The work reported in this dissertation is intended to propose, analyze and demonstrate a technology for a high temperature integrated power electronics module, for high temperature (e.g those over 200oC) applications involving high density and low stress. To achieve this goal, this study has examined some existing packaging approaches, such as wire-bond interconnects and solder die-attach, flip-chip and pressure contacts. Based on the survey, a high temperature, multilayer 3-D packaging technology in the form of an Embedded Chip Module (ECM) is proposed to realize a lower stress distribution in a mechanically balanced structure with double-sided metallization layers and material CTE match in the structure. Thermal and thermo-mechanical analysis on an ECM is then used to demonstrate the benefits on the cooling system, and to study the material and structure for reducing the thermally induced mechanical stress. In the thermal analysis, the high temperature ECM shows the ability to handle a power density up to 284 W/in3 with a heat spreader only 2.1x2.1x0.2cm under forced convection. The study proves that the cooling system can be reduced by 76% by using a high temperature module in a room temperature environment. Furthermore, six proposed structures are compared using thermo-mechanical analysis, in order to obtain an optimal structure with a uniform low stress distribution. Since pure Mo cannot be electroplated, the low CTE metal Cr is proposed as the stress buffering material to be used in the flat metallization layers for a fully symmetrical ECM structure. Therefore, a chip area stress as low as 126MPa is attained. In the fabrication process, the high temperature material glass and a ceramic adhesive are applied as the insulating and sealing layers. Particularly, the Cr stress buffering layer is successfully electroplated in the high temperature ECM by means of the hard chrome plating process. The flat metallization layer is accomplished by using a combined structure with Cr and Cu metallization layers. The experimental evaluations, including the electrical and thermal characteristics of the ECM, have been part of in the study. The forward and reverse characteristics of the ECM are presented up to 250oC, indicating proper device functionality. The study on the reverse characteristics of the ECM indicates that the large leakage current at high temperature is not due to the package surrounding the chip, but chiefly caused by the Schottky junction and the chip passivation layer. Finally, steady-state and transient measurements are conducted in terms of the thermal measurements. The steady-state thermal measurement is used to demonstrate the cooling system reduction. To obtain the thermal parameters of the different layers in the high temperature ECM, the transient thermal measurement is applied to a single chip ECM based on the temperature cooling-down curve measurement. / Ph. D.

Yes / Antioxidant active packaging was prepared by coating a citrus extract on the surface of polyethylene terephthalate (PET) trays which had been either treated with an atmospheric pressure plasma jet or left untreated. The surface characteristics of the packaging were examined, as were its stability and antioxidant efficacy following storage for up to 24 weeks under the following three storage conditions: room temperature, 0 % relative humidity (RH) or 50 °C. Plasma pretreatment increased coating density, thickness and roughness, and oxygenated functional groups at the polymer surface, whereas water contact angle decreased. Trays stored at room temperature did not lose their antioxidant efficacy over 24 weeks and plasma pretreatment enhanced the efficacy from week 8 onwards. Gravimetric analysis of the coating revealed a loss of antioxidant compounds only after 16 weeks. Trays stored at 0 % RH lost coating from week 1 onwards, with lower loss in plasma pretreated trays, while loss of coating was highest at 50 °C, with lower loss in plasma pretreated trays only after 24 weeks. Overall, the surface characteristics of the antioxidant active packaging were modified by plasma pretreatment of the PET surface, with some improvement in antioxidant efficacy, and the efficacy of the packaging in delaying oxidative deterioration in cooked meats was retained during storage at ambient temperature.

<p dir="ltr">Modeling and simulation play a pivotal role in engineering and research, enabling cost effective solutions for design, manufacturing, and failure analysis, especially where physical testing is infeasible. This work explores numerical methods for multi-scale domains, where structures span diverse length scales, presenting unique challenges in meshing and accuracy. Advanced approaches such as domain decomposition and global-local methods are discussed, with an emphasis on their application in heterogeneous integration (HI) for advanced packaging. HI, which addresses the limitations of Moore’s Law, integrates diverse components into 2.5D and 3D architectures but introduces complex mechanical and thermo-mechanical challenges. This research addresses gaps in multi-scale numerical frameworks, proposing novel methods to handle non-linear physical evolution while maintaining compatibility with existing tools. A non-intrusive global-local inspired methodology that couples the local subdomain back to the global subdomain was implemented to increase the accuracy in non-linear multi-scale simulations involving evolution at local scale. The developed framework was then generalized to solve rate dependent and rate independent phenomenon. The work further extends into numerical methods for design of HI packages as well. Unlike detailed analysis, the design stage analysis prioritizes speed of computation with a first order accuracy of results. This is achieved using machine learning techniques for efficient design space exploration in HI. The study overall aims to advance computational frameworks tailored for accuracy in reliability analysis and speed in design stages, focusing on semiconductors and advanced packaging applications.</p>

With increased focus on miniaturization and high performance in electronics, thermal management is a very important area of research today. In multiple applications such as portable electronics, consumer electronics, military applications, automobile, power electronics, high performance computing, etc. innovative thermal management strategies are necessary. In this work, two novel approaches to dissipate redundant heat better- first by novel carbonaceous-nanoparticle additives to develop thermal interface materials with superior performance and the second by using advanced metal additive manufacturing techniques to design and analyze metal-lattice based heat sinks are presented. Thermal Interface Materials with multiple carbon-based nanoparticle fillers such as coal-derived Multi Layered Graphene (MLG), standard reduced Graphene Oxide (rGO), Multi-Walled Carbon Nano Tubes (MWCNTs), and Graphene Nano-Platelets (GNPs) in thermal paste were synthesized and seen to have superior heat dissipation properties. Also, graphene was synthesized from coal through an in-house, facile, scalable and cost-effective process. The enhancement in thermal conductance varies from ~70% in the coal-MLG to ~14% in MWCNTs-based TIMs. Noteworthy is ~3.5 times larger enhancement in thermal performance with the in-house coal-derived-MLG as compared to the commercially available g-MLG. At a 3% wt. fraction of coal-MLG, enhancement in thermal conductance was almost 120% higher compared to the base thermal grease. In the second part, metal lattice-based heat sinks are designed for additive manufacturing for use in passive cooling of high-flux thermal management. A parametric optimization based on the lattice geometry, thickness, and height subject to additive manufacturing constraints is conducted. Intricate metal lattices with low mass based on the Simple Cubic, Octet, and Voronoi structures were generated by implicit modelling in nTopology® and their thermal performance was analyzed through numerical analysis using commercial CFD packages. The Voronoi lattice performed best with a significant improvement in thermal performance (~18% reduction in junction temperature difference with respect to ambient) as compared to a standard baseline Longitudinal heat Sink (LHS), while reducing the mass of the heat sink by ~2.1 times. Such optimized metal lattice-based heat sinks can lead to significant downsizing, reduction in overall mass and cost in applications where thermal management is critical with a need for low mass. We believe that such novel scalable materials and processes suited for mass production could be critical in meeting the material, design and product development needs to tackle the thermal management challenges of the future. / Master of Science / With increase in demand of high power and performance in electronics, there is a concurrent increase in redundant heat that needs to be dissipated. With enhanced focus and push towards electric vehicles, defense, consumer electronics, datacenter and supercomputing applications, electronics cooling is a critical area of research today. There are two primary resistances to heat- as it is removed from electronics package to the surrounding atmosphere – due to the thin layer of a material called Thermal Interface Material (TIM) at the interface between the heat sink and the package, and the resistance offered by the heat sink itself. In this work, a two-pronged approach for better cooling in electronics is presented. Firstly, carbon-based nano-sized particles are used to synthesize novel TIMs that provide superior heat transport capabilities as compared to a standard baseline. In the second approach, complex metal-lattice based heat sinks are designed for manufacturing with advanced techniques such as metal 3D printing. Multiple carbon-based nano-particle additives such as Multi Layered Graphene synthesized from coal (MLG), standard commercially available reduced Graphene Oxide (rGO), Multi-Walled Carbon Nano Tubes (MWCNTs), and Graphene Nano-Platelets (GNPs) are dispersed in thermal paste and all of the resulting composites were found to remove heat better from electronics packages. The improvement in this ability varies from ~70% in the coal-MLG to ~14% in MWCNTs-based TIMs. Noteworthy is ~3.5 times larger enhancement in the heat transport ability with the use of in-house coal-derived-MLG as compared to the commercially available g-MLG. At an 3% wt. fraction of coal-MLG, there was a 1.2x increase in thermal performance as compared to the base thermal grease. Also, it is significant to mention that MLG was synthesized from coal through an in-house, facile scalable and cost-effective process. In the second part, metal lattice-based heat sinks designed for metal 3D printing for use in passive cooling of electronics was investigated. Multiple geometric parameters such as the lattice type, thickness, and height subject to additive manufacturing constraints were studied. Intricate metal lattices with low mass based on three structures- Simple Cubic, Octet, and Voronoi were generated by implicit modelling, and their thermal performance was predicted by computer based-simulations using commercial CFD packages. The Voronoi lattice performed best with a significant reduction (~18%) in junction temperature difference with the surrounding atmosphere- as compared to a standard baseline rectangular heat sink design, while simultaneously reducing the mass of the heat sink by ~2.1 times. Such optimized metal lattice-based heat sinks can lead to significant reduction in overall mass, size, and cost in weight sensitive applications. We believe that such novel scalable materials, designs, and processes suited for mass production could be critical in meeting the material, design and product development needs to tackle the thermal management challenges of the near future.

Plastic was initially designed to enhance human well-being, but now it has become a threat to us and the planet. The plastic industry faces significant scrutiny due to the sustainability challenges associated with plastic products. The purpose of this study is to understand how organisations in the plastic industry manage its legitimacy and ensure the industry's survival. We employ organisational legitimacy as a lens and the three pillars of institutions - regulative, normative, and cultural-cognitive - as an analytic framework, to understand the roles of legitimacy in shaping an organisation's sustainability practices. Site Zero, Europe's largest plastic packaging waste sorting facility in Motala, Sweden has caught our attention. Utilising a qualitative research strategy and a case study research design, this paper explores how the multifaceted nature of legitimacy impacts Site Zero on its sustainability practices. Besides the site visit, we have conducted seven semi-structured interviews with five key members of Swedish Plastic Recycling and two material experts from a public agency and a producer responsibility organisation. Through this case study, we conclude that there is a gap between legitimacy and sustainability. Pursuing legitimacy increases the chance of organisations' survival in the plastic industry, however, it may also hinder them from achieving sustainability. Additionally, while high-quality recycling plays a crucial role in handling plastic packaging waste, it has its limitations in making plastic sustainable with the current profit-driven market and an overconsumption lifestyle.

In this work, the thermal behavior of a DBC substrate with a multi-die array using an inductively generated temperature input is investigated. Through a combination of iterative modeling and numerical simulations, the study analyzes the temperature distribution and the resulting temperature profiles within the entire setup. These results provide valuable insights into the practical impact of an alternative temperature generation by induction heating in the field of multi-die attach and power packaging.:1. Introduction 2. Problem description 3. Preliminary results 4. Conclusions 5. References 6. Authors

The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. The exclusive use of IC manufacturing technologies leads to limited material choices, limited design flexibility and consequently to sub-optimal MEMS and NEMS devices. The work presented in this thesis breaks new ground with a multitude of novel approaches for the integration of non-standard materials that enable the fabrication of 3D micro and nanoelectromechanical systems. The objective of this thesis is to highlight methods that make use of non-standard materials with superior characteristics or methods that use standard materials and fabrication techniques in a novel context. The overall goal is to propose suitable and cost-efficient fabrication and integration methods, which can easily be made available to the industry. The first part of the thesis deals with the integration of bulk wire materials. A novel approach for the integration of at least partly ferromagnetic bulk wire materials has been implemented for the fabrication of high aspect ratio through silicon vias. Standard wire bonding technology, a very mature back-end technology, has been adapted for yet another through silicon via fabrication method and applications including liquid and vacuum packaging as well as microactuators based on shape memory alloy wires. As this thesis reveals, wire bonding, as a versatile and highly efficient technology, can be utilized for applications far beyond traditional interconnections in electronics packaging. The second part presents two approaches for the 3D heterogeneous integration based on layer transfer. Highly efficient monocrystalline silicon/ germanium is integrated on wafer-level for the fabrication of uncooled thermal image sensors and monolayer-graphene is integrated on chip-level for the use in diaphragm-based pressure sensors. The last part introduces a novel additive fabrication method for layer-bylayer printing of 3D silicon micro- and nano-structures. This method combines existing technologies, including focused ion beam implantation and chemical vapor deposition of silicon, in order to establish a high-resolution fabrication process that is related to popular 3D printing techniques. / <p>QC 20121207</p>

CNPq / Mudanças nos hábitos alimentares, nas políticas de segurança alimentar e nos estilos de vida da população tem modificado os padrões de projeto das embalagens dos alimentos. Estas mudanças são visíveis especialmente nas funções das embalagens que precisam dar conta da diversidade de oferta de alimentos congelados preparados, denominados alimentos preparados. No contexto do desenvolvimento de embalagens, questiona-se a necessidade de aprofundar a pesquisa nas funções das embalagens para essas categorias de produtos, identificando parâmetros que atendam suas especificidades. E ainda, considerando o cenário produtivo, a análise daquelas já disponíveis no mercado. Para mapear o contexto de projeto de produto, esta investigação busca delimitar as principais funções e características exigidas das embalagens de alimentos congelados preparados, bem como os métodos e práticas de projeto e o cenário de regulamentação dos órgãos normatizadores de segurança alimentar dos alimentos embalados. Como resultado dessa investigação foi elaborado um manual de referência para profissionais envolvidos na estratégia e projeto para o segmento - designers industriais e projetistas de embalagens - de modo a integrar ações, normas e métodos de projeto de produto. Uma amostragem desses perfis profissionais esteve envolvida na pesquisa com usuários e avaliação do manual e os resultados apontaram a necessidade de interlocução entre as áreas (de projeto/alimentos), reforçando a carência de materiais de referência que reúnam, de forma objetiva e sistemática, mecanismos de apoio aos responsáveis pelas análises e validações de embalagens para alimentos preparados congelados. / Changes in eating habits, the food security policies and people's lifestyles have modified food packages of design standards. These changes are visible especially in the functions of the packages that need to account for the diversity of supply of prepared frozen foods, prepared foods called. In the development of packaging, we question the need for further research into the functions of packaging for these product categories, identifying parameters that meet their specific requirements. Further, considering the manufacturing scenario, the analysis those already available on the market. To map the product design context, this research seeks to define the main functions and characteristics required of prepared frozen food packaging, as well as the methods and design practices and regulatory setting of the standard-setting bodies for food safety of packaged food. As a result of this investigation has produced a reference manual for professionals involved in strategy and design to the segment - industrial designers and packaging designers - to integrate actions, standards and product design methods. A sampling of these professional profiles has been involved in research with users and manual evaluation and the results showed the need for dialogue between the areas (design / food), reinforcing the lack of reference materials, comprising an objective and systematic way, mechanisms support those responsible for analysis and packaging validations for frozen prepared foods.

Effiziente und zuverlässige Prozesse sind für die Produktion und das Verpacken von Verbrauchsgütern wie Lebensmittel aufgrund enorm hoher Produktionsmengen von großer Bedeutung. Auch im Getränkebereich steigt der Kostendruck und rückt die Bedeutung effizienter Prozesse in den Vordergrund. Mit systematischer Analyse des Betriebsverhaltens der Anlagen gelingt es, die technischen und organisatorischen Potenziale besser zu nutzen und die Gesamteffektivität der Produktion zu erhöhen. / Efficient and reliable processes for production and packaging are of great importance for high production quantity of consumer goods like food. Especially in the beverage industry the cost pressure is increasing, that’s why the significance of efficient processes gets more and more important. The systematic analysis of the operating behavior of machine equipment helps to find technical and organizational potential to increase the overall effectiveness of the production.

Thesis (MSc)--Stellenbosch University, 2012. / ENGLISH ABSTRACT: The presence of mineral oils in dry foodstuff was found to originate from the packaging materials, namely, paperboard manufactured from recovered fibres, and these oils subsequently migrate to the foodstuff via the vapour phase. The presence of mineral oils in food is of concern as it originates from the use of paper products not originally intended for food contact applications, i.e., before the paper is subjected to a suitable recycling process. These mineral oils consist of technical grade compounds which may contain aromatic compounds and other components with unknown toxicological effects. Although the related authorities are currently considering the safe and legal limits of these contaminants in foodstuffs, as well as establishing a standardised test method for monitoring mineral oils in food and packaging materials, paperboard manufacturers wish to ensure that their products are safe for food contact applications. Since recycling is unavoidable, particularly from an ecological and economical point of view, one of the proposed solutions the industry is focussing on is the use of a functional barrier towards mineral oils – be it an inner bag as a direct food-contact surface, or a barrier coating directly applied on the inner side of the paperboard. In this study, a permeation test method was established, and developed, to evaluate the transmission rate of a volatile organic compound, acting as a mineral oil simulant, through model paper and plastic packaging materials. This was correlated to the transmission rate of actual mineral oil through the packaging materials, and therefore used as a highly accelerated tool to characterise packaging materials in relation to their barrier properties. The test method, referred to as the “heptane vapour transmission rate,” was subsequently used to derive the required transport parameters’ characteristics of each of the tested materials, which enabled an evaluation of the potential shelf-life of the packaged product. This research demonstrated that barrier-coated paperboards have the ability to behave in the same way as, and often even better than, commercial plastic films, towards the migration of mineral oil. Detailed information on the interaction between the packaging materials and mineral oil simulant, n-heptane, was acquired from gravimetric sorption. Insight was obtained into a material’s ability to function as a mineral oil barrier. It was established that the quick and easy permeation method was sufficient for evaluating packaging materials as potential mineral oil barriers, and resulted in the determination of transport parameters that were higher than that obtained by sorption. The obtained transport parameters could therefore be considered a worst case scenario when predicting the package content shelf-life. / AFRIKAANSE OPSOMMING: Daar is voorheen bevind dat die teenwoordigheid van mineraalolies in droë voedsel afkomstig is van die verpakkingsmateriaal, naamlik karton, wat vervaardig is van herwonne papierprodukte, en daarna migreer die olies na die voedsel deur die gasfase. Die teenwoordigheid van hierdie mineraalolies in kos wek groot kommer aangesien dit afkomstig is van papierprodukte wat nie oorspronklik bedoel is vir voedselkontak voor die herwinningsproses nie. Die olies bestaan uit industriële graad mineraalolies wat moontlik aromatiese verbindings asook ander komponente bevat waarvan die toksiekologiese effekte onbekend is. Terwyl die betrokke owerhede tans besig is om die veilige en wettige grense van hierdie kontaminante in voedsel te oorweeg, asook die vestigting van 'n gestandaardiseerde toetsmetode vir die kontrole van mineraalolies in die voedsel-verpakkingsmateriaal-kombinasie, wil karton- en papiervervaardigers graag verseker dat hul produkte veilig is vir voedselkontak. Siende dat herwinning onvermydelik is vanuit 'n ekologiese en ekonomiese oogpunt, is een van die voorgestelde oplossings in die bedryf om te fokus op die gebruik van 'n funksionele keerfilm ten opsigte van mineraalolies, wat ‘n sakkie binne-in die karton, wat dien as die direkte kos-kontakoppervlak, of 'n keerlaag, wat direk aangewend word op die binnekant van die karton, kan behels. Hierdie studie ondersoek die daarstel en deursypelingsontwikkeling van 'n toetsmetode om die oordragtempo van 'n vlugtige organiese verbinding, wat optree as 'n mineraalolie simulant, deur middel van model papier- en plastiekverpakkingsmateriale, te evalueer. Dit stem ooreen met die oordragtempo van werklike mineraalolies deur die verpakkingsmateriaal en kan dus gebruik word as 'n hoogs versnelde instrument om verpakkingsmateriale te karakteriseer met betrekking tot hul keereienskappe. Die toetsmetode, die sogenaamde "heptaangasoordragtempo," is vervolgens gebruik om die vereiste oordragparameters af te lei wat kenmerkend is van elk van die geëvalueerde verpakkingsmateriale en wat sodoende gebruik kon word om die potensiële raklewe van die verpakte produk te bepaal. Hierdie navorsing het getoon dat kartonprodukte met ‘n keerlaag die vermoë het om dieselfde op te tree as kommersiële plastiekfilms en dikwels selfs beter, ten opsigte van die migrasie van mineraalolies. Gedetailleerde inligting oor die interaksie tussen die verpakkingsmateriale en mineraalolie simulant, n-heptaan, is verkry vanaf gravimetriese sorpsie. Dit gee insig in 'n materiaal se vermoë om te funksioneer as 'n mineraalolie-keermiddel. Daar is vasgestel dat die vinnige en maklike deurwerking metode voldoende is vir die evaluering van verpakkingsmateriale as potensiële mineraalolie-keermiddels, en verleen oordragparameters wat hoër is as dié verkry deur sorpsie. Hierdie oordragparameters kan dus as 'n ergste scenario vir die voorspelling van die raklewe van ‘n verpakte produk beskou word.