Uniaxial stress is a powerful technique to tune the electronic structure of very pure materials. The novel piezoelectric-based techniques developed by our group, which allow application of large and homogeneous uniaxial pressure in a continuously-tunable manner, make uniaxial pressure an independent axis in the parameter space for the study of quantum materials. Many exciting experiments have been performed that combine different measurement methods with this uniaxial stress technique in the past few years. In this thesis, I demonstrate the first electrical transport measurement under uniaxial pressure of a free-standing microstructure single-crystalline sample patterned by focused ion beam (FIB) milling. With the microstructuring technique that I developed, the transport properties transverse to the force direction can be more accurately probed. The ability to resolve the anisotropy introduced by the uniaxial pressure lets us have a better understanding of how the electronic structure of Sr₂RuO₄ changes under uniaxial stress. Moreover, the microstructure technique opens new roads for smaller crystals (∼ 100 µm) to be studied under uniaxial pressure. In addition, higher stresses and better sample homogeneity could be achieved by working with smaller samples. For Sr₂RuO₄, one of the three Fermi-surface sheets can be driven through a Lifshitz transition by applying uniaxial stress along the [100] direction. Superconductivity and resistivity have been observed to be strongly enhanced at the singularity. In addition, a spin-density wave (SDW) has been observed at stresses beyond the Lifshitz transition. Measurement of the Hall effect under uniaxial stress allows us to probe Hund’s metal physics in Sr₂RuO₄. The Hall coefficient of unstressed Sr₂RuO₄ goes through two sign reversals, at 30 K and 120 K. Under the Hund’s metal scenario, this temperature dependence has been proposed to result from orbital differentiation of the inelastic scattering rate, which is a key property expected of Hund’s metals. In the present study, it is shown that at a temperature where electron-electron scattering dominates (≳ 5 K), the Hall coefficient becomes less electron-like while approaching the VHS, which is consistent with increased scattering in the d_xy band. Beyond the transition, the Hall coefficient becomes much more electron-like, which is opposite to expectations from the change in Fermi surface topology, but can be explained by a combination of Hund’s metal physics and strong suppression in the d_xy scattering rate. At very low temperature (0.5 K), the Hall coefficient is essentially unchanged across the Lifshitz transition, despite the change in the Fermi-surface topology. In contrast to the longitudinal resistivity that has a strong peak at the VHS but does not respond to the SDW, the resistance transverse to the force direction shows a strong response to the SDW, but only a small response at the VHS. In addition, I obtain ρ(T) at the Lifshitz transition below Tc by subtracting off the magnetoresistance and find that T² ln(1/T) fits better than T^3/2, which suggests a saddle point rather than an extended saddle point at the VHS.:1. Introduction to Sr2RuO4 1.1. Normal-State Properties Van Hove Singularity and Lifshitz Transition in Sr2RuO4 1.2. Hall Effect in Sr2RuO4 Weak-field Hall Coefficient Experimental Hall Coefficient in Sr2RuO4 and Related Systems 1.3. Hund’s Metal Scenario Dynamical Mean-Field Theory Experimental Evidence for Orbital Differentiation in Sr2RuO4 Hall Coefficient of Sr2RuO4 within Hund’s Metal Scenario 1.4 Uniaxial-Pressure Projects on Sr2RuO4 2. Experimental Setup 2.1. Stress and Strain 2.2. Uniaxial Stress Technique Uniaxial-Stress Cell Sample Carrier 2.3. Imperfections of the Stress Cells 2.4. Sample Preparation Needle Sample Preparation Microstructure Sample Preparation Comparison of the Two Samples 2.5. Measurement Setup 3He Cryostat Transport Measurement Setup 3. Hall Coefficient and Resistivity Measurements 3.1. Basics of Resistivity Measurement Stress Ramps 3.2. Basics of Hall Measurement Setup Field Dependence of Hall Resistivity Temperature Dependence of Hall Coefficient 3.3. Stress Ramps under Constant Magnetic Field 3.4. Stress Dependence of Hall Coefficient and Resistivity 3.5. Resistivity Measurements below Tc 3.6. Field Sweeps within the Magnetic Phase 3.7. Summary 4. Measurements Transverse to the Stress Axis 4.1. Setup for Transport Measurements Transverse to the Uniaxial Stress 4.2. Simulations Based on Finite Element Method 4.3. Resistance Measurements Transverse to Applied Stress 4.4. Summary 5. Data Analysis and Discussion 5.1. A Tight-Binding Model under Uniaxial Pressure 5.2. Analysis of Hall Coefficient across the Lifshitz Transition Hall Coefficient Analysis under the Isotropic-l or Isotropic-τ Approximations Hall Coefficient Analysis under Hund’s Metal Scenario 5.3. Magnetoresistance Subtraction in Temperature Ramps 5.4. Transport Properties at 5 K 5.5. Summary 6. Conclusions and Outlook Appendices A. Si-Gap-Platform Microstructure Project A.1. Si-Gap Platform A.2. Sample Preparation with PFIB-Microstructuring A.3. Microstructure Stress Cells B. Other results B.1. Hall Effect from the Hall Pair 2 B.2. Magnetoresistance in Longitudinal and Transverse Configurations B.3. Toward -1.5 GPa B.4. Comparison of RH(T) in Sr2RuO4 Compressed along [100] Direction and YBa2Cu3O6.67 Compressed along the b-axis Bibliography

Metal-Oxide-Silicon Field-Effect-Transistors with a layer of electrically isolated Si nanocrystals (NCs) embedded in the gate oxide are known to improve conventional floating gate flash memories. Data retention, program and erase speeds as well as the memory operation voltages can be substantially improved due to the discrete charge storage in the isolated Si NCs. Using ion beam synthesis, Si NCs can be fabricated along with standard CMOS processing. The optimization of the location and size of ion beam synthesized Si NCs requires a deeper understanding of the mechanisms involved, which determine (i) the built-up of Si supersaturation by high-fluence ion implantation and (ii) NC formation by phase separation. For that aim, process simulations have been conducted that address both aspects on a fundamental level and, on the other hand, are able to avoid tedious experiments. The built-up of a Si supersaturation by high-fluence ion implantation were studied using dynamic binary collision calculations with TRIDYN and have lead to a prediction of Si excess depth profiles in thin gate oxides of a remarkable quality. These simulations include in a natural manner high fluence implantation effects as target erosion by sputtering, target swelling and ion beam mixing. The second stage of ion beam synthesis is modeled with the help of a tailored kinetic Monte Carlo code that combines a detailed kinetic description of phase separation on atomic level with the required degree of abstraction that is necessary to span the timescales involved. Large ensembles of Si NCs were simulated reaching the late stages of NC formation and dissolution at simulation sizes that allowed a direct comparison with experimental studies, e.g. with electron energy loss resolved TEM investigations. These comparisons reveal a nice degree of agreement, e.g. in terms of predicted and observed precipitate morphologies for different ion fluences. However, they also point clearly onto impact of additional external influences as, e.g., the oxidation of implanted Si by absorbed humidity, which was identified with the help of these process simulations. Moreover, these simulations are utilized as a general tool to identify optimum processing regimes for a tailored Si NC formation for NC memories. It is shown that key properties for NC memories as the tunneling distance from the transistor channel to the Si NCs, the NC morphology, size and density can be adjusted accurately despite of the involved degree of self-organization. Furthermore, possible lateral electron tunneling between neighboring Si NCs is evaluated on the basis of the performed kinetic Monte Carlo simulations.

Obwohl Wasserstoff omnipräsent ist, ist seine Analytik anspruchsvoll und es stehen nur wenige analytische Verfahren zur Auswahl. Unter diesen nimmt die auf einer Kernreaktion von Wasserstoff und Stickstoff basierende N-15-Methode einen herausragenden Platz ein. Sie liefert eine ortsaufgelöste Wasserstoffkonzentration bis in den ppm-Bereich in oberflächennahen Schichten (kleiner 2 µm). Gegenstand der Arbeit sind die Darstellung der Theorie der N-15-Kernreaktionsanalyse (NRA), des experimentellen Aufbaus des entsprechenden Strahlrohrs am Ionenbeschleuniger der BAM und der Auswertung der Messergebnisse. Ziel ist die erstmalige Charakterisierung eines Referenzmaterials für die H-Analytik auf Basis von amorphen Silizium (aSi) auf einem Si[100]-Substrat. International wird von den metrologischen Instituten NIST [REE90] und IRMM [VAN87] je ein Referenzmaterial für die Heißextraktion in Form von Titanplättchen angeboten. Diese sind aber für die oberflächennahen Verfahren (NRA, ERDA, GDOES, SIMS) nicht nutzbar, da die oberflächennahe Konzentration von Wasserstoff in Titan nicht konstant ist. Die Homogenität der mittels CVD abgeschiedenen aSi:H-Schichten wurde untersucht. Dazu wurden pro Substrat für ca. 30 Proben die Wasserstofftiefenprofile gemessen, mittels eines innerhalb der Arbeit entstandenen Programms entfaltet und der statischen Auswertung unterzogen. Das Ergebnis waren Mittelwert und Standardabweichung der Wasserstoffkonzentration, sowie ein Schätzer für den Beitrag der Inhomogenität zur Meßunsicherheit. Die Stabilität des potentiellen Referenzmaterials wurde durch die Konstanz der Ergebnisse von Wiederholtungsmessungen der Wasserstoffkonzentrtion während der Applikation einer hohen Dosis von N-15 Ionen bewiesen. In einem internationalen Ringversuch wurde die Rückführbarkeit der Messergebnisse nachgewiesen. Teilnehmer waren 13 Labore aus 7 Ländern. Eingesetzt wurden N-15 und F-19 NRA, ERDA und SIMS. Besonderer Beachtung wurde der Bestimmung der Messunsicherheiten gewidmet. Für die Charakterisierung der aSi:H-Schichten wurden neben der NRA die Weißlichtinterferometrie, Ellipsometrie, Profilometrie und Röngenreflektometrie, sowie die IR- und Ramanspektroskopie genutzt. Die Stöchiometrie des eingesetzten Standardmaterials Kapton wurde mittels NMR-Spekroskopie und CHN-Analyse überprüft. [VAN87] Vandendriessche, S., Marchandise, H., Vandecasteele, C., The certification of hydrogen in titanium CRM No318, Brüssel-Luxembourg,1987 [REE90] Reed, W.P., Certificate of Analysis SRM 352c, Gaithersburg, NIST, 1990

Ion irradiation of tetrahedral amorphous carbon (ta-C) thin films induces a carbon phase transformation from the electrically insulating sp3 hybridization into the conducting sp2 hybridization. In this work, a detailed study on the electrical resistivity and the microstructure of areas, irradiated with several ion species at 30 keV energy is presented. Continuous ion bombardment yields a drastic drop of the resistivity as well as significant structural modifications of the evolving sp2 carbon phase. It is shown that the resistivity lowering can be attributed to the degree of graphitization in the film. Furthermore, the structural ordering processes are correlated with the ion deposited energy density. It is therefore revealed that the ion-induced phase transformation in ta-C films is a combination of sp3-to-sp2 conversion of carbon atoms and ion-induced ordering of the microstructure into a more graphite-like arrangement. All experiments were done with focused ion beam (FIB) systems by applying FIB lithography of electrical van-der-Pauw test structures. FIB lithography on ta-C layers is presented as a fast and easy technique for the preparation of electrically active micro- and nanostructures in an insulating carbon matrix.

Ion irradiation of tetrahedral amorphous carbon (ta-C) thin films induces a carbon phase transformation from the electrically insulating sp3 hybridization into the conducting sp2 hybridization. In this work, a detailed study on the electrical resistivity and the microstructure of areas, irradiated with several ion species at 30 keV energy is presented. Continuous ion bombardment yields a drastic drop of the resistivity as well as significant structural modifications of the evolving sp2 carbon phase. It is shown that the resistivity lowering can be attributed to the degree of graphitization in the film. Furthermore, the structural ordering processes are correlated with the ion deposited energy density. It is therefore revealed that the ion-induced phase transformation in ta-C films is a combination of sp3-to-sp2 conversion of carbon atoms and ion-induced ordering of the microstructure into a more graphite-like arrangement. All experiments were done with focused ion beam (FIB) systems by applying FIB lithography of electrical van-der-Pauw test structures. FIB lithography on ta-C layers is presented as a fast and easy technique for the preparation of electrically active micro- and nanostructures in an insulating carbon matrix.:Contents List of Figures iii List of Tables v List of Abbreviations vii 1. Introduction 1 2. Fundamentals 5 2.1. Ion-solid interactions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1.1. Scattering and stopping . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1.2. Ion range distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1.3. Target modifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1.4. Thermal driven segregation . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.2. Focused ion beams (FIBs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.2.1. Commercial gallium FIB (Ga + -FIB) . . . . . . . . . . . . . . . . . . . . . 24 2.2.2. Mass-separated FIB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2.3. Tetrahedral amorphous carbon (ta-C) . . . . . . . . . . . . . . . . . . . . . . . . 26 2.3.1. Composition, microstructure and film properties . . . . . . . . . . . . . . 26 2.3.2. Growth mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.3.3. Electronic properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3. Experimental 39 3.1. Samples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.2. Apparatus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4. Ion induced surface swelling 43 4.1. Fluence and energy dependence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.2. Calculations of the swelling height . . . . . . . . . . . . . . . . . . . . . . . . . . 48 5. Electrical properties of irradiated ta-C 55 5.1. Electrical resistivity of as-implanted ta-C . . . . . . . . . . . . . . . . . . . . . . 55 5.1.1. Resistance of Ga + implanted micropatterns . . . . . . . . . . . . . . . . . 55 5.1.2. Sheet resistance of Ga + irradiated ta-C . . . . . . . . . . . . . . . . . . . 59 5.1.3. Determination of the sp 3 content . . . . . . . . . . . . . . . . . . . . . . . 62 5.1.4. The effect of different ion species . . . . . . . . . . . . . . . . . . . . . . . 65 5.1.5. Low temperature resistivity – The peculiarity of gallium . . . . . . . . . . 71 5.2. The effect of annealing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.3. Irradiation at elevated substrate temperatures . . . . . . . . . . . . . . . . . . . . 79 6. The microstructure of irradiated ta-C 87 6.1. Raman investigations of ion irradiated ta-C . . . . . . . . . . . . . . . . . . . . . 88 6.1.1. Fundamentals of Raman spectroscopy on amorphous carbon . . . . . . . . 88 6.1.2. Raman spectra of as-implanted ta-C . . . . . . . . . . . . . . . . . . . . . 93 6.1.3. Thermally driven graphitization of the microstructure . . . . . . . . . . . 98ii Contents 6.1.4. The correlation between microstructure and resistivity . . . . . . . . . . . 101 6.2. TEM investigations of ion irradiated ta-C . . . . . . . . . . . . . . . . . . . . . . 104 7. FIB lithography on ta-C layers 107 7.1. Graphitic nanowires . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 7.1.1. Nanowire dimensions – The resolution of FIB lithography . . . . . . . . . 108 7.1.2. Nanowire resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 7.2. Electrical insulation between conducting structures . . . . . . . . . . . . . . . . . 113 8. Conclusions and Outlook 117 A. Gallium nanoparticles on ta-C layers 121 Bibliography 123

Efficient substrates for surface-enhanced Raman spectroscopy (SERS) are under constant development, since time-consuming and costly fabrication routines are often an issue for high-throughput spectroscopy applications. In this research, we use a two-step fabrication method to produce self-organized parallel-oriented plasmonic gold nanostructures. The fabrication routine is ready for wafer-scale production involving only low-energy ion beam irradiation and metal deposition. The optical spectroscopy features of the resulting structures show a successful bidirectional plasmonic response. The localized surface plasmon resonances (LSPRs) of each direction are independent from each other and can be tuned by the fabrication parameters. This ability to tune the LSPR characteristics allows the development of optimized plasmonic nanostructures to match different laser excitations and optical transitions for any arbitrary analyte. Moreover, in this study, we probe the polarization and wavelength dependence of such bidirectional plasmonic nanostructures by a complementary spectroscopic ellipsometry and Raman spectroscopy analysis. We observe a significant signal amplification by the SERS substrates and determine enhancement factors of over a thousand times. We also perform finite element method-based calculations of the electromagnetic enhancement for the SERS signal provided by the plasmonic nanostructures. The calculations are based on realistic models constructed using the same particle sizes and shapes experimentally determined by scanning electron microscopy. The spatial distribution of electric field enhancement shows some dispersion in the LSPR, which is a direct consequence of the semi-random distribution of hotspots. The signal enhancement is highly efficient, making our SERS substrates attractive candidates for high-throughput chemical sensing applications in which directionality, chemical stability, and large-scale fabrication are essential requirements.

Metal-Oxide-Silicon Field-Effect-Transistors with a layer of electrically isolated Si nanocrystals (NCs) embedded in the gate oxide are known to improve conventional floating gate flash memories. Data retention, program and erase speeds as well as the memory operation voltages can be substantially improved due to the discrete charge storage in the isolated Si NCs. Using ion beam synthesis, Si NCs can be fabricated along with standard CMOS processing. The optimization of the location and size of ion beam synthesized Si NCs requires a deeper understanding of the mechanisms involved, which determine (i) the built-up of Si supersaturation by high-fluence ion implantation and (ii) NC formation by phase separation. For that aim, process simulations have been conducted that address both aspects on a fundamental level and, on the other hand, are able to avoid tedious experiments. The built-up of a Si supersaturation by high-fluence ion implantation were studied using dynamic binary collision calculations with TRIDYN and have lead to a prediction of Si excess depth profiles in thin gate oxides of a remarkable quality. These simulations include in a natural manner high fluence implantation effects as target erosion by sputtering, target swelling and ion beam mixing. The second stage of ion beam synthesis is modeled with the help of a tailored kinetic Monte Carlo code that combines a detailed kinetic description of phase separation on atomic level with the required degree of abstraction that is necessary to span the timescales involved. Large ensembles of Si NCs were simulated reaching the late stages of NC formation and dissolution at simulation sizes that allowed a direct comparison with experimental studies, e.g. with electron energy loss resolved TEM investigations. These comparisons reveal a nice degree of agreement, e.g. in terms of predicted and observed precipitate morphologies for different ion fluences. However, they also point clearly onto impact of additional external influences as, e.g., the oxidation of implanted Si by absorbed humidity, which was identified with the help of these process simulations. Moreover, these simulations are utilized as a general tool to identify optimum processing regimes for a tailored Si NC formation for NC memories. It is shown that key properties for NC memories as the tunneling distance from the transistor channel to the Si NCs, the NC morphology, size and density can be adjusted accurately despite of the involved degree of self-organization. Furthermore, possible lateral electron tunneling between neighboring Si NCs is evaluated on the basis of the performed kinetic Monte Carlo simulations.

Obwohl Wasserstoff omnipräsent ist, ist seine Analytik anspruchsvoll und es stehen nur wenige analytische Verfahren zur Auswahl. Unter diesen nimmt die auf einer Kernreaktion von Wasserstoff und Stickstoff basierende N-15-Methode einen herausragenden Platz ein. Sie liefert eine ortsaufgelöste Wasserstoffkonzentration bis in den ppm-Bereich in oberflächennahen Schichten (kleiner 2 µm). Gegenstand der Arbeit sind die Darstellung der Theorie der N-15-Kernreaktionsanalyse (NRA), des experimentellen Aufbaus des entsprechenden Strahlrohrs am Ionenbeschleuniger der BAM und der Auswertung der Messergebnisse. Ziel ist die erstmalige Charakterisierung eines Referenzmaterials für die H-Analytik auf Basis von amorphen Silizium (aSi) auf einem Si[100]-Substrat. International wird von den metrologischen Instituten NIST [REE90] und IRMM [VAN87] je ein Referenzmaterial für die Heißextraktion in Form von Titanplättchen angeboten. Diese sind aber für die oberflächennahen Verfahren (NRA, ERDA, GDOES, SIMS) nicht nutzbar, da die oberflächennahe Konzentration von Wasserstoff in Titan nicht konstant ist. Die Homogenität der mittels CVD abgeschiedenen aSi:H-Schichten wurde untersucht. Dazu wurden pro Substrat für ca. 30 Proben die Wasserstofftiefenprofile gemessen, mittels eines innerhalb der Arbeit entstandenen Programms entfaltet und der statischen Auswertung unterzogen. Das Ergebnis waren Mittelwert und Standardabweichung der Wasserstoffkonzentration, sowie ein Schätzer für den Beitrag der Inhomogenität zur Meßunsicherheit. Die Stabilität des potentiellen Referenzmaterials wurde durch die Konstanz der Ergebnisse von Wiederholtungsmessungen der Wasserstoffkonzentrtion während der Applikation einer hohen Dosis von N-15 Ionen bewiesen. In einem internationalen Ringversuch wurde die Rückführbarkeit der Messergebnisse nachgewiesen. Teilnehmer waren 13 Labore aus 7 Ländern. Eingesetzt wurden N-15 und F-19 NRA, ERDA und SIMS. Besonderer Beachtung wurde der Bestimmung der Messunsicherheiten gewidmet. Für die Charakterisierung der aSi:H-Schichten wurden neben der NRA die Weißlichtinterferometrie, Ellipsometrie, Profilometrie und Röngenreflektometrie, sowie die IR- und Ramanspektroskopie genutzt. Die Stöchiometrie des eingesetzten Standardmaterials Kapton wurde mittels NMR-Spekroskopie und CHN-Analyse überprüft. [VAN87] Vandendriessche, S., Marchandise, H., Vandecasteele, C., The certification of hydrogen in titanium CRM No318, Brüssel-Luxembourg,1987 [REE90] Reed, W.P., Certificate of Analysis SRM 352c, Gaithersburg, NIST, 1990

No description available.

Dehnungssensoren werden zur Überwachung von sicherheitsrelevanten Bauteilen, besonders in Bauteilen aus faserverstärkten Polymermatrixverbundwerkstoffen eingesetzt. Durch deren Integration in das Bauteilinnere werden sie vor schädigenden mechanischen sowie korrosiven Einwirkungen geschützt. Dies gewährleistet eine zuverlässige sowie dauerhafte Funktion. Verschiedene Ansätze zur Weiterentwicklung integrierbarer Dehnungssensoren werden international untersucht. Die Verringerung des Sensordurchmessers auf Abmaße im Bereich des Durchmessers von Verstärkungsfasern ist dabei ein bedeutendes Entwicklungsziel. Insbesondere bei der Integration in Bauteile aus faserverstärkten Kunststoffen sorgen zum Durchmesser von Fasern vergleichbare Sensordurchmesser für eine optimale Sensoranbindung. Die Bildung von Harznestern sowie schwächender Unstetigkeiten kann mittels dünner Sensoren verhindert werden. Dies gewährleistet eine artefaktefreie Dehnungsmessung. Drei verschiedene Ansätze für neuartige Dehnungssensoren mit kleinem Querschnitt wurden in dieser Arbeit untersucht. / Strain sensors are used for structural health monitoring issues, certainly in parts with high safety requirements made of fibre-reinforced plastic composites. The integration of these sensors inside the parts protects them against any mechanical and corrosive impact. The sensor functionality can be enhanced by integration. There is a lot of international research effort to further develop integratable strain sensors. Different approaches are currently pursued. This thesis presents the results of investigations on three different approaches for novel strain sensors. The main goal of these investigations was to minimise the sensor diameter down to the diameter of reinforcing fibres. The small diameter allows for an optimum and artefact free integration of the sensors. The formation of resin nests and notches to the material structure can be prevented by integrating sensor with a smaller diameter. The strain measurement and monitoring is enhanced and more reliable then.