Dans un avenir proche, les dispositifs de détection médicaux miniaturisés en temps réels (lab-on-chip) seront au centre de la révolution des méthodes de diagnostics médicaux et d’identification des processus biologiques et cela, autant au niveau clinique qu’au niveau de la recherche. Pour y arriver, il est important de développer des chimies de surface stables et spécifiques, ce qui demande une compréhension des interactions intermoléculaires à l’interface liquide/solide. Pour bien comprendre ces interactions, il est important de développer des instruments adaptés à la mesure près de l’interface liquide/solide des différentes caractéristiques à identifier. Ce projet de recherche présente la conception, la fabrication et les expériences tests d’un capteur multimodal pour l’identification de processus biologiques à l’interface basés sur des technologies de résonance des plasmons de surface (SPR) et de microcalorimérie. Ces deux technologies mises ensemble vont permettre d’effectuer des mesures de la cinétique des interactions ainsi que des caractéristiques thermodynamiques. En premier lieu, les caractéristiques d’une interaction intermoléculaire à l’interface d’une réaction d’hybridation d’ADN furent définies afin d’en déduire un cahier des charges pour les transducteurs. Suite à cela, la conception des transducteurs microcalorimétrique et SPR furent réalisés en tenant compte des contraintes de chacun des transducteurs. Suite à la conception théorique des différentes parties du capteur, un procédé de fabrication compatible avec les méthodes de fabrication standard de la microélectronique fut défini et testé. Afin de s’assurer de la fonctionnalité des dispositifs ainsi fabriqués, des tests de fonctionnalisation de surface furent appliqués sur les échantillons afin de tester la compatibilité du procédé de fonctionnalisation avec les méthodes de fabrication et avec une chimie de surface type. Pour terminer, un système de mélange actif fut testé et caractérisé avec le dispositif de microcalorimétrie afin de s’assurer qu’il était possible de mélanger les fluides avec les produits biologiques pour s’assurer de la qualité de la réaction de surface. Le système développé pourra être utilisé pour effectuer la mesure d’hybridation d’ADN à l’interface. Le système intègre deux modalités permettant la caractérisation en temps réel des interactions intermoléculaires à l’interface liquide/solide. Ce type de système permet la mesure de la cinétique de différents modèles biologiques tels que les puces à sucre encore certains récepteurs cellulaires ou la mesure de conformation moléculaire à l’interface. Des mesures d’oxydation du glucose catalysée par la glucose oxydase sont montrées. / To begin with, the characteristics of a DNA hybridization intermolecular interaction at the interface were defined in order to deduce the specifications for our transducers. Following this, the SPR and microcalorimetric transducer will be design by taking into account the constraints of each one. Following the theoretical design of the sensor, a manufacturing process compatible with standard methods of microelectronics manufacturing was tested and identified. To ensure the functionality of the devices, a test of surface functionalization on the sensor was applied to test the compatibility of the manufacturing process with the surface functionalization methods. Finally, a system of active mixing was tested and characterized with a microcalorimetric device to ensure it was possible to mix fluids with organic products to be sure of the quality of the surface reaction. The system developed can be used to mesure DNA hybridization at the interface. This system incorporates two modalities for real-time characterization of intermolecular interactions near the solid/liquid interface. This type of system allows the kinetic measurement of different biological models such as cellular receptors or it is possible to have some molecular measure conformation near the interface. Oxidation of glucose with the enzyme glucose oxidase was shown to present the possibility to measure a biological interaction.

Laser Induced Forward Transfer (LIFT) techniques show promise as a disruptive technology which will enable the placement of components smaller than what conventional pick-and-place techniques are capable of today. Limitations of current die-attach techniques are presented and discussed and present the opportunity for a new placement method. This study introduces the Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) process and is an application of the unique blistering behavior of a dynamic releasing layer when irradiated by low energy focused UV laser pulses. The potential of tmSLADT as the next generation LIFT technique is demonstrated by the "touchless" transfer of 65 μm thick silicon tiles between two substrates spaced 195 μm apart. Additionally, the advantages of an enclosed blister-actuator mechanism over previously studied ablative and thermal releasing techniques are discussed. Finally, experimental results studying transfer precision indicate this non optimized die transfer process compares with, and may exceed, the placement precision of current assembly techniques. / Defense Microelectronics Activity (DMEA) under agreement number H94003-09-2-0905

This work is focused on thermomechanical and electric analyses of microelectronic structures in the ANSYS program. Firstly an analysed model was formed in the program Solidworks. Then structures with components SOT23, SMD 1206, FlipChip and chip with wire bonding interconnection were analyzed. The analyses were performed for the temperatures 50, 100, 150 °C and various materials. The simulations outputs are presented as pictures in colours with models deformations and calculated values. The results will be utilised in education and presented on the web. The Flash, ActionScript and XML technologies were used for application to present results of the research.

Les données industrielles offrent un matériau pour la prise de décision. Les travaux présentés concernent la transformation de données brutes en connaissances, pour contribuer au système de connaissances d’une organisation et améliorer son système décisionnel. Un processus d’aide à la décision est proposé. Il implique les acteurs de l’organisation et l’emploi de méthodes formelles. D’abord, il analyse et formalise les problématiques décisionnelles. Ensuite, il construit une aide la décision quantitative. Cette méthodologie est appliquée à un problème particulier : la gestion des capacités des TI d’une usine de STMicroelectronics. En effet, les managers doivent assurer un équilibre entre le coût de l’infrastructure TI et le niveau de service offert. Notre processus offre une aide pertinente. Il permet de surmonter deux enjeux, fréquents lors de la gestion des capacités : la complexité des systèmes IT et la prise en compte de l’activité métier. Situant ces travaux dans le cadre du référentiel ITIL, l’application du processus permet de constituer des modèles prédictifs, mettant en relation l’activité des serveurs informatiques et l’activité industrielle. Cette application permet aussi de contrôler dynamiquement la validité des modèles, ainsi que l’activité quotidienne du SI. Nos travaux formalisent quantitativement des connaissances, en favorisent l’utilisation dans les processus décisionnels, et en assurent l’évolution dans le temps. Nos recherches posent des fondations pour un plus large recours plus à l’exploitation des données issues des systèmes de production, dans le cadre du développement de systèmes de support à la décision et de perspectives Big Data. / A proper analysis of industrial data can provide material for decision making. The research work presented deals with the question: how can one convert raw data into useable information, to contribute to the knowledge management of an organization and improve its dynamic decision making? A decision-aid process is proposed. It implies actors of the organization and use of formal methods. Firstly, it analyses and formalizes decisional problems. Then, it develops an appropriate decision-aid on the basis of statistics. Our methodology is applied to a specific issue: capacity management of IT of a STMicroelectronics plant. This application raises a decision issue: managers have to ensure the right balance between infrastructure cost and service level offered. We demonstrate that the process may provide relevant support. This negates two managerial dilemmas, usually encountered when managing capacity: complexity of IT systems and incorporation of the business activity. Our application has been developed in the scope of the ITIL framework. It will be shown how the process builds predictive models, which link the activity of hardware servers to the industrial activity. Methods are also proposed, to monitor daily the quality of these models, as well as the overall activity of the IS. This work helps at formalizing quantitatively organizational knowledge, facilitating its use in decisional processes, but also ensuring its positive change over time. We hope this research is laying some foundations for a broader exploitation of the data stored in modern manufacturing systems, through future development of decision-support systems and Big Data initiatives.

La miniaturisation des circuits intégrés numériques tend à augmenter leur sensibilité aux radiations. Ainsi le rayonnement naturel peut induire des événements singuliers et porter atteinte à la fiabilité des circuits.Cette thèse porte sur la modélisation des mécanismes à l'origine de ces événements singuliers et sur le développement de solutions de durcissement par conception permettant de limiter l'impact des radiations sur le taux d'erreur.Dans une première partie, nous avons notamment développé une approche dénommée RWDD (Random-Walk Drift- Diffusion) modélisant le transport et la collection de charges au sein d'un circuit, sur la base d'équations physiques sans paramètre d'ajustement. Ce modèle particulaire et sa résolution numérique transitoire permettent de coupler le transport des charges avec un simulateur circuit, tenant ainsi compte de l'évolution temporelle des champs électriques dans la structure. Le modèle RWDD a été intégré avec succès dans une plateforme de simulation capable d'estimer la réponse d'un circuit suite à l'impact d'une particule ionisante.Dans une seconde partie, des solutions de durcissement permettant de limiter l'impact des radiations sur la fiabilité des circuits ont été développées. A l'échelle des cellules élémentaires, de nouvelles bascules robustes aux radiations ont été proposées, en limitant leur impact les performances. Au niveau système, une méthodologie de duplication de l'arbre d'horloge a été développée. Enfin, un flot de triplication a été conçu pour les systèmes dont la fiabilité est critique. L'ensemble de ces solutions a été implémenté en technologie 65 nm et UTBB-FDSOI 28 nm et leur efficacité vérifiée expérimentalement. / The extreme technology scaling of digital circuits leads to increase their sensitivity to ionizing radiation, whether in spatial or terrestrial environments. Natural radiation can now induce single event effects in deca-nanometer circuits and impact their reliability.This thesis focuses on the modeling of single event mechanisms and the development of hardening by design solutions that mitigate radiation threat on the circuit error rate.In a first part of this work, we have developed a physical model for both the transport and collection of radiation-induced charges in a biased circuit, derived from pure physics-based equations without any fitting parameter. This model is called Random-Walk Drift-Diffusion (RWDD). This particle-level model and its numerical transient solving allows the coupling of the charge collection process with a circuit simulator, taking into account the time variations of the electrical fields in the structure. The RWDD model is able to simulate the behavior of a circuit following a radiation impact, independently of the implemented function and the considered technology.In a second part of our work, hardening solutions that limit radiation impacts on circuit reliability have been developed. At elementary cell level, new radiation-hardened latch architectures have been proposed, with a limited impact on performances. At system level, a clock tree duplication methodology has been proposed, leaning on specific latches. Finally, a triplication flow has been design for critical applications. All these solutions have been implemented in 65 nm and UTBB-FDSOI 28nm technologies and radiation test have been performed to measure their hardening efficiency.

En microélectronique, plusieurs tendances telles que l'empilement 3D et l'amincissement de puces amènent des défis thermiques grandissants. Ces défis sont exacerbés lorsqu'appliqués aux appareils mobiles où l'espace et la puissance disponibles pour le refroidissement sont limités. Le but de cette thèse est de développer des outils de conception et méthodes d'implémentation de microcanaux pour le refroidissement microfluidique de puces 2D et 3D avec points chauds destinés aux appareils mobiles.Une méthode de conception pour optimiser la configuration des microcanaux refroidissant une puce est développée utilisant un plan d'expériences numériques. La configuration optimisée propose le refroidissement à une température maximale de 89 °C d'un point chaud de 2 W par un écoulement où la perte de charge est plus petit que 1 kPa. Des prototypes avec différents empilements et distributions de microcanaux sont fabriqués par gravure profonde et apposés par pick-and-place. Un banc de caractérisation et une puce thermique test sont fabriqués pour caractériser expérimentalement les prototypes de refroidissement avec différentes configurations. Un prototype avec microcanaux limités aux alentours des points chauds et reportés sur la face arrière de la puce test atteint une résistance thermique de 2.8 °C/W. Cela est réalisé avec un débit de 9.4 ml/min et des pertes de charges de 19.2 kPa, soit une puissance hydraulique de 3 mW. Ce refroidissement extrait 7.3 W générés sur un seul serpentin à un flux thermique de 1 185 W/cm² pour un coefficient de performance de 2 430. Les résultats de l'optimisation suggèrent que la dissipation thermique soit exploitée en ajoutant des microcanaux en parallèle, plutôt qu'en allongeant les microcanaux. On observe expérimentalement comme numériquement que la résistance liée à la hausse de température du fluide domine la résistance totale. Enfin, il apparaît que les différents empilements ont un effet plus important sur la résistance thermique que les distributions de microcanaux dans les plages observées. / In microelectronics, trends such as 3D stacking and die thinning bring major thermal challenges. Those challenges are exacerbated when applied to mobile devices where the available space and power for cooling are limited. This thesis aims at developing design tools and implementation techniques for microchannels cooling on 2D and 3D chips with hot spots for mobile devices. A design technique to optimize the microchannel configuration for chip cooling is developed using numerical experimentation plans. The optimized configuration suggests a cooling configuration reaching a maximum temperature of 89 °C on a 2 W hot spot, using a flow at a pressure drop plus petit que 1 kPa. Prototypes with different stacking and microchannel distributions are fabricated using deep reactive ion etching process and stacked using pick-and-place technique. A characterization bench and a thermal test chip are fabricated for experimental characterization of the cooling prototypes from various configurations. A prototype with microchannel zones limited to the hot spot vicinity and installed on the backside of the test chip reached a thermal resistance of 2.8 °C/W. This performance is achieved using a flow rate of 9.4 ml/min with a pressure drop of 19.2 kPa, representing a hydraulic power of 3 mW. Such cooling removes 7.3 W generated on a single heat source, representing a heat flux of 1 185 W/cm² for a coefficient of performance of 2 430. The optimization results suggest that the heat spreading is better exploited using parallel microchannels, rather than lengthen microchannels. It is both observed experimentally and numerically that the thermal resistance related to the fluid temperature rise is the major contribution to the total thermal resistance. Finally, it appears that the different stacking effects on thermal resistance are more important than the microchannels distributions in the observed ranges.

In the past decade, there has been an increased interest in low-cost, low-power, high data rate wireless systems for both commercial and defense applications. Some of these include air defense systems, remote sensing radars, and communication systems that are used for unmanned aerial vehicles, ground vehicles, and even the individual consumer. All of these applications require state-of-the-art technologies to push the limits on several design factors such as functionality, weight, size, conformity, and performance while remaining cost effective. There are several potential solutions to accomplish these objectives and a highly pursued path is through the utilization of advanced integrated system platforms with high frequency, versatile, multilayered materials. This work intends to explore advanced 3-D integration for state-of the art components in wireless systems using LCP multilayer organic platforms. Several packaging techniques are discussed that utilize the inherent benefits of this material. Wire bond, via interconnect, and flip-chip packages are implemented at RF and millimeter-wave (mm-wave) frequencies to explore the benefits of each in terms of convenience, reliability, cost, and performance. These techniques are then utilized for the demonstration of bulk acoustic waveguide (BAW) filter applications and for the realization of highly integrated phased-array antenna systems.

This dissertation focuses on high-performance LC-tank CMOS VCO design at 2 GHz. The high-Q inductors are realized using wiring metal lines in advanced packages. Those inductors are used in the resonator of the VCO to achieve low phase noise, low power consumption, and a wide frequency tuning range. In this dissertation, a fine-pitch ball-grid array (FBGA) package, a multichip module (MCM)-L package, and a wafer-level package (WLP) are incorporated to realize the high-Q inductor. The Q-factors of inductors embedded in packages are compared to those of inductors monolithically integrated on Si and GaAs substrates. All the inductors are modeled with a physical, simple, equivalent two-port model for the VCO design as well as for phase noise analysis. The losses in an LC-tank are analyzed from the phase noise perspective. For the implementation of VCOs, the effects of the interconnection between the embedded inductor and the VCO circuit are investigated. The VCO using the on-chip inductors is designed as a reference. The performance of VCOs using the embedded inductor in a FBGA and a WLP is compared with that of a VCO using the on-chip inductor. The VCO design is optimized from the high-Q perspective to enhance performance. Through this optimization, less phase noise, lower power consumption, and a wider frequency tuning range are obtained simultaneously.

Wireless communications have been an indispensable aspect of everyday life, and there is an increasing consumer demand for accessing several wireless communication technologies from a single, compact, mobile device. System-on-package (SOP) technology is an advanced packaging technology that has been proven to realize the convergence of multiple functions into miniaturized, high-performance systems to meet this demand. With the advancements in the SOP technology, the miniaturization of the front-end module has been achieved using embedded passives in multilayer packages. However, the integration of the antenna directly on the module package is still the barrier to achieve a fully-integrated, high-performance RF SOP system. The main reason for this missing link is that integrating the antenna on the package requires miniaturizing the antenna, which is a difficult task. The focus of this dissertation is to design high-performance antennas along with developing techniques for miniaturization and system-on-package (SOP) integration of these antennas to achieve fully-integrated SOP systems using advanced multilayer organic substrates and thin-film magneto-dielectric materials. The targeted spectrum for the antenna designs are 2.4/5 GHz WLAN/WiMAX and 60 GHz WPAN bands. Several novel antenna designs and configurations to integrate the antenna on the package along with the module are discussed in this dissertation. The advanced polymers used in this research are Liquid Crystalline Polymer (LCP), RXP, and thin-film magneto-dielectrics.

In our age in which the use of electronic devices is expanding all over the world, their reliability and miniaturization have become very crucial. The thesis is based on the study of one of the most frequent failure mechanisms in semiconductor packages, the delamination of interface or the separation of two bonded materials, in order to improve their adhesion and a fortiori the reliability of microelectronic devices. It focuses on the metal (-oxide) / polymer interfaces because they cover 95% of all existing interfaces. Since several years, research activities at mesoscopic scale (1-10µm) have proved that the more roughened the surface of the interface, i.e., presenting sharp asperities, the better the adhesion between these two materials. Because roughness exhibits extremely complex shapes, it is difficult to find a description that can be used for reliability analysis of interfaces. In order to investigate quantitatively the effect of roughness variation on adhesion properties, studies have been carried out involving analytical fracture mechanics; then numerical studies were conducted with Finite Element Analysis. Both were done in a deterministic way by assuming an ideal profile which is repeated periodically. With the development of statistical and stochastic roughness representation on the one hand, and with the emergence of probabilistic fracture mechanics on the other, the present work adds a stochastic framework to the previous studies. In fact, one of the Stochastic Finite Element Methods, the Perturbation method is chosen for implementation, because it can investigate the effect of the geometric variations on the mechanical response such as displacement field. In addition, it can carry out at once what traditional Finite Element Analysis does with numerous simulations which require changing geometric parameters each time. This method is developed analytically, then numerically by implementing a module in a Finite Element package MSc. Marc/Mentat. In order to get acquainted and to validate the implementation, the Perturbation method is applied analytically and numerically to the 3 point bending test on a beam problem, because the input of the Perturbation method in terms of roughness parameters is still being studied. The capabilities and limitations of the implementation are outlined. Finally, recommendations for using the implementation and for furture work on roughness representation are discussed.