The main goal of this thesis is to develop practical digital controller architectures for multi-phase dc-dc converters utilized in low power (up to few hundred watts) and cost-sensitive applications. The proposed controllers are suitable for on-chip integration while being capable of providing advanced features, such as dynamic efficiency optimization, inductor current estimation, converter component identification, as well as combined dynamic current sharing and fast transient response. The first part of this thesis addresses challenges related to the practical implementation of digital controllers for low-power multi-phase dc-dc converters. As a possible solution, a multi-use high-frequency digital PWM controller IC that can regulate up to four switching converters (either interleaved or standalone) is presented. Due to its configurability, low current consumption (90.25 μA/MHz per phase), fault-tolerant work, and ability to operate at high switching frequencies (programmable, up to 10 MHz), the IC is suitable to control various dc-dc converters. The applications range from dc-dc converters used in miniature battery-powered electronic devices consuming a fraction of watt to multi-phase dedicated supplies for communication systems, consuming hundreds of watts. A controller for multi-phase converters with unequal current sharing is introduced and an efficiency optimization method based on logarithmic current sharing is proposed in the second part. By forcing converters to operate at their peak efficiencies and dynamically adjusting the number of active converter phases based on the output load current, a significant improvement in efficiency over the full range of operation is obtained (up to 25%). The stability and inductor current transition problems related to this mode of operation are also resolved. At last, two reconfigurable digital controller architectures with multi-parameter estimation are introduced. Both controllers eliminate the need for external analog current/temperature sensing circuits by accurately estimating phase inductor currents and identifying critical phase parameters such as equivalent resistances, inductances and output capacitance. A sensorless non-linear, average current-mode controller is introduced to provide fast transient response (under 5 μs), small voltage deviation and dynamic current sharing with multi-phase converters. To equalize the thermal stress of phase components, a conduction loss-based current sharing scheme is proposed and implemented.

Current electrical systems are faced with the limitation in performance by the electrical interconnect technology determining overall processing speed. In addition, the electrical interconnects containing many long distance interconnects require high power to drive. One of the best ways to overcome these bottlenecks is through the use of optical interconnect to limit interconnect latency and power. This research explores new computer-aided design algorithms for developing optoelectronic systems. These algorithms focus on place and route problems using optical interconnections covering system-on-a-chip design as well as system-on-a-package design. In order to design optoelectronic systems, optical interconnection models are developed at first. The CAD algorithms include optical interconnection models and solve place and route problems for optoelectronic systems. The MCNC and GSRC benchmark circuits are used to evaluate these algorithms.

Integrated systems with billions of transistors on a single chip are a now reality. These systems include multi-core microprocessors and are built today using deca-nanometer devices organized into synchronous digital circuits. The movement of data within such systems is regulated by a set of predictable timing signals, called clocks, which must be distributed to a large number of sequential elements. Collectively, these clocks have a significant impact on the frequency of operation and, consequently, on the performance of the systems. The clocks are also responsible for a large fraction of the power consumed by these systems. The objective of this dissertation is to better understand clock distribution in order to identify opportunities and strategies for improvement by analyzing the conditions under which the optimal tradeoff between power and performance can be achieved, by modeling the constraints associated with local and global clocking, by evaluating the impact of noise, and by investigating promising new design strategies for future integrated systems.

This thesis presents the analysis, design and characterization of an integrated high-frequency phase-locked loop (PLL) frequency multiplier. The frequency multiplier is novel in its use of a low multiplication factor of 4 and a fully differential topology for rejection of common mode interference signals. The PLL is composed of a voltage controlled oscillator (VCO), injection-locked frequency divider (ILFD) for the first divide-by-two stage, a static master-slave flip-flop (MSFF) divider for the second divide-by-two stage and a Gilbert cell mixer phase detector (PD). The circuit has been fabricated using a standard CMOS 0.18-um process based on its relatively low cost and ready availability. The PLL frequency multiplier generates an output signal at 26 GHz and is the highest operational frequency PLL in the technology node reported to date. Time domain phase plane analysis is used for prediction of PLL locking range based on initial conditions of phase and frequency offsets. Tracking range of the PLL is limited by the inherent narrow locking range of the ILFD, and is confirmed via experimental results. The performance benefits of the fully differential PLL are experimentally confirmed by the injection of differential- and common-mode interfering signals at the VCO control lines. A comparison of the common- and differential-mode modulation indices reveals that a common mode rejection ratio (CMRR) of greater than 20 dB is possible for carrier offset frequencies of less than 1 MHz. Closed-loop frequency domain transfer functions are used for prediction of the PLL phase noise response, with the PLL being dominated by the reference and VCO phase noise contributions. Regions of dominant phase noise contributions are presented and correlated to the overall PLL phase noise performance. Experimental verifications display good agreement and confirm the usefulness of the techniques for PLL performance prediction. The PLL clock multiplier has an operational output frequency of 26.204 to 26.796 GHz and a maximum output frequency step of 16 MHz. Measured phase noise at 1 MHz offset from the carrier is -103.9 dBc/Hz. The PLL clock multiplier core circuit (VCO/ILFD/MSFF Divider/PD) consumes 186 mW of combined power from 2.8 and 4.3 V DC rails. / Thesis (Ph.D, Electrical & Computer Engineering) -- Queen's University, 2009-04-24 11:31:35.384

Les systèmes multiprocesseurs sur puce électronique (On-Chip Multiprocessor [OCM]) sont considérés comme les meilleures structures pour occuper l'espace disponible sur les circuits intégrés actuels. Dans nos travaux, nous nous intéressons à un modèle architectural, appelé architecture isométrique de systèmes multiprocesseurs sur puce, qui permet d'évaluer, de prédire et d'optimiser les systèmes OCM en misant sur une organisation efficace des nœuds (processeurs et mémoires), et à des méthodologies qui permettent d'utiliser efficacement ces architectures. Dans la première partie de la thèse, nous nous intéressons à la topologie du modèle et nous proposons une architecture qui permet d'utiliser efficacement et massivement les mémoires sur la puce. Les processeurs et les mémoires sont organisés selon une approche isométrique qui consiste à rapprocher les données des processus plutôt que d'optimiser les transferts entre les processeurs et les mémoires disposés de manière conventionnelle. L'architecture est un modèle maillé en trois dimensions. La disposition des unités sur ce modèle est inspirée de la structure cristalline du chlorure de sodium (NaCl), où chaque processeur peut accéder à six mémoires à la fois et où chaque mémoire peut communiquer avec autant de processeurs à la fois. Dans la deuxième partie de notre travail, nous nous intéressons à une méthodologie de décomposition où le nombre de nœuds du modèle est idéal et peut être déterminé à partir d'une spécification matricielle de l'application qui est traitée par le modèle proposé. Sachant que la performance d'un modèle dépend de la quantité de flot de données échangées entre ses unités, en l'occurrence leur nombre, et notre but étant de garantir une bonne performance de calcul en fonction de l'application traitée, nous proposons de trouver le nombre idéal de processeurs et de mémoires du système à construire. Aussi, considérons-nous la décomposition de la spécification du modèle à construire ou de l'application à traiter en fonction de l'équilibre de charge des unités. Nous proposons ainsi une approche de décomposition sur trois points : la transformation de la spécification ou de l'application en une matrice d'incidence dont les éléments sont les flots de données entre les processus et les données, une nouvelle méthodologie basée sur le problème de la formation des cellules (Cell Formation Problem [CFP]), et un équilibre de charge de processus dans les processeurs et de données dans les mémoires. Dans la troisième partie, toujours dans le souci de concevoir un système efficace et performant, nous nous intéressons à l'affectation des processeurs et des mémoires par une méthodologie en deux étapes. Dans un premier temps, nous affectons des unités aux nœuds du système, considéré ici comme un graphe non orienté, et dans un deuxième temps, nous affectons des valeurs aux arcs de ce graphe. Pour l'affectation, nous proposons une modélisation des applications décomposées en utilisant une approche matricielle et l'utilisation du problème d'affectation quadratique (Quadratic Assignment Problem [QAP]). Pour l'affectation de valeurs aux arcs, nous proposons une approche de perturbation graduelle, afin de chercher la meilleure combinaison du coût de l'affectation, ceci en respectant certains paramètres comme la température, la dissipation de chaleur, la consommation d'énergie et la surface occupée par la puce. Le but ultime de ce travail est de proposer aux architectes de systèmes multiprocesseurs sur puce une méthodologie non traditionnelle et un outil systématique et efficace d'aide à la conception dès la phase de la spécification fonctionnelle du système. / On-Chip Multiprocessor (OCM) systems are considered to be the best structures to occupy the abundant space available on today integrated circuits (IC). In our thesis, we are interested on an architectural model, called Isometric on-Chip Multiprocessor Architecture (ICMA), that optimizes the OCM systems by focusing on an effective organization of cores (processors and memories) and on methodologies that optimize the use of these architectures. In the first part of this work, we study the topology of ICMA and propose an architecture that enables efficient and massive use of on-chip memories. ICMA organizes processors and memories in an isometric structure with the objective to get processed data close to the processors that use them rather than to optimize transfers between processors and memories, arranged in a conventional manner. ICMA is a mesh model in three dimensions. The organization of our architecture is inspired by the crystal structure of sodium chloride (NaCl), where each processor can access six different memories and where each memory can communicate with six processors at once. In the second part of our work, we focus on a methodology of decomposition. This methodology is used to find the optimal number of nodes for a given application or specification. The approach we use is to transform an application or a specification into an incidence matrix, where the entries of this matrix are the interactions between processors and memories as entries. In other words, knowing that the performance of a model depends on the intensity of the data flow exchanged between its units, namely their number, we aim to guarantee a good computing performance by finding the optimal number of processors and memories that are suitable for the application computation. We also consider the load balancing of the units of ICMA during the specification phase of the design. Our proposed decomposition is on three points: the transformation of the specification or application into an incidence matrix, a new methodology based on the Cell Formation Problem (CFP), and load balancing processes in the processors and data in memories. In the third part, we focus on the allocation of processor and memory by a two-step methodology. Initially, we allocate units to the nodes of the system structure, considered here as an undirected graph, and subsequently we assign values to the arcs of this graph. For the assignment, we propose modeling of the decomposed application using a matrix approach and the Quadratic Assignment Problem (QAP). For the assignment of the values to the arcs, we propose an approach of gradual changes of these values in order to seek the best combination of cost allocation, this under certain metric constraints such as temperature, heat dissipation, power consumption and surface occupied by the chip. The ultimate goal of this work is to propose a methodology for non-traditional, systematic and effective decision support design tools for multiprocessor system architects, from the phase of functional specification.

Des développements technologiques récents concernant les photodiodes à effet avalanche (PDA) ont mené à la conception et la fabrication d'un tout nouveau module de détection de radiation TEP (tomographie d'émission par positrons) destiné à l'imagerie moléculaire préclinique. Il est basé sur une matrice de 8 par 8 scintillateurs LYSO (ortho-silicate de lutétium dopé au cérium, cerium-doped lutetium yttrium orthosilicate ) individuellement couplés aux pixels de deux matrices monolithiques de 4 par 8 PDA. Cette avancée, pouvant amener la résolution spatiale d'un scanner à passer sous la barrière du mm, exige la conception d'un tout nouveau système d'acquisition de données. En effet, il faut adapter le système de lecture individuelle de chacun des pixels du bloc de détection de façon à satisfaire la multiplication par ~8, relativement à une version antérieure (le LabPET[indice supérieur TM] I), de la densité de pixels du futur scanner LabPET[indice supérieur TM] II. Conséquemment, le traitement de signal numérique ne peut être exclusivement embarqué dans les matrices de portes logiques programmable (field-programmable gate array , FPGA) du système d'acquisition, en considérant les aspects monétaires, d'espace occupé et de puissance consommée de l'ensemble du projet LabPET[indice supérieur TM] II. De façon à s'adapter à cette nouvelle réalité, un nouveau circuit intégré à application spécifique (application specific integrated circuit, ASIC) à signaux mixtes avec 64 canaux d'acquisition, fabriqué avec la technologie TSMC CMOS 0,18 [micromètre], a été conçu. L'ASIC utilise la méthode de temps au-dessus d'un seuil (time over threshold , ToT), déjà implantée dans des applications de physique des hautes-énergies, de manière à extraire numériquement l'information relative à un rayonnement interagissant avec la matrice de détection (l'énergie, le temps et le numéro de pixel de l'événement). Dans le cadre de ce projet, une architecture complexe de machines à états-finis, cadencée par une horloge de 100 MHz, a été implantée et elle permet à l'ASIC d'identifier le taux anticipé de 3 000 événements par seconde par canal. Ceci est réalisé en calculant en temps réel le paramètre ToT tout en assurant la calibration adéquate de chacune des chaînes d'acquisition. Le circuit intégré peut caractériser jusqu'à 2 Mévénements/s malgré son unique lien différentiel à bas voltage (low-voltage differential signaling, LVDS) de transfert de données et consomme environ 600 mW. L'ASIC a été développé en suivant un processus de conception de circuits intégrés à signaux mixtes. Il permet notamment de minimiser et de vérifier l'impact des indésirables effets parasites sur la circuiterie analogique et numérique de l'ensemble avant que les dessins de masques ne soient envoyés vers la fonderie pour fabriquer le circuit désiré.

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation. / Dreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.

The main goal of this thesis is to develop practical digital controller architectures for multi-phase dc-dc converters utilized in low power (up to few hundred watts) and cost-sensitive applications. The proposed controllers are suitable for on-chip integration while being capable of providing advanced features, such as dynamic efficiency optimization, inductor current estimation, converter component identification, as well as combined dynamic current sharing and fast transient response. The first part of this thesis addresses challenges related to the practical implementation of digital controllers for low-power multi-phase dc-dc converters. As a possible solution, a multi-use high-frequency digital PWM controller IC that can regulate up to four switching converters (either interleaved or standalone) is presented. Due to its configurability, low current consumption (90.25 μA/MHz per phase), fault-tolerant work, and ability to operate at high switching frequencies (programmable, up to 10 MHz), the IC is suitable to control various dc-dc converters. The applications range from dc-dc converters used in miniature battery-powered electronic devices consuming a fraction of watt to multi-phase dedicated supplies for communication systems, consuming hundreds of watts. A controller for multi-phase converters with unequal current sharing is introduced and an efficiency optimization method based on logarithmic current sharing is proposed in the second part. By forcing converters to operate at their peak efficiencies and dynamically adjusting the number of active converter phases based on the output load current, a significant improvement in efficiency over the full range of operation is obtained (up to 25%). The stability and inductor current transition problems related to this mode of operation are also resolved. At last, two reconfigurable digital controller architectures with multi-parameter estimation are introduced. Both controllers eliminate the need for external analog current/temperature sensing circuits by accurately estimating phase inductor currents and identifying critical phase parameters such as equivalent resistances, inductances and output capacitance. A sensorless non-linear, average current-mode controller is introduced to provide fast transient response (under 5 μs), small voltage deviation and dynamic current sharing with multi-phase converters. To equalize the thermal stress of phase components, a conduction loss-based current sharing scheme is proposed and implemented.

"2009" / Thesis (MSc (Hons))--Macquarie University, Faculty of Science, Dept. of Physics and Engineering, 2010. / Bibliography: p. 163-166. / Introduction -- Design theory and process technology -- 15GHz oscillator implementations -- 24GHz oscillator implementation -- Frequency prescaler implementation -- MMIC fabrication and measurement -- Conclusion. / Advances in Silicon Germanium (SiGe) Bipolar Complementary Metal Oxide Semiconductor (BiCMOS) technology has caused a recent revolution in low-cost Monolithic Microwave Integrated Circuit (MMIC) design. -- This thesis presents the design, fabrication and measurement of four MMICs for frequency synthesis, manufactured in a commercially available IBM 0.18μm SiGe BiCMOS technology with ft = 60GHz. The high speed and low-cost features of SiGe Heterojunction Bipolar Transistors (HBTs) were exploited to successfully develop two single-ended injection-lockable 15GHz Voltage Controlled Oscillators (VCOs) for application in an active Ka-Band antenna beam-forming network, and a 24GHz differential cross-coupled VCO and 1/6 synchronous static frequency prescaler for emerging Ultra Wideband (UWB) automotive Short Range Radar (SRR) applications. -- On-wafer measurement techniques were used to precisely characterise the performance of each circuit and compare against expected simulation results and state-of-the-art performance reported in the literature. -- The original contributions of this thesis include the application of negative resistance theory to single-ended and differential SiGe VCO design at 15-24GHz, consideration of manufacturing process variation on 24GHz VCO and prescaler performance, implementation of a fully static multi-stage synchronous divider topology at 24GHz and the use of differential on-wafer measurement techniques. -- Finally, this thesis has llustrated the excellent practicability of SiGe BiCMOS technology in the engineering of high performance, low-cost MMICs for frequency synthesis in millimeterwave (mm-wave) devices. / Mode of access: World Wide Web. / xxii, 166 p. : ill (some col.)

Les systèmes embarqués mobiles font partis intégrante de notre quotidien. Afin de les rendre plus adaptésaux usages, ils ont été miniaturisés et leur autonomie a été augmentée, parfois de façon très considérable.Toutefois, les propositions d’amélioration butent désormais sur les possibilités de la technologie des circuitsintégrés. Pour aller plus loin, il faut donc envisager de repenser la chaîne de traitement du signal afin deréduire la consommation de ces dispositifs. Cette thèse développe une approche originale pour exploiterefficacement l’échantillonnage par traversée de niveaux d’une part et, d’autre part, associe cet échantillonnageà une logique évènementielle afin de réduire drastiquement la consommation d’énergie des systèmesintégrés autonomes. Une méthode de discrétisation adaptée à une application de reconnaissance de signauxphysiologiques, utilisée comme exemple dans cette thèse, y est présentée. Un premier prototype en logiqueévènementielle (asynchrone) sur circuit FPGA a permis de valider cette stratégie et de démontrer les bénéficesde cet échantillonnage dédié en termes de réduction de l’activité par rapport à un échantillonnage uniforme.Un second prototype en logique asynchrone et conçu en technologie CMOS AMS 0.35 μm a permis de validerpar simulation électrique un gain extrêmement important sur la consommation électrique du dispositif. / Our everyday life is highly dependent on mobile embedded systems. In order to make them suitable to differentapplications, they have underwent size reduction and lifetime extension. However, these improvementsare currently limited by the possibilities of the integrated circuits technologies. In order to push back theboundaries, it is necessary to reconsider the whole digital signal processing chain from scratch to sustain thepower consumption reduction in this kind of system. This work develops on the first hand a strategy thatsmartly uses the level-crossing sampling scheme and on the other combines this sampling method with eventlogicto highly reduce the power consumption in mobile embedded systems. A discretisation method adaptedto the recognition of physiological patterns application is described. A first event-logic (asynchronous) prototypeimplemented on FPGA proved the potential benefits that an adapted sampling scheme could offersto reduce activity compared to a uniform sampling scheme. Electrical simulations performed on a secondprototype, also designed in asynchronous logic, with CMOS AMS 0.35 μm technology, validated a high gainin power consumption.