Le système de fabrication des plaquettes de silicium (wafer) est la partie la plus complexe et la plus coûteuse du processus de fabrication des semi-conducteurs et son ordonnancement pour la production a un impact significatif sur la rentabilité économique. Le système d’outils Multi-cluster pour la fabrication de plaquettes est un système de type multi-boucles, largement utilisé dans la fabrication de plaquettes de 300 mm et 450 mm. Le problème d’ordonnancement dans ce système de production présente des caractéristiques pour les modèles de flux de plaquettes compliqué, des contraintes résidentielles strictes et des conflits de ressources à gérer, ce qui rend le problème très complexe. Dans cette thèse, l'outil multi-cluster est étudié et les recherches se concentrent principalement sur les caractéristiques des contraintes sur le temps de séjour, les contraintes sur les ressources utilisés et les flux plaquettes de silicium. Plus particulièrement, cette thèse traite trois problèmes d'ordonnancement: le problème d'ordonnancement cyclique unitaire pour un flux unique de plaquettes, le problème d'ordonnancement cyclique multi-unitaires dans un modèle de flux unique de plaquettes et le problème d'ordonnancement non-cyclique. Pour résoudre ces problèmes, des modèles robustes sont développés ainsi que certains algorithmes heuristiques efficaces sont construits pour atteindre les objectifs. L'objectif principal étant d'améliorer la performance des outils multi-cluster et d'augmenter le rendement des flux des plaquettes de silicium. Des tests de simulation et des analyses sont effectuées afin d’évaluer la performance des algorithmes proposés. Les résultats montrent la stabilité et l'efficacité de ces algorithmes. / Multi-cluster tool is a highly automated and costly wafer fabrication system with multi-loop coupling structure, and scheduling of such equipment directly affects the overall efficiency of semiconductor manufacturing enterprises. Multi-cluster tools scheduling problem has the features of large scale, complex wafer flow patterns, strict residency time constraints and intense resource conflict, which are significantly different from any other manufacturing system. Since the existing literatures have proved that most of the wafer fabrication systems scheduling problems are NP-hard, it’s difficult to obtain the optimal solution by using exact algorithms. Thus, how to develop an efficient heuristic algorithm to solve the multi-cluster tools scheduling problem attracts considerable attention both in academia and in industry. After reviewing the literatures, it is found that the research on the cyclic scheduling problem of multi-cluster tools rarely takes into account the characteristics of residency constraints. The scale of the object is limited to three single cluster tools, and the proposed scheduling methods are mostly mathematical programming and simple scheduling rules. Therefore, in this thesis, the multi-cluster tool is studied and our research mainly focuses on the characteristics of residency constraints, resource constraints and wafer flow patterns. Based on the descriptions of research domains, some solid models are developed for different scheduling problems and some efficient heuristic algorithms are constructed to realize the objectives. To deal with the problem, different approaches are proposed: A non-linear mixed-integer programming model, a two-stage = approximate-optimal scheduling algorithm, and a chaos-based particle swarm optimization-tabu search hybrid heuristic algorithm. Simulation experiments and analysis demonstrate the effectiveness of these algorithms. Results show the stability and efficiency of proposed algorithms.

In der vorliegenden Arbeit wird ein neues Verfahren zur Dünnschichtverkappung von oberflächennahen Mikrostrukturen vorgestellt. Ausgehend von den speziellen Anforderungen an die Verkappung oberflächennaher Mikrostrukturen, insbesondere von Strukturen mit hohem Aspektverhältnis, wurden die Verwendung eines Fluor-Kohlenstoff-Polymers als Opferschichtmaterial und die Eignung unterschiedlicher Schichtstapel zur Realisierung der Dünnschichtkappe untersucht. Die resultierende Technologie ermöglicht eine durchgehend trockenchemische Prozessierung. Für die Abschätzung der notwendigen Schichtdicken und den geometrischen Entwurf der Kappenstrukturen, wurden auf Basis der Plattentheorie analytische und numerische Modelle erstellt. Verschiedene Materialkombinationen bestehend aus Siliziumoxid, Siliziumnitrid und Aluminium wurden hinsichtlich ihrer mechanischen und thermomechanischen Eigenschaften untersucht und bewertet. Ein weiterer Schwerpunkt lag auf der Entwicklung und Optimierung der Opferschichtprozesse, sowie deren Integration in die Gesamttechnologie. Die Eignung der plasmagestützten Prozesse zur Abscheidung und Strukturierung des Opferpolymers wurde durch die Fertigung von verkapselten Beschleunigungssensoren nachgewiesen. Ein ausreichender hermetischer Verschluss der Dünnschichtkappe konnte durch die Messung der viskosen Dämpfung an Feder-Masse-Schwingern bestätigt werden.

Beim Aufbau von konfigurierbaren wafer-scale Systemen für pulsgekoppelte neuronale Netze werden hohe Anforderungen an die Kommunikation zwischen einzelnen Komponenten gestellt. Zur Unterstützung des Hardwareentwurfs, aber auch um die parallele Entwicklung der Software zu ermöglichen, können Simulationsmodelle verwendet werden. Der Aufbau der Architektur und die Implementierung als SystemC-Modell werden beschrieben. Aus der Simulation sind Rückschlüsse auf die Architektur möglich, es ergeben sich aber auch Anforderungen an die zu entwickelnde Softwareumgebung.

Long cycle times in semiconductor manufacturing represent an increasing challenge for the industry and lead to a growing need of break-through approaches to reduce it. Small lot sizes and the conversion of batch processes to mini-batch or single-wafer processes are widely regarded as a promising means for a step-wise cycle time reduction. Our analysis with discrete-event simulation and queueing theory shows that small lot size and the replacement of batch tools with mini-batch or single wafer tools are beneficial but lot size reduction lacks persuasive effectiveness if reduced by more than half. Because the results are not completely convincing, we develop a new semiconductor tool type that further reduces cycle time by lot streaming leveraging the lot size reduction efforts. We show that this combined approach can lead to a cycle time reduction of more than 80%.

There is currently a demand of mm‑wave on‑chip antennas to enable all kinds of new applications in several different areas. But the development requires, among other things, special equipment used during the measurement phase due to the small dimensions and the high frequencies. In this project a robotic measurement system, SAX (Single Arm eXtra), was designed and constructed at Micro and Nanosystems (MST) department at KTH Royal Institute of Technology (Sweden). The purpose of the SAX is to enable radiation pattern measurements of on‑chip antennas ( 140 GHz to 325 GHz ), whether the boresight is vertical or horizontal along with other requirements, by moving a converter with the measurement antenna around the antenna in question. Several alternative designs for the basic construction, both from other works and invented by the author, were analyzed based on the requirements for this project and other limitations. The chosen unique design, the SAX, is very compact and uses only one stepper motor. Several parts have been developed in this project to ensure the proper functionality of the SAX. That includes a main operator program, a motor input signal generating program, a motor input signal executing system, a security system, and a system for controlled rotation of the SAX. For the input signal to the motor two different algorithms to generate the time delays were developed and tested. They were adapted to make the motor manage the sweeps of an ever‑changing load with high inertia during acceleration and deceleration. One of them was developed to make the time delay array generation much more efficient albeit with larger approximation error. The SAX worked well and should be rather easy‑to‑use regarding the operation of the system, from the physical maneuvering to utilizing the sub‑systems to the running of the main operator program. It fulfilled the specific requirements by enable a cross pattern measurement from  -60° to +60°  both from above and from the side, adjustment of the radius between 15cm to 45cm , adjustment 10cm in height, to be rotated along the floor in steps of 1°, measurement steps of 1° with an accuracy of less than 0,5° (the largest error was measured to be ≤ 0,461°). However, some calibration work needs to be done before the optimal performance of the system is reached. As a verification of the operation of the system data from measurements of open‑ended waveguides was presented. / Det finns en efterfrågan på chipantenner för millimetervågor eftersom de kan möjliggöra allehanda produkter inom flera olika områden. Forskningen på dessa ställer dock bl.a. speciella krav på utrustning som används under testmätningsfasen p.g.a. de små dimensionerna och den höga frekvensen. I detta projekt har ett robotsystem, SAX (Single Arm eXtra), utformats och konstruerats på avdelningen för Mikro- och nanosystem på KTH. Syftet med SAX är att mäta högfrekventa chipantenner ( 140 GHz till 325 GHz ) genom att förflytta en frekvensomvandlare med tillhörande mätantenn i en cirkulär bana runt antennen ifråga, oavsett om den är riktad vertikalt eller horisontellt och givet andra kravspecifikationer. Flera designalternativ för den grundläggande konstruktionen, både från andras arbeten och framtagna av författaren själv, har analyserats utifrån kravspecifikation för detta projekt och andra begränsningar. Den valda unika designen, SAX, är väldigt kompakt och använder sig bara av en stegmotor. För att möjliggöra funktionen i den slutgiltiga produkten har flera delar tagits fram vilka inkluderar ett operatörsprogram, ett program för genererandet av motorstyrsignaler, ett program för motorstyrning, ett säkerhetssystem och ett rotationssystem för kontrollerad rotation av SAX. För genererandet av motorstyrsignaler i form av tidsfördröjda pulser framtogs två olika algoritmer. De ger anpassade accelerations- och retardationssignaler för att motorn ska klara av att förflytta en föränderlig last med stor tröghet. En av dessa framtogs med syfte att mycket effektivt generera pulstiderna om än med större approximationsfel. SAX fungerade tillfredsställande och torde vara ganska lättanvänd med tanke på vad systemet kräver av operatören, från att fysiskt manövrera systemet till att använda delsystemen till att använda operatörsprogrammet. Systemet uppfyllde de givna specifika kraven genom att möjliggöra mätningar i form av ett kryssmönster från -60° till +60°  både ovanifrån och från sidan, radiejustering från 15cm till 45cm , höjdjustering över 10cm , rotation över golvet i steg om 1° , mätningar i steg om 1° med en noggrannhet på 0,5° (den största avvikelsen uppmättes till ≤ 0,461°). Vidare kalibrering behöver dock utföras för att utnyttja den fulla potentialen hos konstruktionen. För att verifiera funktionsdugligheten för systemet presenterades data från mätningar gjorda på öppna vågledare.

Double-sided module exhibits electrical and thermal characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided module to reduce the stress to a level acceptable by silicon dice. For a 14 mm x 21 mm module carrying 6.6 mm x 6.6 mm die, finite-element simulation suggested an optimal design having four posts located 1 mm from the die; the z-direction stress at the chip was reduced from 17 MPa to 0.6 MPa. / Ph. D.

Online quality assurance is crucial for elevating product quality and boosting process productivity in advanced manufacturing. However, the inherent complexity of advanced manufacturing, including nonlinear process dynamics, multiple process attributes, and low signal/noise ratio, poses severe challenges for both maintaining stable process operations and establishing efficacious online quality assurance schemes. To address these challenges, four different advanced manufacturing processes, namely, fused filament fabrication (FFF), binder jetting, chemical mechanical planarization (CMP), and the slicing process in wafer production, are investigated in this dissertation for applications of online quality assurance, with utilization of various sensors, such as thermocouples, infrared temperature sensors, accelerometers, etc. The overarching goal of this dissertation is to develop innovative integrated methodologies tailored for these individual manufacturing processes but addressing their common challenges to achieve satisfying performance in online quality assurance based on heterogeneous sensor data. Specifically, three new methodologies are created and validated using actual sensor data, namely, (1) Real-time process monitoring methods using Dirichlet process (DP) mixture model for timely detection of process changes and identification of different process states for FFF and CMP. The proposed methodology is capable of tackling non-Gaussian data from heterogeneous sensors in these advanced manufacturing processes for successful online quality assurance. (2) Spatial Dirichlet process (SDP) for modeling complex multimodal wafer thickness profiles and exploring their clustering effects. The SDP-based statistical control scheme can effectively detect out-of-control wafers and achieve wafer thickness quality assurance for the slicing process with high accuracy. (3) Augmented spatiotemporal log Gaussian Cox process (AST-LGCP) quantifying the spatiotemporal evolution of porosity in binder jetting parts, capable of predicting high-risk areas on consecutive layers. This work fills the long-standing research gap of lacking rigorous layer-wise porosity quantification for parts made by additive manufacturing (AM), and provides the basis for facilitating corrective actions for product quality improvements in a prognostic way. These developed methodologies surmount some common challenges of advanced manufacturing which paralyze traditional methods in online quality assurance, and embody key components for implementing effective online quality assurance with various sensor data. There is a promising potential to extend them to other manufacturing processes in the future. / Ph. D. / This dissertation work develops novel online quality assurance methodologies for advanced manufacturing using various sensor data. Four advanced manufacturing processes, including fused filament fabrication, binder jetting, chemical mechanical planarization, and wafer slicing process, are investigated in this research. The developed methodologies address some common challenges in the aforementioned processes, such as nonlinear process dynamics and high variety in sensor data dimensions, which have severely hindered the effectiveness of traditional online quality assurance methods. Consequently, the proposed research accomplishes satisfying performance in defect detection and quality prediction for the advanced manufacturing processes. In this dissertation, the research methodologies are constructed in both space and time domains based on different types of sensor data. Sensor data representation and integration for a variety of data formats (e.g., online data stream, profile data, image data) with the dimensionality covering a wide range (from ~100 to ~105 ) are researched to extract effective features that are sensitive to manufacturing process defects; the devised methods, based on the extracted features, utilize spatiotemporal analysis to realize timely detection and accurate prediction of process defects. These integrated methodologies have a promising potential to be extended to other advanced manufacturing processes for efficacious process monitoring and quality assurance. The accomplished work in this dissertation is an effective effort towards sustainable operations of advanced manufacturing. The achieved performance not only enables improvement in defect detection and quality prediction, but also lays the foundation for future implementation of corrective actions that can automatically mitigate the process defects.

The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. The exclusive use of IC manufacturing technologies leads to limited material choices, limited design flexibility and consequently to sub-optimal MEMS and NEMS devices. The work presented in this thesis breaks new ground with a multitude of novel approaches for the integration of non-standard materials that enable the fabrication of 3D micro and nanoelectromechanical systems. The objective of this thesis is to highlight methods that make use of non-standard materials with superior characteristics or methods that use standard materials and fabrication techniques in a novel context. The overall goal is to propose suitable and cost-efficient fabrication and integration methods, which can easily be made available to the industry. The first part of the thesis deals with the integration of bulk wire materials. A novel approach for the integration of at least partly ferromagnetic bulk wire materials has been implemented for the fabrication of high aspect ratio through silicon vias. Standard wire bonding technology, a very mature back-end technology, has been adapted for yet another through silicon via fabrication method and applications including liquid and vacuum packaging as well as microactuators based on shape memory alloy wires. As this thesis reveals, wire bonding, as a versatile and highly efficient technology, can be utilized for applications far beyond traditional interconnections in electronics packaging. The second part presents two approaches for the 3D heterogeneous integration based on layer transfer. Highly efficient monocrystalline silicon/ germanium is integrated on wafer-level for the fabrication of uncooled thermal image sensors and monolayer-graphene is integrated on chip-level for the use in diaphragm-based pressure sensors. The last part introduces a novel additive fabrication method for layer-bylayer printing of 3D silicon micro- and nano-structures. This method combines existing technologies, including focused ion beam implantation and chemical vapor deposition of silicon, in order to establish a high-resolution fabrication process that is related to popular 3D printing techniques. / <p>QC 20121207</p>

This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. Background information about the actuators and the integration method is provided. SMA microactuators offer the highest work density of all MEMS actuators, however, they are not yet a standard MEMS material, partially due to the lack of proper wafer-level integration methods. This thesis presents methods for the wafer-level heterogeneous integration of bulk SMA sheets and wires with silicon microstructures. First concepts and experiments are presented for integrating SMA actuators with knife gate microvalves, which are introduced in this thesis. These microvalves feature a gate moving out-of-plane to regulate a gas flow and first measurements indicate outstanding pneumatic performance in relation to the consumed silicon footprint area. This part of the work also includes a novel technique for the footprint and thickness independent selective release of Au-Si eutectically bonded microstructures based on localized electrochemical etching. Electrostatic actuators are presented to functionalize MEMS crossbar switches, which are intended for the automated reconfiguration of copper-wire telecommunication networks and must allow to interconnect a number of input lines to a number of output lines in any combination desired. Following the concepts of heterogeneous integration, the device is divided into two parts which are fabricated separately and then assembled. One part contains an array of double-pole single-throw S-shaped actuator MEMS switches. The other part contains a signal line routing network which is interconnected by the switches after assembly of the two parts. The assembly is based on patterned adhesive wafer bonding and results in wafer-level encapsulation of the switch array. During operation, the switches in these arrays must be individually addressable. Instead of controlling each element with individual control lines, this thesis investigates a row/column addressing scheme to individually pull in or pull out single electrostatic actuators in the array with maximum operational reliability, determined by the statistical parameters of the pull-in and pull-out characteristics of the actuators. / QC20100729

In der Photovoltaikindustrie wird der Diamantdrahtsägeprozess für die Fertigung kristalliner Siliziumwafer eingesetzt. In dieser Arbeit wird ein dynamisches Modell des Drahtsägeprozesses entwickelt, das die Simulation relevanter Prozessvariablen über die Prozesszeit und über die Ausdehnung des Drahtfeldes zulässt. Den Kern der Modellierung bildet ein parametrisches Abtragmodell, das die Abtragrate in Funktion verschiedener Prozessvariablen beschreibt. Die Parameter dieses Modells werden anhand von Messdaten identifiziert. Basierend auf dem validierten Modell werden Ansätze zur Rezeptoptimierung untersucht mit dem Ziel, die Produktivität zu steigern. Abschliessend wird ein ausgewählter Ansatz aus der Rezeptoptimierung experimentell validiert. Aus der Versuchsreihe geht hervor, dass mit den entwickelten Ansätzen eine wesentliche Reduktion der Prozesszeit möglich ist.:1. Einleitung 1.1. Einordnung der Arbeit 1.2. Beschreibung des Drahtsägeprozesses mit Diamantdraht 1.3. Technisch-wissenschaftliche Zielsetzungen 1.4. Stand der Technik 1.5. Gliederung der Arbeit 2. Modellierung des Drahtsägeprozesses 2.1. Überblick und Notation 2.2. Modell für den Kontakt zwischen Draht und Siliziumbrick 2.3. Parametrisches Abtragmodell 2.4. Drahttransformationsmodelle 2.5. Rezeptmodell 2.6. Überblick über das Gesamtmodell 2.7. Implementierung in der Simulationsumgebung 3. Identifikation der Modellparameter und Modellvalidierung 3.1. Messdaten und Experimente 3.2. Methodik der Parameteridentifikation 3.3. Ergebnisse und Diskussion 4. Ansätze zur Rezeptoptimierung 4.1. Zielsetzungen und Grundlagen 4.2. Analyse der Prozessvariablen im quasistationären Zustand 4.3. Beschreibung verschiedener Methoden zur Erhöhung des Abtrages 4.4. Simulationsbasierter Vergleich verschiedener Rezepte 5. Experimentelle Validierung der Rezeptoptimierung 5.1. Überlegungen zur Planung und Durchführung der Versuche 5.2. Abgleich mit dem Simulationsmodell 5.3. Auswertung und Diskussion der Versuchsergebnisse 6. Zusammenfassung und Ausblick / In the photovoltaic industry, the diamond wire sawing process is used for the production of crystalline silicon wafers. In this thesis, a dynamic model of the wire sawing process is presented, which enables the simulation of relevant process variables over the process time and the extension of the wire web. The model comprises a parametric material removal model, which describes the removal rate as a function of different process variables. The parameters of this model are identified using experimental data. Based on the validated model, different approaches to the optimization of the recipe are analyzed with the aim of increasing the productivity of the process. Finally, a selected approach is experimentally validated. The series of experiments reveals that a substantial reduction of the process time is achievable using the developed approaches.:1. Einleitung 1.1. Einordnung der Arbeit 1.2. Beschreibung des Drahtsägeprozesses mit Diamantdraht 1.3. Technisch-wissenschaftliche Zielsetzungen 1.4. Stand der Technik 1.5. Gliederung der Arbeit 2. Modellierung des Drahtsägeprozesses 2.1. Überblick und Notation 2.2. Modell für den Kontakt zwischen Draht und Siliziumbrick 2.3. Parametrisches Abtragmodell 2.4. Drahttransformationsmodelle 2.5. Rezeptmodell 2.6. Überblick über das Gesamtmodell 2.7. Implementierung in der Simulationsumgebung 3. Identifikation der Modellparameter und Modellvalidierung 3.1. Messdaten und Experimente 3.2. Methodik der Parameteridentifikation 3.3. Ergebnisse und Diskussion 4. Ansätze zur Rezeptoptimierung 4.1. Zielsetzungen und Grundlagen 4.2. Analyse der Prozessvariablen im quasistationären Zustand 4.3. Beschreibung verschiedener Methoden zur Erhöhung des Abtrages 4.4. Simulationsbasierter Vergleich verschiedener Rezepte 5. Experimentelle Validierung der Rezeptoptimierung 5.1. Überlegungen zur Planung und Durchführung der Versuche 5.2. Abgleich mit dem Simulationsmodell 5.3. Auswertung und Diskussion der Versuchsergebnisse 6. Zusammenfassung und Ausblick