言，除了有機會降低成本，也能不受到原廠的牽制。另外，台廠期望能透過自主開發生產設備來取代設備的高額進口成本，然而目前本土設備廠商自主開發前段製程設備能力有限，向外尋求關鍵技術之合作為良好的解決方案。筆者思考這兩個方面是否能透過與俄羅斯合作，成功突破目前的情況。 本論文針對俄羅斯半導體產業過去發展、現況與未來發展進行研究，同時了解台灣與全球半導體產業現況及發展前景。運用文獻檢閱法搜集全球、台灣、俄羅斯半導體產業現有資料。筆者也使用訪問法，自行設計訪談問題，以台灣及俄羅斯半導體產業專家為對象進行訪談，並將搜集到的第一手資料資料進行整理，以Rugman 與 Verbeke的「雙鑽石模型」，分別為「生產因素條件」、「需求條件」、「相關及支援性產業」、「企業策略、結構與競爭」，以及第五個因素「政府」作為理論架構，分析台灣與俄羅斯半導體產業發展現況，並提出雙方可能合作機會與策略之建議。 研究發現俄羅斯科學基礎研究實力豐厚，晶片應用著重在軍事、航太等方面，晶片生產朝向少量多樣方向發展。從俄羅斯政府許多政策上可以其支持國內微電子產業的發展，並期望微電子產業的振興能帶動國內其他產業的升級。台灣晶圓製造能力強，供應鏈完整，應用領域主要專注於資通訊方面，雙方競爭可能性低。台灣在基礎研究與設備開發所需技術方面，實力較為不足，與俄羅斯進行技術合作可謂實現設備國產化的策略之一。經由理論架構分析，台灣與俄羅斯進行技術合作，有望能縮短設備開發所需的時日。台灣供應鏈及先進製造能力，能為俄羅斯特殊晶片提供生產製造、封裝檢測等服務。台俄雙方在半導體領域的合作機會大，可互相補足缺口，促成產業升級。 / The semiconductor industry in Taiwan is well developed. Because of the high cost of wafer manufacturing process, having a second source of equipment, components, and materials would be beneficial for Taiwanese semiconductor companies. The cost of production and dependency on original equipment suppliers will decrease. In addition, Taiwanese companies seek the opportunity to be self-reliant on developing production equipment in order to reduce the high cost of importing equipment. However, the capacity of Taiwanese equipment manufacturers is limited. Cooperate with foreign companies on key technology is the preferable solution. This thesis focuses on the cooperation with Russia companies and check whether Taiwanese companies can have a breakthrough at current situation. This study includes the past, present, and the future development of Taiwanese and Russian semiconductor industry. Literature review and interview method are two main research methods. Collecting current reference of global, Taiwanese, and Russian semiconductor industry and primary sources from the interview with semiconductor industry experts, the author conducts an analysis on the development of the semiconductor industry in Taiwan and Russia with the “Double Diamond” model of Rugman and Verbeke. The analysis factors include “Factors conditions”, “Demand conditions”, “Related and supporting industries”, and “Government.” Further, this research proposes advice for cooperation and strategies. Through theoretical analysis, technical cooperation between Taiwan and Russia is expected to shorten the develop time of equipment. Industrial supply chain and advanced manufacturing capacity in Taiwan can provide manufacturing, packaging and testing service for Russia. Cooperation between Taiwan and Russia in the field of semiconductor can complement each other and will promote industrial upgrading.

晶圓製程設備商必須充分利用全球化智慧資源規劃，發展企業策略，才能創造企業競爭力和成長動能。經過多次的景氣循環，晶圓設備產業已經成為少數廠商全球激烈競爭的環境，特別是仍有兩家設備供應商以上的產品線。對於客戶而言，購買設備的主要因素來自於廠商製程能力和成本的優勢。除了少數關鍵製程由一家壟斷外，客戶都可以在每一個新製程世代(Technology node)找到兩家廠商評估設備和技術需求。在贏者全拿的壓力與吸引力下，在每一個新製程世代的銷售週期中，晶圓設備商都必須要充分利用智慧資本化的效益，掌握客戶的技術、量產時程，才能確保銷售空間。在發展策略上，為面對高技術競爭但是低成長的產業環境，晶圓設備商必須要透過併購和整合其核心技術相關新事業才能同時整合既有智慧資源和創造成長。 不管從市場規模和產業鏈來看，台灣的半導體產業已經成為全球最重要的製造據點，也是台灣最重要的產業之一。半導體製造廠龐大的資本支出和相關需求更讓台灣成為各半導體設備商的銷售服務的兵家必爭之地。根據SEMI的最新市場調查，總計台灣2007年的半導體設備市場達到106.5億美元，較2006年大幅成長45.2%，正式超越日本成為全球最大半導體設備投資市場。在產業鏈中，晶圓製程設備除了是晶圓廠最大資本支出外，還是產業技術發展的供應者。很可惜的是，雖然擁有龐大的商機做後盾，台灣卻沒有及時發展這個領域。在轉換成本、專利、和領導晶圓製造商合作開發和人才、資金等高產業門檻下，除了自動化設備較有進展外，台灣在晶圓製程設備產業的自給率普遍低於5%，技術、智財和人才還是掌握在外國的晶圓製程設備廠商。在沒有整合產、官、學、研等資源和適合的智財管理規劃下，在需要高度基礎科學和長遠技術發展的晶圓製程設備產業，我們設備自制化的結果不高，並不令人訝異。晶圓製造業者的議價和技術自主能力因此而受到拘束，所發展的智財也沒有太大價值和效用。 本研究目的希望以智慧資源規劃為研究方法，進行晶圓製程設備產業的實證研究。先就市場特性分析晶圓製程設備產業概況，接著探討廠商如何運用智慧資源規劃的資本化和產業結構化切入市場，最後在實證研究上以分析主要晶圓製程設備廠商的專利能量和最新奈米技術High-k/Metal Metal Gate探討產業的技術發展趨勢與廠商智慧資源規劃的運用和佈署。期望從綜合上述論點，做為台灣是否適合發展晶圓製程設備和又該如何準備智慧資源規劃的參考。 / Global intellectual resource planning (IRP) is cruicial in industrial strategy for wafer fabrication equipment vendors to develop competence and growth momentums. After several business cycles during the past few decades, this industry has become a very competitive market of a few players. For their customers, the key decision factors are the technology capability and cost of the vendors. Except for some critical process equipments dominated by only one vendor, the customers can identify 2 vendors to evaluate their equipment and cost performance. That Winner takes all become the pressure and attraction of the industry. The vendors must fully apply the value of intellectual property and overhaul their customer’s technology and production roadmap to ensure their share in the market. To cope with the market challenges of low growth and highly competitiveness, the vendors must incoporate and integrate other new companies of their core technology to consolidate given intellectual resource and create better achievements. Either from the perspective of market size and industry value chain, Taiwan has played the most important role in semiconductor manufacturing industry worldwide. To extend their market share and keep in the lead, the foundry and DRAM companies have aggressively invested in the production of 300mm fabs. The vast investments and its production demands have made Taiwan the most competitive place in semiconductor equipment markets. According to the SEMI most update, the business volume of Taiwan semiconductor equipments market reached to US$10.65 billion in 2007, with an impressive growth of 45.2% more than 2006. Taiwan has overtaken Japan and become the largest semiconductor equipment markets in the world. In the industry value chain, the wafer fabrication equipments not only accounted for the greatest capital expenditure of fibs but also the foundation for the process technology development. It is a pity that the equipments industry in Taiwan did not flourish as along with the great market here. All the key technologies, people, materials and components are manipulated by foreign vendors. This situation resulted in an un-balanced development in domestic semiconductor industry as well as the bargain power and self-owned technology. The related developed intellectual rights can not show the real value and effect. With the high entry barriers of transfer cost, patents, professionals and investments of wafer fabrication equipments markets, Taiwan vendors take less than 5% in the market share, except for some progress in automation equipments of lower IP, capital and transfer cost barriers. The Taiwan vendors have not demonstrated capability in process technology to penetrate the markets. The wafer fabrication equipment market growth was a result of o the outsource investment from Europe, US and Japan fabs. It turns out that the technology, IP and people are still possessed by foreign vendors. Without the synergy and integration of government, academia and industry and intangible resource planning, it is not surprising that our production localization ratio is relatively low. Thus, the thesis will elaborate the case study in the way of intellectual resource planning. First, the research will analyze the industrial characteristics of wafer fabrication equipment market. In the followings, this research will discuss how vendors can apply IRP to penetrate the market. Finally, this research will analyze the patents of major vendors and High-k/Metal Gate process technology to elaborate the industry technology cycles and new technology development strategy. As a result, the thesis will try to discuss if it is suitable for Taiwan to develop the wafer fabrication equipment market and also serve for reference how to prepare the intellectual resource planning.

半導體及光電產業快速發展，已成為台灣賴以與國際競爭之兩大經濟產業，為維持台灣既有之製造優勢及實力，並加強設計創新能力，政府擬定「新世紀兩兆雙星產業發展計畫」，明確勾勒出我國對於半導體及平面顯示器兩大產業之發展方向。邁入二十一世紀，新興國家快速崛起，台灣產業發展面臨強大的競爭，尤其在中國大陸，各廠為維持既有的競爭優勢及提昇市場佔有率，唯有加速持續投資建廠，一則創造規模經濟以降低生產成本，另一方面更以領先技術築高競爭者之進入障礙。 近年來，國內各大廠積極建置規劃12吋晶圓廠及TFT-LCD八代廠，由於均屬於高資本之投資，擬定發包策略，故強化採購人員的談判技巧及遴選合適的承攬廠商，以最短的時間及最少的預算來完成建廠，將成為建廠業者主要的政策。 本研究乃在探究哪些關鍵因素足以影響建廠廠商之採購發包策略，再以工程承攬商的觀點提出應對，發展出本身之承攬策略。由於有關建廠發包策略之相關文獻不多，故本研究主要採實地專家訪談，訪談半導體廠及TFT-LCD廠廠務及採購主管對於建廠採購發包之看法，配合文獻所提之各要點發展問卷，透過問卷了解高階主管、廠務人員及採購人員對發包有何不同觀點，同時面對不同之發包型態與關鍵影響因素，利用層級分析法（Analytical Hierarchy Process；AHP），發展適用於不同類型採購發包決策人員之各構面及次準則指標之權重，並與其他相關研究做比較，探討差異所在及原因，綜合研究建廠廠商高階主管、廠務人員及採購人員對於新建廠務系統發包之需求，進而擬定出承攬商因應之承攬策略，以提供決策者進行執行決策之參考。 關鍵字：半導體產業、光電產業、工程承攬、發包策略、承攬策略 / As the developments in semiconductor and opto-electronic industries grow rapidly, they have become two major economic industries of Taiwan to compete globally. In order to keep Taiwan’s exiting advantages in manufacturing and its strength and also to improve its design and innovation abilities, Taiwan government has proposed “The New Century Two Trillions Double Stars Industries Development Plan” and the plan has clearly outlined the development directions for both semiconductor and flat panel display industries in Taiwan. While stepping into 21st century, the developments in Taiwan industries have faced enormous competition due to the sharp rising of emerging countries, China especially. For maintaining its competition advantages and upgrading its market shares, every enterprise only has to accelerate on making investments to the plant construction. By doing so, it aims to create economic scale to lower the product costs and it also aims to increase the entry barriers for competitors through its leading advanced technologies. In recent years, major enterprises in Taiwan have aggressively engaging in 12” fab construction and TFT-LCD 8th generation plant construction planning. Since both are the investments required high capital, the enhancement in procurement professionals’ negotiation skills and the selections of qualified contractors, the drawing up for the contracting strategies and the completion of the plant construction within shortest time with minimum budget are the major policies for the enterprises of the plant construction. This paper aims at probing into what are the key factors that will have influence on the procurement and contracting strategies made by the enterprises of the plant construction and followed by responding proposals provided from the contractors’ of the plant construction points of view and also the developments of the contracting strategies made by them. Since there are not many researches about the topic on the contracting strategies of the plant construction, the study is mainly from live interviews with experts and through interviews with facility managers and procurement mangers of semiconductor and TFT-LCD plants to understand their points of views on the procurement and contracting strategies of the plant construction. In addition, also matching up with major points in bibliographies, the questionnaire has been developed and the questionnaire survey has revealed various points of views about contracting from top management, facility professionals and procurement professionals and the key influential factors when facing different types of contracting meanwhile. By using Analytical Hierarchy Process, it has applied on every aspect and the percentages of the secondary indexes for the decision makers’ of different types of procurement and contracting and the results have also been compared with other related researches in order to figure out the differences and their causes. Combined with the study on the demand from top management, facility professionals and procurement professionals of the enterprises of the plant construction for the contracting of new plant construction systems, the contractors’ can draw up the responding contracting strategies and provide them to decision makers as the reference whiling they are making judgments. Key words: Semiconductor industries, Opto-electronic industries, Contracting work, Procurement strategies, Contracting strategies.

學界普遍認為中國半導體產業在2000年以降快速崛起主要因素是中國各級政府仿效東亞國家八十年代扶持半導體產業模式。也就是「發展型國家」(Developmental State)角色。如中國中央政府推動半導體策略性產業政策：提供優惠稅賦（「國務院十八號文件」）以及進行大規模研發計畫(「八六三計畫」)；地方政府則提供半導體廠商建廠資金和低價建廠成本。然而，實際上，從跨國比較觀點分析在中國政府半導體產業角色，發現我們可以發現中國政府在半導體產業角色與「發展型國家」的理念型有所差異。基於上述討論有兩個主要研究目的： 1.建立國家機關角色類型學，了解中國個案與既有類型異同之處。以此，提出新理論架構：第一個指標：國家機關干預型式，主要指國家是否推動「策略性產業政策」；第二個指標、企業財產權關係: 企業財產權屬於國家或私人。兩個指標和各自有兩個變異，因此形成二乘二的四個國家機關角色類型學。 2.分析形成不同國家機關角色的因素：落後的程度、官僚體系特質和政策網路等因素如何形塑國家機關角色等因素對形成國家角色有何影響。 為進行跨國比較本文選擇了四個國家以及其時空分界點：1985-1990年的美國、1976-1980年的日本、1984-1988年的台灣與2000年以降的中國，進行國家角色干預前後的時空因素比較。 本文研究發現有三：一、一國落後的程度決定了其國家角色類型：。二、國家干預前的「韋伯式官僚」程度，影響了「發展型國家」和「企業家發展型國家」的要素之一「大規模研發計畫」是否完整，但不會決定屬於個案是屬於哪一類型國家。 / Scholars argued that the rapid development of China's semiconductor industry due to strategic industry policy, known as East Asian “Developmental State Model”. China central government provided preferential domestic sale tax (Circular 18) for China-based semiconductor firms and launched national R&D project (863); local government also provides loans and low building cost for semiconductor enterprises. However, as cross-countries comparing role of state in the semiconductor industry, China’s case still is different from ideal type of Developmental State. Based on the discussion above, this dissertation has two main research purposes: 1.Establishing the typology of state: what different China's case with other nations and propose a new theoretical framework. The first indicator is whether State to promote "Strategic Industrial Policy" or not; the second corporate property relations: the second indicator is property rights of enterprises, which is government owned or private. The two indicators have two variations, so the format a typology, three types role of state in two by two matrix. 2.Analyzing the causal factors of role of state: how does extent of economic backwardness, characteristics of bureaucratic system and types policy network influence roles of state. For a cross-nations studies, I selected four variety cases and time dividing points: United States (before and after 1985-1990), Japan(before and after 1976-1980), Taiwan ( before and after 1984-1988), and China (before and fater 2000-2005) to define role of state and its causal factors. This study has three main findings: First, the extent of backwardness of a nations determined its role of state. Second, level of Weberian bureaucracy level affected complete extent of Developmental State" and Entrepreneurial Developmental State" , but would not determined its role of state.

半導體生產的流程可分成四階段：晶圓生產(fabrication)、測試分類(sorting)、封裝(assembly)與檢驗(testing)。每個階段都有不同的廠商可提供服務。當晶圓生產廠商接獲訂單，其供應鍊管理者會根據產能、需求量、交貨日、技術水準與成本等考慮因素，決定此訂單應由何晶圓廠區生產、由何測試分類廠做分類、由何封裝廠做封裝與最後由何檢驗廠做檢驗。本研究的主要目的為在各種限制條件下，以最小成本為目標，找出完成客戶訂單的最佳廠商組合。可能的限制包括產能限制、交貨日的滿足、各廠區的技術水準及需求量的大小。本問題可視為產品組合、廠商組合與生產排程的綜合問題，過去常用的解決方法為整數與線性規劃的混合應用，但是由於牽涉的因素太多，常常問題的模式中變數與限制式過多導致無法解決。本研究先以資料的收集與模式的建構為主，利用並修改現有的產品結構樹模型使其變成供應鏈網路模式，並加入半導體產業供應鏈相關特性，建立一個以時間軸為機制的混合整數線性模式。並且以時間成本的概念來衡量整個半導體供應鏈的效能。 混合整數線性模式常會面臨許多問題，由於模式的複雜，變數與限制式過多，造成求解的困難。對電腦資源的需求很大，花費的時間也很長。同時對於問題的規模亦造成制限。於是本研究藉著修改Kim (1995) 的 backward list scheduling 演算法概念，建構一個解決問題的啟發式演算法，可快速求得一組近似最佳解之可行解。 由於供應鏈所面對的是隨機環境，因此必須以模擬的方式對上述模型進行檢驗，確認其有效性及適用的範圍。利用系統模擬方法，確定隨機變數與其分配，以建立模擬模型程式。實際進行模擬，以驗證上述供鏈模型之有效性，並瞭解、分析模型之適用性及應用方式。 對於半導體產業供應鏈廠商指派與資源分配之網路管理方面，提供一數量化的思考邏輯。運用數量化的模式表現出不同的半導體產業供應鏈廠商指派與資源分配之網路管理的問題，並提出解決問題的演算機制。

No description available.