伴隨知識經濟時代的來臨，企業在全球化競爭下與產業高速變動的環境中，對於資訊與知識的質與量與日俱增，而為了因應全球經濟競爭與產業變遷，企業興起一股以知識管理為基礎的競爭優勢，作為發展與提升效能的利器。 知識管理對於傳統製造業生產流程效能的影響力已可由相關研究驗證，然而智慧型工程產業，如資本與技術密集的半導體資訊產業，是否在採取知識管理後能夠普遍提升生產流程的效能，尚待驗證，本研究係嘗試建立知識管理與半導體資訊企業生產流程效能之間的關聯性。 研究發現，半導體企業在削減變更成本、降低產品報廢率及重工率、產能擴充時間縮短、產品精密度與複雜度、以及彈性生產組態等生產流程效能上，都與知識管理中的知識管理策略、知識管理工具、知識管理網絡架構、以及知識管理流程有顯著的連結。知識管理策略與知識管理工具確實對半導體企業在削減變更成本、降低產品報廢率及重工率、產品精密度與複雜度、以及產能擴充時間縮短上，有顯著的效能表現 / The epoch knowledge economies bring high competitiveness in business market, and as well as stimulate the importance of information qualities and knowledge capacity. To face global economic developments and the transformation of industry, knowledge management thus has become the basic measure to improve the effectiveness of the developments of company. Evidently that knowledge management has been proved for the advantage of traditional industry in the effectiveness of production process, semiconductor industry however needs more verifications. The study hence is to scrutinize the connectedness between knowledge management and the effectiveness of production process in semiconductor industry. The study revealed that the overall effectiveness of production process indeed was correlated with the adoption of knowledge management system, and in detail, the strategies of knowledge management and the tools of knowledge management would enhance the effectiveness of production process in semiconductor industry.

台灣半導體產業發展成熟，產業群聚效應明顯，供應鏈完整。基於晶圓製造過程中成本花費考量，若能尋找設備、零組件、材料原廠以外的第二來源，對於台灣半導體廠商而言，除了有機會降低成本，也能不受到原廠的牽制。另外，台廠期望能透過自主開發生產設備來取代設備的高額進口成本，然而目前本土設備廠商自主開發前段製程設備能力有限，向外尋求關鍵技術之合作為良好的解決方案。筆者思考這兩個方面是否能透過與俄羅斯合作，成功突破目前的情況。 本論文針對俄羅斯半導體產業過去發展、現況與未來發展進行研究，同時了解台灣與全球半導體產業現況及發展前景。運用文獻檢閱法搜集全球、台灣、俄羅斯半導體產業現有資料。筆者也使用訪問法，自行設計訪談問題，以台灣及俄羅斯半導體產業專家為對象進行訪談，並將搜集到的第一手資料資料進行整理，以Rugman 與 Verbeke的「雙鑽石模型」，分別為「生產因素條件」、「需求條件」、「相關及支援性產業」、「企業策略、結構與競爭」，以及第五個因素「政府」作為理論架構，分析台灣與俄羅斯半導體產業發展現況，並提出雙方可能合作機會與策略之建議。 研究發現俄羅斯科學基礎研究實力豐厚，晶片應用著重在軍事、航太等方面，晶片生產朝向少量多樣方向發展。從俄羅斯政府許多政策上可以其支持國內微電子產業的發展，並期望微電子產業的振興能帶動國內其他產業的升級。台灣晶圓製造能力強，供應鏈完整，應用領域主要專注於資通訊方面，雙方競爭可能性低。台灣在基礎研究與設備開發所需技術方面，實力較為不足，與俄羅斯進行技術合作可謂實現設備國產化的策略之一。經由理論架構分析，台灣與俄羅斯進行技術合作，有望能縮短設備開發所需的時日。台灣供應鏈及先進製造能力，能為俄羅斯特殊晶片提供生產製造、封裝檢測等服務。台俄雙方在半導體領域的合作機會大，可互相補足缺口，促成產業升級。 / The semiconductor industry in Taiwan is well developed. Because of the high cost of wafer manufacturing process, having a second source of equipment, components, and materials would be beneficial for Taiwanese semiconductor companies. The cost of production and dependency on original equipment suppliers will decrease. In addition, Taiwanese companies seek the opportunity to be self-reliant on developing production equipment in order to reduce the high cost of importing equipment. However, the capacity of Taiwanese equipment manufacturers is limited. Cooperate with foreign companies on key technology is the preferable solution. This thesis focuses on the cooperation with Russia companies and check whether Taiwanese companies can have a breakthrough at current situation. This study includes the past, present, and the future development of Taiwanese and Russian semiconductor industry. Literature review and interview method are two main research methods. Collecting current reference of global, Taiwanese, and Russian semiconductor industry and primary sources from the interview with semiconductor industry experts, the author conducts an analysis on the development of the semiconductor industry in Taiwan and Russia with the “Double Diamond” model of Rugman and Verbeke. The analysis factors include “Factors conditions”, “Demand conditions”, “Related and supporting industries”, and “Government.” Further, this research proposes advice for cooperation and strategies. Through theoretical analysis, technical cooperation between Taiwan and Russia is expected to shorten the develop time of equipment. Industrial supply chain and advanced manufacturing capacity in Taiwan can provide manufacturing, packaging and testing service for Russia. Cooperation between Taiwan and Russia in the field of semiconductor can complement each other and will promote industrial upgrading.

自八O年代以後，台灣半導體通路產業即邁入了激烈的競爭時代。眾多高同質性的業者，相互競奪上游產品線的代理權，以及下游買者市場的交易權；業者的生存契機，主要來自於提供上、下游業者間進行商業交換的平台。因此，此一平台所能提昇的交換效率，及其處理跨組織間交換成本的能力，乃成為不容忽視的課題。半導體通路業為台灣資訊工業中，歷史悠久且具重要地位的產業；研究瞭解半導體通路產業之價值鏈活動，將有助於台灣半導體通路產業之促進升級。 半導體通路商所從事之價值鏈活動功能，予以分類概有商流、物流、金流、資訊流及技術流等五大項；其中，諸多研究證實——技術支援能力，乃屬半導體通路商之核心競爭力之一。過去有關半導體通路商的研究，大多是由競爭策略、企業資源規劃及整體通路之價值鏈活動等觀點著手，但專注於技術流部分，予以進行4C交換成本態勢分析之探討者，則尚未得見；因此，本研究乃有其創始性。 本研究以台灣地區的半導體通路商為研究對象，期望所做研究結果可供台灣半導體通路業者，做為規劃技術行銷策略之實務參考。本研究屬於質性之探索性研究，經由個案訪談及問卷之初級資料與次級資料的蒐集彙整，並以4C交換成本理論的四個主要變數：外顯單位效益成本、資訊搜尋成本、道德危機成本、專屬陷入成本，進行個案企業之比較分析，並歸納出下列之研究發現與結論： 1. 上游供應商與通路商之技術合作，其對通路商處理交換成本能力的需求排序為：道德危機成本、資訊搜尋成本、專屬陷入成本、外顯單位效益成本。 2. 技術性協力廠商與通路商之技術合作，其對通路商處理交換成本能力的需求排序：道德危機成本、外顯單位效益成本、資訊搜尋成本、專屬陷入成本。 3. 下游系統製造廠商與通路商之技術合作，其對通路商處理交換成本能力的需求為：外顯單位效益成本之功效，高於內隱交換成本之效能。 4. 規模經濟型之半導體通路商，其對下游系統製造商所提供之技術支援服務功能，外顯單位效益成本的優勢，高於內隱交換成本。 5. 利基型之半導體通路商，其對下游系統製造商所提供之技術支援服務功能，內隱交換成本優勢，高於外顯單位效益成本。 6. 經營低技術層次產品之半導體通路商，其對下游系統製造商所提供之技術支援服務功能，外顯單位效益成本的優勢，高於內隱交換成本。 / After the eighth decade, the channel industry of Taiwan semiconductor moved toward serious competition. Many of high similarity company compete with each other in the agency of product line source and the buyer market of OEM customer; the survival opportunity of company is to provide the platform for the exchange between the supplier and customer. Hence, the most critical point is to increase the efficiency and to reduce the exchange cost between the cross-organization in the platform. Semiconductor channel industry is long historical with important position in Taiwan information industry; to investigate and study the semiconductor channel industry will contribute to the research for the upgrade of semiconductor channel industry in Taiwan. The value chain activity of semiconductor channel can be break through into business flow, logistics, financial flow, information flow and technology flow; Among them, technical support ability has been approved to be one of the key competitiveness of the semiconductor channel by many researches. Most of the past researches stood on the views, such as competitive strategy, Enterprise Resource Planning and whole value chain activity, etc., but the point on the 4C exchanges cost co-opetition analysis in the technology flow has not been seen yet. Hence, it’s important for this research. This research is expected to provide the result for the practice reference of the technical marketing strategy to the Taiwan semiconductor channel by focusing on them. This research is belong to the qualitative exploratory research from the data collection of the primary and the secondary information in the interview cases and questionnaires, then to analyze the cases comparatively by the four primary parameters of the 4C exchange cost the cost: the external cost on utility, information searches, morals hazard and hold up asset specificity. Finally, the following important results have been pointed out: 1. The sort of the technical cooperation between the channel and the supplier to the requirement for the channel ability in dealing with exchange cost is: morals hazard, information searches, asset specificity and the external cost on utility. 2. The sort of the technical cooperation between the channel and the independent design house (IDH) to the requirement for the channel ability in dealing with exchange cost is: moral hazard, the external cost on utility, information searches and asset specificity. 3. The technical cooperation between the channel and the system manufacture customer to the requirement for the channel ability in dealing with exchange cost is: the effectiveness of the external cost on utility is higher than that of the inner exchange cost. 4. The technology support service function to the system manufacture customer from the semiconductor channel of the scale economic type is: the advantage of the external cost on utility is higher than that of the inner exchange cost. 5. The technology support service function to the system manufacture customer from the niche type semiconductor channel is: the advantage of the inner exchange cost is higher than that of the external cost on utility. 6. The technology support service function to the system manufacture customer from the semiconductor channel with operating in the low technical level product is: the advantage of the external cost on utility is higher than that of the inner exchange cost.

本研究主要採用文獻探討以及個案訪談作為主要的研究方法，先藉由文獻探討建立起論文整體之架構以及相關理論之說明定義所需探討之研究變項，之後再透過台灣半導體標竿企業的製程研發專案訪談加以實證。本研究以研究「專案類型」、「技術知識特質」、與「組織架構特質」對「製程開發的創新活動」的關聯關係來探討台灣半導體製程的研發活動過程並說明所觀察現象的具體意義。另外，並透過研究不同性質的專案來觀察與客戶間的互動關係並說明所觀察到現象以及背後的思考邏輯，進而可得到以下初步之研究結論： 一、製程研發專案的技術與知識特質 1. 不同類型專案中，製程合併型程度越高的專案，其技術知識的內隱性較低、多元性較低、標準化程度較高、路徑相依程度較高。而製程技術標準化與相依度會影響專案成員在研發過程所採取的實驗條件設定的方式，進而在實驗開發階段會影響內隱度。 2. 全新元件的開發可分為兩個層次；第一、元件架構的確立。第二、製造流程的確立。 二、製程研發的團隊組成與研發活動 1. 專案組織架構隨專案類型差異而有明顯差異。製程合併型的專案一般為廠級的開發專案，傾向以「輕型團隊」之方式運作﹔而高度創新的製程研發專案傾向以「重型團隊」之方式運作。 2. 技術知識內隱程度愈高，多元程度程度愈高者愈傾向以試製實驗來共同解決問題。 3. 專案的知識內隱程度愈高越需外部知識的來源；製程研發專案的技術知識的內隱性、多元程度愈高，使用者參與程度愈傾向「共同開發」。 三、組織結構與知識的分享平台 1. 為蓄積、分享重要的技術資訊，成立正式組織統籌規劃高壓製程的研發，並於每季邀集各廠提供相關製程經驗分享。研發經驗會藉由團隊的研發過程與分享制度的建立，進行不同型式的知識轉移。 2. 研發專案團隊內的知識分享機制隨著機密程度不同而有所限制。 四、其他發現 1. 不同產品類別、背景客戶的電路設計習慣不一，可藉適當電路設計於開發時期找出元件的弱點。IDM廠對資料要求度較高，設計師習慣所有的文件資料都具備後才開始設計。 2. 使用者的參與製程開發，可讓新製程依使用者的習慣調整。對製程了解越深入的設計公司，其電路設計越游走合法邊緣。 / This thesis adopts reference and case study as the main research approach. It sets up the thesis whole structure by reference and relevant theories to define the factors. Afterward, to demonstrate the thesis structure by interview three projects about IC manufacture process developing of the company, which is the benchmark semiconductor company in Taiwan. This thesis attempts to take an exploratory study of the relationship between characteristics of project type, characteristics of technological knowledge, characteristics of organization structure, and innovation actitity in process developing on that company in Taiwan. In addition, through the case study, to observe the relationship with customer to explain the phenomenon and thinking in different case.There are primary figures found in the thesis： 1. The characteristics of technological knowledge in process developing projector. a. In different kinds of process developing projects, the combinative multi-process project with low degree in tacit knowledge and pluralism, but with higher degree in standardized and route- interdependence. The degree in process standardized and route- interdependence would influence the experiment condition, which would effects the degree of tacit knowledge in experiment period. b. The development of new device can be divided into two levels: First, the establishment of the device structure. Second, the establishment of the process flow. 2. The developing team make-up and developing activity a. The organization structure has obvious differences in different project type. The combinative multi-process project inclined to with the way operation of ' the light-duty group '; the research and develop with high innovation inclined to with the way operation of ' the heavy-duty group '. b. The projector with high degrree in tacit knowledge and pluralism inclined to solving the problem by the trial-producing experiment. c. Degree of technology diversity determines degree of user engagement in development. Projects with high degree of technology diversity tend to engage user in the joint development mode. Projects with low degree of technology diversity tend to engage user in the “Offering Mode”. 3. Organization structure and the sharing platform of knowledge a. It should build an official organization structure to overall planning developing projectors for knowledge accumulataion and sharing. b. The develipong experiment would be transferred in different type by sharing system building and organization set-up. c. The knowledge sharing of research and develop has limitation in different secret degree. 4. Others a. Different product classification, background of customers has different design style. Could make use of proper circuit design to find out the weakness of device. b. IDM factory require high quality documatation support. Designer used to design afeter all documentation ready, c. The new process could be adjusted according to user’s design style if he participates in the developing project. d. More understanding in process, the circuit design might violade the design rule.

晶圓製程設備商必須充分利用全球化智慧資源規劃，發展企業策略，才能創造企業競爭力和成長動能。經過多次的景氣循環，晶圓設備產業已經成為少數廠商全球激烈競爭的環境，特別是仍有兩家設備供應商以上的產品線。對於客戶而言，購買設備的主要因素來自於廠商製程能力和成本的優勢。除了少數關鍵製程由一家壟斷外，客戶都可以在每一個新製程世代(Technology node)找到兩家廠商評估設備和技術需求。在贏者全拿的壓力與吸引力下，在每一個新製程世代的銷售週期中，晶圓設備商都必須要充分利用智慧資本化的效益，掌握客戶的技術、量產時程，才能確保銷售空間。在發展策略上，為面對高技術競爭但是低成長的產業環境，晶圓設備商必須要透過併購和整合其核心技術相關新事業才能同時整合既有智慧資源和創造成長。 不管從市場規模和產業鏈來看，台灣的半導體產業已經成為全球最重要的製造據點，也是台灣最重要的產業之一。半導體製造廠龐大的資本支出和相關需求更讓台灣成為各半導體設備商的銷售服務的兵家必爭之地。根據SEMI的最新市場調查，總計台灣2007年的半導體設備市場達到106.5億美元，較2006年大幅成長45.2%，正式超越日本成為全球最大半導體設備投資市場。在產業鏈中，晶圓製程設備除了是晶圓廠最大資本支出外，還是產業技術發展的供應者。很可惜的是，雖然擁有龐大的商機做後盾，台灣卻沒有及時發展這個領域。在轉換成本、專利、和領導晶圓製造商合作開發和人才、資金等高產業門檻下，除了自動化設備較有進展外，台灣在晶圓製程設備產業的自給率普遍低於5%，技術、智財和人才還是掌握在外國的晶圓製程設備廠商。在沒有整合產、官、學、研等資源和適合的智財管理規劃下，在需要高度基礎科學和長遠技術發展的晶圓製程設備產業，我們設備自制化的結果不高，並不令人訝異。晶圓製造業者的議價和技術自主能力因此而受到拘束，所發展的智財也沒有太大價值和效用。 本研究目的希望以智慧資源規劃為研究方法，進行晶圓製程設備產業的實證研究。先就市場特性分析晶圓製程設備產業概況，接著探討廠商如何運用智慧資源規劃的資本化和產業結構化切入市場，最後在實證研究上以分析主要晶圓製程設備廠商的專利能量和最新奈米技術High-k/Metal Metal Gate探討產業的技術發展趨勢與廠商智慧資源規劃的運用和佈署。期望從綜合上述論點，做為台灣是否適合發展晶圓製程設備和又該如何準備智慧資源規劃的參考。 / Global intellectual resource planning (IRP) is cruicial in industrial strategy for wafer fabrication equipment vendors to develop competence and growth momentums. After several business cycles during the past few decades, this industry has become a very competitive market of a few players. For their customers, the key decision factors are the technology capability and cost of the vendors. Except for some critical process equipments dominated by only one vendor, the customers can identify 2 vendors to evaluate their equipment and cost performance. That Winner takes all become the pressure and attraction of the industry. The vendors must fully apply the value of intellectual property and overhaul their customer’s technology and production roadmap to ensure their share in the market. To cope with the market challenges of low growth and highly competitiveness, the vendors must incoporate and integrate other new companies of their core technology to consolidate given intellectual resource and create better achievements. Either from the perspective of market size and industry value chain, Taiwan has played the most important role in semiconductor manufacturing industry worldwide. To extend their market share and keep in the lead, the foundry and DRAM companies have aggressively invested in the production of 300mm fabs. The vast investments and its production demands have made Taiwan the most competitive place in semiconductor equipment markets. According to the SEMI most update, the business volume of Taiwan semiconductor equipments market reached to US$10.65 billion in 2007, with an impressive growth of 45.2% more than 2006. Taiwan has overtaken Japan and become the largest semiconductor equipment markets in the world. In the industry value chain, the wafer fabrication equipments not only accounted for the greatest capital expenditure of fibs but also the foundation for the process technology development. It is a pity that the equipments industry in Taiwan did not flourish as along with the great market here. All the key technologies, people, materials and components are manipulated by foreign vendors. This situation resulted in an un-balanced development in domestic semiconductor industry as well as the bargain power and self-owned technology. The related developed intellectual rights can not show the real value and effect. With the high entry barriers of transfer cost, patents, professionals and investments of wafer fabrication equipments markets, Taiwan vendors take less than 5% in the market share, except for some progress in automation equipments of lower IP, capital and transfer cost barriers. The Taiwan vendors have not demonstrated capability in process technology to penetrate the markets. The wafer fabrication equipment market growth was a result of o the outsource investment from Europe, US and Japan fabs. It turns out that the technology, IP and people are still possessed by foreign vendors. Without the synergy and integration of government, academia and industry and intangible resource planning, it is not surprising that our production localization ratio is relatively low. Thus, the thesis will elaborate the case study in the way of intellectual resource planning. First, the research will analyze the industrial characteristics of wafer fabrication equipment market. In the followings, this research will discuss how vendors can apply IRP to penetrate the market. Finally, this research will analyze the patents of major vendors and High-k/Metal Gate process technology to elaborate the industry technology cycles and new technology development strategy. As a result, the thesis will try to discuss if it is suitable for Taiwan to develop the wafer fabrication equipment market and also serve for reference how to prepare the intellectual resource planning.

在這個由消費者主導的時代，行銷的力量在於創造、溝通、傳遞價值予顧客，著重全面的消費者接觸點，策略性地創造有力的品牌概念，為公司增加獲利、為股東累積收益。 本研究以外商半導體公司的成功案例，探討工業零組件之B2B（Business to Business）經營模式中之整合行銷傳播(Integrated Marketing Communication)策略與做法，從IMC的整合程度中之計劃整合面，探討整合行銷傳播中的組織架構，分析內部決策組織和外部功能組織的協調性，以及從人員知識面切入，探討專業人才與能力的培養；再從資源整合面，深入了解個案在整合行銷傳播預算、媒體購買、資料庫運用等面向的資源運用方式，以及在各項傳播工具的操作策略上的實際執行方式與成果，並藉由策略架構、資源、流程、關係、與價值五大面向，分析個案的關鍵成功因素與經驗，再經由個案於去年底所完成之與競爭對手相較之品牌排名調查以及委由國際知名品牌鑑價機構Interbrand計算之企業品牌價值結果，展現個案執行整合行銷傳播策略的實際績效。以個案研究法檢視該公司如何在自皇家飛利浦集團獨立後之一年內迅速累積品牌價值，而其整合行銷傳播策略在其中所達成的貢獻的關鍵成功因素。 本論文之研究方法、針對研究架構中之「計畫整合」及「資源整合」部分採取次級資料分析法，此部分是由supplier side的觀點作為研究出發點; 針對「傳播工具整合」的部分，採取焦點訪談法，是由demand side為出發點，研究客戶未被滿足的需求; 在「關鍵成功因素」的部分，採取深度訪談法，藉由訪談專業人士，針對個案分析其成功的關鍵因素。本論文所選擇的研究個案，是名列全球前十大半導體公司之一的N半導體（N Semiconductors）。 本研究之研究目的在於研究外商半導體公司整合行銷傳播(IMC)的關鍵成功因素與經驗，探討B2B工業零組件經營模式之整合行銷傳播(IMC)策略與做法，期以外商半導體於整合行銷傳播(IMC)方面的成功經驗，做出對台灣IC產業未來發展品牌之建議。 / In this market dominated by consumers, the power of marketing is to create, communicate and transfer value to customers. Focusing on coming into a full-scale contact with consumers, marketing strategically creates an influential concept of brand to increase the profit and generate revenue for the shareholders. This research studies the Integrated Marketing Communication（IMC）strategy and application of business-to-business formula in the global semiconductors industry through a case study of a foreign semiconductors company. Form the perspective of planning integration in IMC, the research analysis the organization structure of the IMC team and the coordination of both internal decision-making and external functional processes. To study the human resource management of professional personals as well as to further realize the IMC budget, media buying, and database utilization, the research also studies from the in-depth perspectives of team knowledge base resource allocation. For the operational practices and results of the communication tools, the research also reviews the company’s key successful factors form the five perspectives of strategic structure, resource allocation, process management, relationship built-up, and value generation. With in-depth analyzing the brand valuation report and brand value evaluation report conducted by Interbrand to unfold the actual effectiveness of the company’s overall integrated marketing communication strategy, as a case study, the research is to sketch how this semiconductors successfully generated brand equity and brand value in just one year since its independence for the Royal Philips group. For the research methods of this research, by taking the “secondary analysis” for studying both planning integration and resource integration form the perspective of supplier side, “focus group” for studying the integration of communication tool from the perspective or demand side, and “in-depth interview” for studying the key successful factors of the case company, which is one of the world’s top 10 semiconductors companies, from the perspective of industrial professionals. The objective of this research is to study the key successful factors and experiences of foreign semiconductors companies, to reflect how to manage the IMC strategy into the company’s overall business strategy of B2B industry, and to make suggestions to the IC companies in Taiwan for brand development based on the successful experiences of the case company.

由於無線通訊相關應用持續蓬博發展，使得為關鍵零組件的射頻前端元件及模組相關產業於2006年開始獲利；以及化合物半導體於此領域的元件及模組為矽產業較難取以代，雖其製造流程相似，但其經營環境與矽產業有所不同，故值得深入探討其產業發展是否與矽產業有其不同之處。 本研究乃是針對化合物半導體產業於無訊通訊領域進行描述與分析來達成下列目的：第一、詳細地描述此產業現況及台灣廠商經營模式以提供各界參考；第二、在此產業發展已較為成熟時，檢視和分析此產業是否如矽產業採專業分工，以及找出影響產業垂直整合程度的關鍵因素為何；第三、運用產業矩陣進行產業分析，以供後續研究參考如何運用產業矩陣。 本研究採用司徒達賢教授所提出的產業矩陣分析法進行產業分析與描述，如此將能對此產業能有更系統化、周延且細緻地了解，並透過策略形態分析法深入了解各公司的策略構想為何，來協助釐清此產業較為重要的產業特性為何。 研究結果顯示，化合物半導體於無線通訊產業的IC設計與IC製造是否朝向專業分工，與IDM廠及專業晶圓廠的製程水準有關；以及在手機持續往輕薄短小、高頻率、以及3M(多頻、多模、多媒體)的方向發展下，對各價值單元的影響皆不同。

半導體及光電產業快速發展，已成為台灣賴以與國際競爭之兩大經濟產業，為維持台灣既有之製造優勢及實力，並加強設計創新能力，政府擬定「新世紀兩兆雙星產業發展計畫」，明確勾勒出我國對於半導體及平面顯示器兩大產業之發展方向。邁入二十一世紀，新興國家快速崛起，台灣產業發展面臨強大的競爭，尤其在中國大陸，各廠為維持既有的競爭優勢及提昇市場佔有率，唯有加速持續投資建廠，一則創造規模經濟以降低生產成本，另一方面更以領先技術築高競爭者之進入障礙。 近年來，國內各大廠積極建置規劃12吋晶圓廠及TFT-LCD八代廠，由於均屬於高資本之投資，擬定發包策略，故強化採購人員的談判技巧及遴選合適的承攬廠商，以最短的時間及最少的預算來完成建廠，將成為建廠業者主要的政策。 本研究乃在探究哪些關鍵因素足以影響建廠廠商之採購發包策略，再以工程承攬商的觀點提出應對，發展出本身之承攬策略。由於有關建廠發包策略之相關文獻不多，故本研究主要採實地專家訪談，訪談半導體廠及TFT-LCD廠廠務及採購主管對於建廠採購發包之看法，配合文獻所提之各要點發展問卷，透過問卷了解高階主管、廠務人員及採購人員對發包有何不同觀點，同時面對不同之發包型態與關鍵影響因素，利用層級分析法（Analytical Hierarchy Process；AHP），發展適用於不同類型採購發包決策人員之各構面及次準則指標之權重，並與其他相關研究做比較，探討差異所在及原因，綜合研究建廠廠商高階主管、廠務人員及採購人員對於新建廠務系統發包之需求，進而擬定出承攬商因應之承攬策略，以提供決策者進行執行決策之參考。 關鍵字：半導體產業、光電產業、工程承攬、發包策略、承攬策略 / As the developments in semiconductor and opto-electronic industries grow rapidly, they have become two major economic industries of Taiwan to compete globally. In order to keep Taiwan’s exiting advantages in manufacturing and its strength and also to improve its design and innovation abilities, Taiwan government has proposed “The New Century Two Trillions Double Stars Industries Development Plan” and the plan has clearly outlined the development directions for both semiconductor and flat panel display industries in Taiwan. While stepping into 21st century, the developments in Taiwan industries have faced enormous competition due to the sharp rising of emerging countries, China especially. For maintaining its competition advantages and upgrading its market shares, every enterprise only has to accelerate on making investments to the plant construction. By doing so, it aims to create economic scale to lower the product costs and it also aims to increase the entry barriers for competitors through its leading advanced technologies. In recent years, major enterprises in Taiwan have aggressively engaging in 12” fab construction and TFT-LCD 8th generation plant construction planning. Since both are the investments required high capital, the enhancement in procurement professionals’ negotiation skills and the selections of qualified contractors, the drawing up for the contracting strategies and the completion of the plant construction within shortest time with minimum budget are the major policies for the enterprises of the plant construction. This paper aims at probing into what are the key factors that will have influence on the procurement and contracting strategies made by the enterprises of the plant construction and followed by responding proposals provided from the contractors’ of the plant construction points of view and also the developments of the contracting strategies made by them. Since there are not many researches about the topic on the contracting strategies of the plant construction, the study is mainly from live interviews with experts and through interviews with facility managers and procurement mangers of semiconductor and TFT-LCD plants to understand their points of views on the procurement and contracting strategies of the plant construction. In addition, also matching up with major points in bibliographies, the questionnaire has been developed and the questionnaire survey has revealed various points of views about contracting from top management, facility professionals and procurement professionals and the key influential factors when facing different types of contracting meanwhile. By using Analytical Hierarchy Process, it has applied on every aspect and the percentages of the secondary indexes for the decision makers’ of different types of procurement and contracting and the results have also been compared with other related researches in order to figure out the differences and their causes. Combined with the study on the demand from top management, facility professionals and procurement professionals of the enterprises of the plant construction for the contracting of new plant construction systems, the contractors’ can draw up the responding contracting strategies and provide them to decision makers as the reference whiling they are making judgments. Key words: Semiconductor industries, Opto-electronic industries, Contracting work, Procurement strategies, Contracting strategies.

學界普遍認為中國半導體產業在2000年以降快速崛起主要因素是中國各級政府仿效東亞國家八十年代扶持半導體產業模式。也就是「發展型國家」(Developmental State)角色。如中國中央政府推動半導體策略性產業政策：提供優惠稅賦（「國務院十八號文件」）以及進行大規模研發計畫(「八六三計畫」)；地方政府則提供半導體廠商建廠資金和低價建廠成本。然而，實際上，從跨國比較觀點分析在中國政府半導體產業角色，發現我們可以發現中國政府在半導體產業角色與「發展型國家」的理念型有所差異。基於上述討論有兩個主要研究目的： 1.建立國家機關角色類型學，了解中國個案與既有類型異同之處。以此，提出新理論架構：第一個指標：國家機關干預型式，主要指國家是否推動「策略性產業政策」；第二個指標、企業財產權關係: 企業財產權屬於國家或私人。兩個指標和各自有兩個變異，因此形成二乘二的四個國家機關角色類型學。 2.分析形成不同國家機關角色的因素：落後的程度、官僚體系特質和政策網路等因素如何形塑國家機關角色等因素對形成國家角色有何影響。 為進行跨國比較本文選擇了四個國家以及其時空分界點：1985-1990年的美國、1976-1980年的日本、1984-1988年的台灣與2000年以降的中國，進行國家角色干預前後的時空因素比較。 本文研究發現有三：一、一國落後的程度決定了其國家角色類型：。二、國家干預前的「韋伯式官僚」程度，影響了「發展型國家」和「企業家發展型國家」的要素之一「大規模研發計畫」是否完整，但不會決定屬於個案是屬於哪一類型國家。 / Scholars argued that the rapid development of China's semiconductor industry due to strategic industry policy, known as East Asian “Developmental State Model”. China central government provided preferential domestic sale tax (Circular 18) for China-based semiconductor firms and launched national R&D project (863); local government also provides loans and low building cost for semiconductor enterprises. However, as cross-countries comparing role of state in the semiconductor industry, China’s case still is different from ideal type of Developmental State. Based on the discussion above, this dissertation has two main research purposes: 1.Establishing the typology of state: what different China's case with other nations and propose a new theoretical framework. The first indicator is whether State to promote "Strategic Industrial Policy" or not; the second corporate property relations: the second indicator is property rights of enterprises, which is government owned or private. The two indicators have two variations, so the format a typology, three types role of state in two by two matrix. 2.Analyzing the causal factors of role of state: how does extent of economic backwardness, characteristics of bureaucratic system and types policy network influence roles of state. For a cross-nations studies, I selected four variety cases and time dividing points: United States (before and after 1985-1990), Japan(before and after 1976-1980), Taiwan ( before and after 1984-1988), and China (before and fater 2000-2005) to define role of state and its causal factors. This study has three main findings: First, the extent of backwardness of a nations determined its role of state. Second, level of Weberian bureaucracy level affected complete extent of Developmental State" and Entrepreneurial Developmental State" , but would not determined its role of state.

半導體產業自 1950/1960 年代創始以來, 即以高度垂直整合的型式存在. 電路設計, 製程技術開發, 晶圓製造, CP測試, 封裝, 以及 FT測試 都是在同一公司完成. 至今日為止, 雖然仍然有不少的高度垂直整合的半導體公司存在, 許多的半導體公司已開始轉向為較低度垂直整合的型式存在. 在現代的產業術語中, 這些不同的產業單位被稱為整合元件廠 (IDM), 輕晶圓廠公司 (Fab-lite), 無晶圓廠公司(fab-less), 晶圓代工(wafer foundry), 外包封裝測試公司 (OSAT), 等等. 半導體產業自高度整合的IDM模式走向設計與製造分離的商業模式是一個許多人有興趣探討的課題. 其中一項很明顯的因素就是半導體製程開發及產能建置所需的龐大資金所造就出的專業晶圓代工模式. 但是,當專業晶圓代工模式帶入大量的經濟效益的同時, 眾多的公司在半導體產業中跨公司的交易成本亦大量增加. 在本論文中, 作者試圖以個案分析的方法, 探討半導體產業中一家專業晶圓代工公司 (A 公司) 如何使用協同電子商務來降低與客戶之間的交易成本. Coase and Williamson為主所發展出的交易成本經濟學 (Transaction Cost Economics, TCE)為本論文提供了一個良好的理論架構. 這些專精不同的半導體公司(Firms)在半導體產業中(Market)交易(Transact). 當面對不同程度的交易障礙時, 都會努力使這些障礙降低. 本論文之目標是以 Coase/William的TCE為架構, 定性分析出晶圓代工產業的協同電子商務在降低交易成本的效益. 在針對Ａ公司的個案研究中，研究結果指出, 協同電子商務在降低監督成本上是相當顯著的. 其次為搜尋成本及訂約成本的降低. 效益較不顯著的則為違約成本的降低. / The Semiconductor Industry started out in the 1950/1960 time frame, in the form of highly vertical integration. Circuit design, process technology development, wafer manufacturing, circuit probe operations, assembly manufacturing and final testing operations were all performed within a company. Although vertically integrated semiconductor companies still have strong presence in today’s industry, many others have turned much less vertically integrated. In semiconductor industry’s jargons, these various entities are: IDMs (Integrated Device Manufacturers), Fab-lite, Fabless, wafer foundries, OSATs (Out Sourced Assembly and Test), etc… This phenomenon of the semiconductor industry going from being highly integrated towards being highly disintegrated is of interest to many. One of the obvious driving forces is the emergence of the wafer foundry segment in the industry due to the heavy investment in the process technology development and the manufacturing capacity build-up. Given the need for the tight collaboration among various semiconductor industry functions, this disintegration undoubtedly imposed much inter-company collaboration barrier along the value chain. In this paper, the study focuses on how a company (“Company A”) in the wafer foundry segment uses collaborative commerce to provide an integration platform for its trading partners to reduce the barrier of conducting business with each other. Transaction Cost Economy (TCE), a term coined by Coase and Williamson, provided an excellent research framework for this case. The barrier existing in these interdependent semiconductor companies along the value change can be viewed as “firms” in the “market”, while facing the significant barrier (transaction costs), looking for ways to maximize the profits for individual firms, and hopefully for the whole value chain as well. In short, this paper analyzes the qualitative effect of the collaborative commerce in a semiconductor foundry company in reducing the inter-company transaction cost within the Coase and Williamson TCE framework. Based on the case study of company A, the results indicate that Collaborative Commerce has significant impact on monitoring cost reduction. It also helps reduce the cost of searching and contracting. On the enforcement cost reduction, Collaborative Commerce plays a relatively weaker role. Key Words: Transaction Cost, Collaborative Commerce, Semiconductor, Foundry, Integration, Dis-integration